JPS59138245U - Lead frame for hybrid integrated circuit devices - Google Patents
Lead frame for hybrid integrated circuit devicesInfo
- Publication number
- JPS59138245U JPS59138245U JP3160483U JP3160483U JPS59138245U JP S59138245 U JPS59138245 U JP S59138245U JP 3160483 U JP3160483 U JP 3160483U JP 3160483 U JP3160483 U JP 3160483U JP S59138245 U JPS59138245 U JP S59138245U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- lead frame
- shaped portion
- circuit devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の、外部リード部として用いられる混成集
積回路用リードフレームの斜視図、第2図は外部リード
部を、千鳥足形状に回路基板に取り付けて形成した従来
の混成集積回路装置の斜視図、第3図は本考案の一実施
例の斜視図、第4図は前記第3図に示すリードフレーム
を回路基板に、千鳥足形状に取り付けて形成した混成集
積回路装置の斜視図である。
7・・・U字状クリップ部、3.8・・・リード部、4
゜9・・・フレーム部、15・・・回路基板。Fig. 1 is a perspective view of a conventional lead frame for a hybrid integrated circuit used as an external lead portion, and Fig. 2 is a perspective view of a conventional hybrid integrated circuit device in which the external lead portion is attached to a circuit board in a staggered shape. 3 is a perspective view of an embodiment of the present invention, and FIG. 4 is a perspective view of a hybrid integrated circuit device formed by attaching the lead frame shown in FIG. 3 to a circuit board in a staggered configuration. 7... U-shaped clip part, 3.8... Lead part, 4
゜9...Frame part, 15...Circuit board.
Claims (1)
する間隔で、フレーム部から互いに平行に突出された複
数のリード部と、前記各リード部の先端で、フレーム部
およびリード部によって決まる面からはずれて、はぼU
字状に反転した第1のU字状部、および前記第1のU字
状部の先端から、再びほぼU字状に反転したクリップ部
とを具備し、前記クリップ部に混成集積回路基板が固着
されることを特徴とする混成集積回路装置用リードフレ
ーム。A frame part, a plurality of lead parts protruding parallel to each other from the frame part at intervals corresponding to an integral multiple of the distance between the holes in the motherboard, and a tip of each lead part from a plane determined by the frame part and the lead parts. Come off, Habo U
A first U-shaped portion inverted into a U-shaped portion, and a clip portion inverted again into a substantially U-shaped portion from the tip of the first U-shaped portion, and a hybrid integrated circuit board is mounted in the clip portion. A lead frame for a hybrid integrated circuit device, characterized in that it is fixed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3160483U JPS59138245U (en) | 1983-03-07 | 1983-03-07 | Lead frame for hybrid integrated circuit devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3160483U JPS59138245U (en) | 1983-03-07 | 1983-03-07 | Lead frame for hybrid integrated circuit devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59138245U true JPS59138245U (en) | 1984-09-14 |
Family
ID=30162446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3160483U Pending JPS59138245U (en) | 1983-03-07 | 1983-03-07 | Lead frame for hybrid integrated circuit devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59138245U (en) |
-
1983
- 1983-03-07 JP JP3160483U patent/JPS59138245U/en active Pending
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