JPH0337858B2 - - Google Patents

Info

Publication number
JPH0337858B2
JPH0337858B2 JP60069015A JP6901585A JPH0337858B2 JP H0337858 B2 JPH0337858 B2 JP H0337858B2 JP 60069015 A JP60069015 A JP 60069015A JP 6901585 A JP6901585 A JP 6901585A JP H0337858 B2 JPH0337858 B2 JP H0337858B2
Authority
JP
Japan
Prior art keywords
jig
workpiece
predetermined position
predetermined
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60069015A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61229332A (ja
Inventor
Yasuo Watanabe
Masayuki Yasu
Masakatsu Takasu
Toshiaki Fukuhara
Koichi Saisu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Setsubi Engineering Co Ltd
Hitachi Ltd
Original Assignee
Hitachi Setsubi Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Setsubi Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Setsubi Engineering Co Ltd
Priority to JP60069015A priority Critical patent/JPS61229332A/ja
Publication of JPS61229332A publication Critical patent/JPS61229332A/ja
Publication of JPH0337858B2 publication Critical patent/JPH0337858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60069015A 1985-04-03 1985-04-03 半導体素子製造装置 Granted JPS61229332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60069015A JPS61229332A (ja) 1985-04-03 1985-04-03 半導体素子製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60069015A JPS61229332A (ja) 1985-04-03 1985-04-03 半導体素子製造装置

Publications (2)

Publication Number Publication Date
JPS61229332A JPS61229332A (ja) 1986-10-13
JPH0337858B2 true JPH0337858B2 (2) 1991-06-06

Family

ID=13390338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60069015A Granted JPS61229332A (ja) 1985-04-03 1985-04-03 半導体素子製造装置

Country Status (1)

Country Link
JP (1) JPS61229332A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104518A (ja) * 2010-11-05 2012-05-31 Sumitomo Heavy Ind Ltd 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法

Also Published As

Publication number Publication date
JPS61229332A (ja) 1986-10-13

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