JPH0334651B2 - - Google Patents

Info

Publication number
JPH0334651B2
JPH0334651B2 JP58224746A JP22474683A JPH0334651B2 JP H0334651 B2 JPH0334651 B2 JP H0334651B2 JP 58224746 A JP58224746 A JP 58224746A JP 22474683 A JP22474683 A JP 22474683A JP H0334651 B2 JPH0334651 B2 JP H0334651B2
Authority
JP
Japan
Prior art keywords
semiconductor
chip
circuit board
conductive
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58224746A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60116150A (ja
Inventor
Kazuyuki Shimada
Junichi Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58224746A priority Critical patent/JPS60116150A/ja
Publication of JPS60116150A publication Critical patent/JPS60116150A/ja
Publication of JPH0334651B2 publication Critical patent/JPH0334651B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
JP58224746A 1983-11-29 1983-11-29 半導体装置 Granted JPS60116150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58224746A JPS60116150A (ja) 1983-11-29 1983-11-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58224746A JPS60116150A (ja) 1983-11-29 1983-11-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS60116150A JPS60116150A (ja) 1985-06-22
JPH0334651B2 true JPH0334651B2 (enExample) 1991-05-23

Family

ID=16818584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58224746A Granted JPS60116150A (ja) 1983-11-29 1983-11-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS60116150A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287625A (ja) * 1985-05-29 1986-12-18 Kaneko Agricult Mach Co Ltd 穀物乾燥機における穀物張込装置
JPS63181450A (ja) * 1987-01-23 1988-07-26 Matsushita Electric Ind Co Ltd 半導体素子用バンプ及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5826121B2 (ja) * 1974-04-24 1983-06-01 セイコーエプソン株式会社 透明導電膜精密パタ−ン形成法
JPS5650539A (en) * 1979-09-29 1981-05-07 Sharp Corp Semiconductor device

Also Published As

Publication number Publication date
JPS60116150A (ja) 1985-06-22

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