JPH0333074Y2 - - Google Patents
Info
- Publication number
- JPH0333074Y2 JPH0333074Y2 JP1985163691U JP16369185U JPH0333074Y2 JP H0333074 Y2 JPH0333074 Y2 JP H0333074Y2 JP 1985163691 U JP1985163691 U JP 1985163691U JP 16369185 U JP16369185 U JP 16369185U JP H0333074 Y2 JPH0333074 Y2 JP H0333074Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- chip
- substrate
- semiconductor package
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/5449—
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985163691U JPH0333074Y2 (enExample) | 1985-10-24 | 1985-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985163691U JPH0333074Y2 (enExample) | 1985-10-24 | 1985-10-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273551U JPS6273551U (enExample) | 1987-05-11 |
| JPH0333074Y2 true JPH0333074Y2 (enExample) | 1991-07-12 |
Family
ID=31092127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985163691U Expired JPH0333074Y2 (enExample) | 1985-10-24 | 1985-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0333074Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6308780B2 (ja) * | 2013-12-27 | 2018-04-11 | 三菱電機株式会社 | パワーモジュール |
-
1985
- 1985-10-24 JP JP1985163691U patent/JPH0333074Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6273551U (enExample) | 1987-05-11 |
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