JPH0332214B2 - - Google Patents

Info

Publication number
JPH0332214B2
JPH0332214B2 JP61308923A JP30892386A JPH0332214B2 JP H0332214 B2 JPH0332214 B2 JP H0332214B2 JP 61308923 A JP61308923 A JP 61308923A JP 30892386 A JP30892386 A JP 30892386A JP H0332214 B2 JPH0332214 B2 JP H0332214B2
Authority
JP
Japan
Prior art keywords
wiring
protective film
insulating protective
stress
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61308923A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63164344A (ja
Inventor
Yasunobu Kodaira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP30892386A priority Critical patent/JPS63164344A/ja
Publication of JPS63164344A publication Critical patent/JPS63164344A/ja
Publication of JPH0332214B2 publication Critical patent/JPH0332214B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP30892386A 1986-12-26 1986-12-26 半導体装置 Granted JPS63164344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30892386A JPS63164344A (ja) 1986-12-26 1986-12-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30892386A JPS63164344A (ja) 1986-12-26 1986-12-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS63164344A JPS63164344A (ja) 1988-07-07
JPH0332214B2 true JPH0332214B2 (enrdf_load_stackoverflow) 1991-05-10

Family

ID=17986906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30892386A Granted JPS63164344A (ja) 1986-12-26 1986-12-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS63164344A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5314845A (en) * 1989-09-28 1994-05-24 Applied Materials, Inc. Two step process for forming void-free oxide layer over stepped surface of semiconductor wafer
JPH03133131A (ja) * 1989-10-18 1991-06-06 Mitsubishi Electric Corp 半導体装置
JP2822656B2 (ja) * 1990-10-17 1998-11-11 株式会社デンソー 半導体装置およびその製造方法
US7576003B2 (en) * 2006-11-29 2009-08-18 International Business Machines Corporation Dual liner capping layer interconnect structure and method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149752A (en) * 1981-03-11 1982-09-16 Mitsubishi Electric Corp Structure of multilayer wiring

Also Published As

Publication number Publication date
JPS63164344A (ja) 1988-07-07

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