JPS6011466U - Leadless chip parts mounting device - Google Patents

Leadless chip parts mounting device

Info

Publication number
JPS6011466U
JPS6011466U JP10245283U JP10245283U JPS6011466U JP S6011466 U JPS6011466 U JP S6011466U JP 10245283 U JP10245283 U JP 10245283U JP 10245283 U JP10245283 U JP 10245283U JP S6011466 U JPS6011466 U JP S6011466U
Authority
JP
Japan
Prior art keywords
leadless chip
chip parts
mounting device
parts mounting
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10245283U
Other languages
Japanese (ja)
Other versions
JPH034054Y2 (en
Inventor
一 墨谷
熊谷　政男
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP10245283U priority Critical patent/JPS6011466U/en
Publication of JPS6011466U publication Critical patent/JPS6011466U/en
Application granted granted Critical
Publication of JPH034054Y2 publication Critical patent/JPH034054Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来のリードレス・チップ部品の取付構造を
説明するための斜視図、第２図は、本考案に係るリード
レス・チップ部の取付構造の一実施例を説明するための
斜視図である。 図において、１は回路基板、２は電極、３は取付金具、
４はリードレス・チップ部品、５は挟持部材、５１は保
持器、５２は合成樹脂部材をそれぞれ示す。FIG. 1 is a perspective view for explaining a conventional mounting structure for a leadless chip component, and FIG. 2 is a perspective view for explaining an embodiment of the mounting structure for a leadless chip part according to the present invention. It is a diagram. In the figure, 1 is a circuit board, 2 is an electrode, 3 is a mounting bracket,
4 is a leadless chip component, 5 is a holding member, 51 is a retainer, and 52 is a synthetic resin member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板上に形成した電極間にリードレス・チップ部品
を交換して所定の性能に調整する構造を、前記リードレ
ス・チップ部品に対応する保持器を弾性体部材で形成し
、該保持器を合成樹脂で一体的に成型したことを特徴と
するリードレス・チップ部品の取付構造。A structure in which leadless chip parts are exchanged between electrodes formed on a circuit board to adjust the performance to a predetermined level is provided by forming a holder corresponding to the leadless chip part from an elastic material and holding the holder in place. A leadless chip component mounting structure characterized by being integrally molded from synthetic resin.
JP10245283U 1983-06-30 1983-06-30 Leadless chip parts mounting device Granted JPS6011466U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10245283U JPS6011466U (en) 1983-06-30 1983-06-30 Leadless chip parts mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10245283U JPS6011466U (en) 1983-06-30 1983-06-30 Leadless chip parts mounting device

Publications (2)

Publication Number Publication Date
JPS6011466U true JPS6011466U (en) 1985-01-25
JPH034054Y2 JPH034054Y2 (en) 1991-02-01

Family

ID=30241477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10245283U Granted JPS6011466U (en) 1983-06-30 1983-06-30 Leadless chip parts mounting device

Country Status (1)

Country Link
JP (1) JPS6011466U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11532436B2 (en) * 2018-06-27 2022-12-20 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component including outer electrodes connected to metal terminals

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105277U (en) * 1979-01-19 1980-07-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55105277U (en) * 1979-01-19 1980-07-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11532436B2 (en) * 2018-06-27 2022-12-20 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component including outer electrodes connected to metal terminals

Also Published As

Publication number Publication date
JPH034054Y2 (en) 1991-02-01

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