JPH034054Y2 - - Google Patents

Info

Publication number
JPH034054Y2
JPH034054Y2 JP1983102452U JP10245283U JPH034054Y2 JP H034054 Y2 JPH034054 Y2 JP H034054Y2 JP 1983102452 U JP1983102452 U JP 1983102452U JP 10245283 U JP10245283 U JP 10245283U JP H034054 Y2 JPH034054 Y2 JP H034054Y2
Authority
JP
Japan
Prior art keywords
leadless chip
chip component
resin molded
component mounting
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983102452U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6011466U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10245283U priority Critical patent/JPS6011466U/ja
Publication of JPS6011466U publication Critical patent/JPS6011466U/ja
Application granted granted Critical
Publication of JPH034054Y2 publication Critical patent/JPH034054Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP10245283U 1983-06-30 1983-06-30 リ−ドレスチツプ部品取付装置 Granted JPS6011466U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10245283U JPS6011466U (ja) 1983-06-30 1983-06-30 リ−ドレスチツプ部品取付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10245283U JPS6011466U (ja) 1983-06-30 1983-06-30 リ−ドレスチツプ部品取付装置

Publications (2)

Publication Number Publication Date
JPS6011466U JPS6011466U (ja) 1985-01-25
JPH034054Y2 true JPH034054Y2 (instruction) 1991-02-01

Family

ID=30241477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10245283U Granted JPS6011466U (ja) 1983-06-30 1983-06-30 リ−ドレスチツプ部品取付装置

Country Status (1)

Country Link
JP (1) JPS6011466U (instruction)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6962282B2 (ja) * 2018-06-27 2021-11-05 株式会社村田製作所 積層セラミック電子部品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105277U (instruction) * 1979-01-19 1980-07-23

Also Published As

Publication number Publication date
JPS6011466U (ja) 1985-01-25

Similar Documents

Publication Publication Date Title
US7791901B2 (en) Stand-off mounting apparatus for discrete electrical components
JP2846751B2 (ja) 回路基板に対するフレキシブルケーブルの接続装置
JP3399959B2 (ja) 高密度電子装置用はんだ付け可能なコネクタ
KR19990071754A (ko) 전자 패키지용 표면장착 소켓 및 이와 함께 사용되는 컨택트
US5173574A (en) Soldering connector and method for manufacturing an electric circuit with this soldering connector
JP2000331734A (ja) 表面実装型コネクタ及び回路装置の製造方法
JPH034054Y2 (instruction)
KR0146063B1 (ko) 반도체 패키지 및 그 제조방법
JPH07221419A (ja) 混成集積回路装置
KR100201397B1 (ko) 반도체 패키지 장착용 패키지
JPH0737335Y2 (ja) Ｌｓｉ（ｉｃ）端子の接続基板
JP2750595B2 (ja) 表面実装用電子部品の接続部材
JP2535680Y2 (ja) 電子冷却素子接続装置
JPH0234786Y2 (instruction)
JPH0129980Y2 (instruction)
JPH0227576Y2 (instruction)
JPH0410618Y2 (instruction)
JP3023468B2 (ja) 電子回路モジュール
JPH0322383A (ja) 表面実装デバイス用ソケット
JPH04225600A (ja) プリント板ユニットの動作試験器接続方法
WO1998041069A3 (de) Flachbaugruppe und verfahren zum nachträglichen aufbringen von zusatzbauelementen auf eine leiterplatte
JPH1064637A (ja) 表面実装コネクタ
JPH048626Y2 (instruction)
JPH0992413A (ja) コネクタ
JPH0641065U (ja) 結線ターミナル