JPH0332220B2 - - Google Patents
Info
- Publication number
- JPH0332220B2 JPH0332220B2 JP63270157A JP27015788A JPH0332220B2 JP H0332220 B2 JPH0332220 B2 JP H0332220B2 JP 63270157 A JP63270157 A JP 63270157A JP 27015788 A JP27015788 A JP 27015788A JP H0332220 B2 JPH0332220 B2 JP H0332220B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon wafer
- suction
- suction hand
- distance
- hand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052710 silicon Inorganic materials 0.000 claims description 94
- 239000010703 silicon Substances 0.000 claims description 94
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 93
- 238000000034 method Methods 0.000 claims description 19
- 230000003028 elevating effect Effects 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 89
- 238000013459 approach Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63270157A JPH02116142A (ja) | 1988-10-26 | 1988-10-26 | シリコンウエハーの吸着方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63270157A JPH02116142A (ja) | 1988-10-26 | 1988-10-26 | シリコンウエハーの吸着方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02116142A JPH02116142A (ja) | 1990-04-27 |
| JPH0332220B2 true JPH0332220B2 (US20100223739A1-20100909-C00005.png) | 1991-05-10 |
Family
ID=17482335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63270157A Granted JPH02116142A (ja) | 1988-10-26 | 1988-10-26 | シリコンウエハーの吸着方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116142A (US20100223739A1-20100909-C00005.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014582A (ja) * | 2009-06-30 | 2011-01-20 | Tesetsuku:Kk | 電子部品用搬送装置 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993024925A1 (en) * | 1992-05-26 | 1993-12-09 | Nihon Cememt Co., Ltd. | Ceramic substrate and its manufacture, and substrate vacuum-clamping device using ceramic vacuum-clamping board |
| JP4737392B2 (ja) * | 2005-06-06 | 2011-07-27 | 株式会社ニコン | 基板検査装置 |
| JP2009078316A (ja) * | 2007-09-25 | 2009-04-16 | Tosoh Corp | 吸着ヘッドの駆動方法 |
| JP5381865B2 (ja) * | 2010-03-30 | 2014-01-08 | 富士電機株式会社 | ウェハ搬送装置およびウェハ搬送方法 |
| JP2016154168A (ja) * | 2015-02-20 | 2016-08-25 | 株式会社ディスコ | 被加工物の受け渡し方法 |
| JP7265842B2 (ja) * | 2018-06-15 | 2023-04-27 | 株式会社北川鉄工所 | エンドエフェクタ及びワーク加工方法 |
-
1988
- 1988-10-26 JP JP63270157A patent/JPH02116142A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014582A (ja) * | 2009-06-30 | 2011-01-20 | Tesetsuku:Kk | 電子部品用搬送装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02116142A (ja) | 1990-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100640105B1 (ko) | 무인운반차, 무인운반차시스템 및 웨이퍼운반방법 | |
| US6721626B2 (en) | Wafer transfer system, wafer transfer method and automatic guided vehicle system | |
| JPH0332220B2 (US20100223739A1-20100909-C00005.png) | ||
| JP2002329769A (ja) | アライメント装置 | |
| JPH06211320A (ja) | ウエハ搬出搬入装置 | |
| KR20220094120A (ko) | 테이프 마운터 | |
| JP3814159B2 (ja) | 無人搬送車 | |
| CN111146128B (zh) | 裸片转移模块和具有该裸片转移模块的裸片接合设备 | |
| JPH10308436A (ja) | 基板搬送装置 | |
| JPH0685408B2 (ja) | ウエハ−ロ−ディング装置 | |
| JP3323730B2 (ja) | ガラス基板搬出方法 | |
| JP3607207B2 (ja) | 収納容器からの半導体ウエーハ取り出し方法と装置 | |
| JP3683345B2 (ja) | 基板搬入搬出装置 | |
| JPH10154740A (ja) | ウェハとトレーのセッティングシステムとそのためのトレーへのウェハセッティング装置 | |
| JPH0727952B2 (ja) | ウエハ搬送装置 | |
| JPH05304199A (ja) | 吸着ヘッドの位置決め機構 | |
| JPS6221644A (ja) | ウエハ搬送装置 | |
| JP2002009124A (ja) | 電子部品移載装置及び電子部品移載方法 | |
| JP3091469B2 (ja) | 半導体装置の製造方法 | |
| KR0161625B1 (ko) | 반도체 웨이퍼 로딩 및 언로딩 장치용 오리엔터 구동방법 | |
| CN118156209A (zh) | 芯片取放设备 | |
| JPH0581177B2 (US20100223739A1-20100909-C00005.png) | ||
| JP2000072249A (ja) | ウエハのノッチ揃え機構 | |
| JPH0766936B2 (ja) | 半導体ウエーハの反り測定方法およびその装置 | |
| JP2002326728A (ja) | プレート状部材取り出し方法およびその装置 |
