JPH0331091Y2 - - Google Patents
Info
- Publication number
- JPH0331091Y2 JPH0331091Y2 JP1984058746U JP5874684U JPH0331091Y2 JP H0331091 Y2 JPH0331091 Y2 JP H0331091Y2 JP 1984058746 U JP1984058746 U JP 1984058746U JP 5874684 U JP5874684 U JP 5874684U JP H0331091 Y2 JPH0331091 Y2 JP H0331091Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- insulating substrate
- thermal expansion
- coefficient
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 26
- 239000000919 ceramic Substances 0.000 claims description 12
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 2
- 238000005336 cracking Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5874684U JPS60172367U (ja) | 1984-04-20 | 1984-04-20 | 電気部品の取付け構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5874684U JPS60172367U (ja) | 1984-04-20 | 1984-04-20 | 電気部品の取付け構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60172367U JPS60172367U (ja) | 1985-11-15 |
JPH0331091Y2 true JPH0331091Y2 (un) | 1991-07-01 |
Family
ID=30584540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5874684U Granted JPS60172367U (ja) | 1984-04-20 | 1984-04-20 | 電気部品の取付け構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60172367U (un) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52161256U (un) * | 1976-05-28 | 1977-12-07 | ||
JPS54107858U (un) * | 1978-01-17 | 1979-07-30 |
-
1984
- 1984-04-20 JP JP5874684U patent/JPS60172367U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60172367U (ja) | 1985-11-15 |
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