JPH0337235Y2 - - Google Patents
Info
- Publication number
- JPH0337235Y2 JPH0337235Y2 JP1984182641U JP18264184U JPH0337235Y2 JP H0337235 Y2 JPH0337235 Y2 JP H0337235Y2 JP 1984182641 U JP1984182641 U JP 1984182641U JP 18264184 U JP18264184 U JP 18264184U JP H0337235 Y2 JPH0337235 Y2 JP H0337235Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- internal casting
- casting resin
- sealed package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 44
- 238000005266 casting Methods 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984182641U JPH0337235Y2 (US07534539-20090519-C00280.png) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984182641U JPH0337235Y2 (US07534539-20090519-C00280.png) | 1984-11-30 | 1984-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6197847U JPS6197847U (US07534539-20090519-C00280.png) | 1986-06-23 |
| JPH0337235Y2 true JPH0337235Y2 (US07534539-20090519-C00280.png) | 1991-08-07 |
Family
ID=30740176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984182641U Expired JPH0337235Y2 (US07534539-20090519-C00280.png) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337235Y2 (US07534539-20090519-C00280.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585348B2 (ja) * | 1975-02-15 | 1983-01-31 | 株式会社グロ−バル振興 | 野球場等における観覧装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585348U (ja) * | 1981-07-02 | 1983-01-13 | 日本電気株式会社 | 樹脂封止型半導体装置 |
-
1984
- 1984-11-30 JP JP1984182641U patent/JPH0337235Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585348B2 (ja) * | 1975-02-15 | 1983-01-31 | 株式会社グロ−バル振興 | 野球場等における観覧装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6197847U (US07534539-20090519-C00280.png) | 1986-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4855868A (en) | Preformed packaging arrangement for energy dissipating devices | |
| JPH02222565A (ja) | 半導体装置 | |
| JPH0337235Y2 (US07534539-20090519-C00280.png) | ||
| JPS5824464Y2 (ja) | 混成集積回路装置 | |
| JP2548625B2 (ja) | 半導体装置の製造方法 | |
| JPH043450A (ja) | 樹脂封止型半導体装置 | |
| JPS62104145A (ja) | 半導体装置 | |
| JPS60157241A (ja) | 半導体装置 | |
| JPH0548955B2 (US07534539-20090519-C00280.png) | ||
| JP2836219B2 (ja) | 樹脂封止型半導体パッケージ | |
| JPS58121652A (ja) | 混成集積回路装置 | |
| JP2593867Y2 (ja) | 複合半導体装置 | |
| JPH08130291A (ja) | 半導体装置 | |
| JPH06188335A (ja) | 樹脂封止形半導体装置 | |
| JPH0432758Y2 (US07534539-20090519-C00280.png) | ||
| JPH0526760Y2 (US07534539-20090519-C00280.png) | ||
| JPS62113433A (ja) | 樹脂封止形半導体装置の製造方法 | |
| JPH0236281Y2 (US07534539-20090519-C00280.png) | ||
| JPH0936280A (ja) | 樹脂封止用パッケージ構造 | |
| JPS60254643A (ja) | 樹脂封止型半導体装置 | |
| JPH02298051A (ja) | 半導体装置 | |
| JPH0464255A (ja) | 半導体装置 | |
| JPS6314466Y2 (US07534539-20090519-C00280.png) | ||
| JPH0237752A (ja) | 半導体装置 | |
| KR200289924Y1 (ko) | 리드프레임 |
