JPH034054Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Technical field of the invention The present invention is a leadless chip component mounting device that allows easy and reliable contact to be made when attaching and removing leadless chip components mounted on a circuit board. Regarding.

(b) Background of the Technology In recent years, circuit boards on which electronic circuits are mounted have been surface-mounted on the circuit board surface using leadless chip components due to the demand for high-density mounting.
On the other hand, in order to set the circuit constants to predetermined values, it is necessary to adjust and replace the mounted leadless chip components with ones of various values. If you repeatedly solder leadless chip parts and then re-melt the solder and then remove and replace them, not only the leadless chip parts but also the soldering pads on the circuit board may be damaged. Because of the above problems, it is desirable to be able to attach and detach the device without soldering.

(c) Problems with the Prior Art FIG. 1 is a partial perspective view illustrating a conventional method for mounting leadless chip components. In the figure, a pair of Z-shaped mounting brackets 3 are arranged symmetrically on a component mounting pad portion 2 of a circuit conductor pattern formed on a circuit board 1 and are connected and fixed by soldering or reflow soldering. Then, place the leadless chip part 4 on the top surface of the mounting bracket 3 and
Connect by soldering. When the circuit characteristics are measured and the leadless chip is replaced with another leadless chip component with different constants, the soldered part between the pad part 2 and the mounting bracket 3 is melted due to heating and comes off, and this part is repositioned and soldered. I came across a problem that I had to do something about.

(d) Purpose of the invention In view of the above-mentioned conventional problems, the object of the invention is to provide a leadless chip component mounting device that allows leadless chip components to be attached and replaced without soldering. be. Moreover, the connection state is extremely secure and highly reliable.

(e) Structure of the invention The above object is that the pair of retainers that respectively hold the connection terminals at both ends of the leadless chip component according to the invention have opposing contact parts in a direction perpendicular to the surface of the circuit board to be mounted. The base of the contact portion is embedded in the legs of a synthetic resin molded body having a concave shape when viewed from the front, and the pair of retainers are arranged at predetermined intervals in the concave synthetic resin molded body. This is achieved by a leadless chip component mounting device which is integrally integrated with the inside of the leadless chip component mounting device.

(f) Embodiments of the invention Hereinafter, the leadless chip component mounting device according to the invention will be explained in detail by way of embodiments with reference to the drawings.

FIG. 2 is an external perspective view of an embodiment of the leadless chip component mounting device of the present invention. In the figure, a pair of retainers 51, which respectively hold the connecting terminal portions (hatched portions) 41 at both ends of the leadless chip component 4, are formed from an elastic material such as a phosphor bronze plate. The holder 51 has a facing contact portion 52 formed in a direction perpendicular to the surface of the circuit board 1 to be mounted, and a base 53 of the facing contact portion 52 is a synthetic resin molded in a concave shape when viewed from the front. It is embedded in the leg portion 55 of the resin molded body 54.

Terminals 56 extending downward from the base 53 are exposed to the outside of the synthetic resin molded body 54 and are connected to the component mounting pads 2 of the circuit conductor pattern of the circuit board 1 by soldering.

With the above configuration, the pair of retainers 51 are opposed to each other inside the concave resin molded body 54 at a predetermined interval such that their opposing contact portions 52 contact and hold the connection terminal portion 41 of the leadless chip component 4. are integrated. The leadless chip component mounting device 5 is configured to solder and fix both terminals 56 to the pad portion 2 of the circuit board 1 so that each connecting terminal portion 41 is brought into contact between the opposing contact portions 52. Press in from above. Since the opposing contact portions 52 are brought into pressure contact with both side surfaces of each connection terminal portion 41 by line contact due to their spring properties, a strong and reliable connection state can be obtained. Since the base portion 53 is embedded in the synthetic resin, a uniform pressing force acts over the entire length in the height direction. Of course, parts can be attached and detached as many times as desired, but the above-mentioned effects will not change. Once the parts are finally determined, the leadless chip parts may be soldered to the holder 51, but it is also possible to solder them directly to the pad portion 2.

(g) Effect of the invention As explained above, according to the leadless chip component mounting device according to the present invention, it is easy to attach and detach the leadless chip component, and the connection terminal part of the leadless chip component can be easily attached and replaced in the height direction. Since the opposing contact portions are in line contact on both sides over the entire length of the connector, a reliable electrical connection can be achieved and the reliability of the connection can be increased, resulting in extremely significant improvements in workability and reliability.

[Brief explanation of drawings]

FIG. 1 is a partial perspective view showing a conventional leadless chip component mounting structure, and FIG. 2 is an external perspective view of the leadless chip component mounting apparatus of the present invention. In the figure, 1 is a circuit board, 2 is a pad part, 3 is a mounting bracket, 4 is a leadless chip component, 41 is a connection terminal part, 5 is a leadless chip component mounting device, 51
is a retainer, 52 is an opposing contact portion, 53 is a base, 54
indicates a synthetic resin molded body, 55 indicates a leg portion, and 56 indicates a terminal.

Claims (1)

[Scope of utility model registration request] A pair of retainers that respectively hold the connecting terminal portions at both ends of the leadless chip component are each made of an elastic member having opposing contact portions formed in a direction perpendicular to the surface of the circuit board to be mounted, and the contact portions The base of is embedded in the legs of a synthetic resin molded body having a concave shape when viewed from the front, and the pair of retainers are integrated with each other facing each other inside the concave synthetic resin molded body at a predetermined interval. Features leadless chip component mounting device.