JPH0332214B2 - - Google Patents
Info
- Publication number
- JPH0332214B2 JPH0332214B2 JP61308923A JP30892386A JPH0332214B2 JP H0332214 B2 JPH0332214 B2 JP H0332214B2 JP 61308923 A JP61308923 A JP 61308923A JP 30892386 A JP30892386 A JP 30892386A JP H0332214 B2 JPH0332214 B2 JP H0332214B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- protective film
- insulating protective
- stress
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001681 protective effect Effects 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 5
- 239000010408 film Substances 0.000 description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000005012 migration Effects 0.000 description 5
- 238000013508 migration Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Local Oxidation Of Silicon (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30892386A JPS63164344A (ja) | 1986-12-26 | 1986-12-26 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30892386A JPS63164344A (ja) | 1986-12-26 | 1986-12-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164344A JPS63164344A (ja) | 1988-07-07 |
| JPH0332214B2 true JPH0332214B2 (de) | 1991-05-10 |
Family
ID=17986906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30892386A Granted JPS63164344A (ja) | 1986-12-26 | 1986-12-26 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164344A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5314845A (en) * | 1989-09-28 | 1994-05-24 | Applied Materials, Inc. | Two step process for forming void-free oxide layer over stepped surface of semiconductor wafer |
| JPH03133131A (ja) * | 1989-10-18 | 1991-06-06 | Mitsubishi Electric Corp | 半導体装置 |
| JP2822656B2 (ja) * | 1990-10-17 | 1998-11-11 | 株式会社デンソー | 半導体装置およびその製造方法 |
| US7576003B2 (en) * | 2006-11-29 | 2009-08-18 | International Business Machines Corporation | Dual liner capping layer interconnect structure and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149752A (en) * | 1981-03-11 | 1982-09-16 | Mitsubishi Electric Corp | Structure of multilayer wiring |
-
1986
- 1986-12-26 JP JP30892386A patent/JPS63164344A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149752A (en) * | 1981-03-11 | 1982-09-16 | Mitsubishi Electric Corp | Structure of multilayer wiring |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63164344A (ja) | 1988-07-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |