JPH0331085Y2 - - Google Patents
Info
- Publication number
- JPH0331085Y2 JPH0331085Y2 JP1985066476U JP6647685U JPH0331085Y2 JP H0331085 Y2 JPH0331085 Y2 JP H0331085Y2 JP 1985066476 U JP1985066476 U JP 1985066476U JP 6647685 U JP6647685 U JP 6647685U JP H0331085 Y2 JPH0331085 Y2 JP H0331085Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- clip
- conductor terminal
- type lead
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000011810 insulating material Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066476U JPH0331085Y2 (US07709020-20100504-C00041.png) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066476U JPH0331085Y2 (US07709020-20100504-C00041.png) | 1985-05-07 | 1985-05-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182045U JPS61182045U (US07709020-20100504-C00041.png) | 1986-11-13 |
| JPH0331085Y2 true JPH0331085Y2 (US07709020-20100504-C00041.png) | 1991-07-01 |
Family
ID=30599417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985066476U Expired JPH0331085Y2 (US07709020-20100504-C00041.png) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0331085Y2 (US07709020-20100504-C00041.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5618448A (en) * | 1979-07-24 | 1981-02-21 | Sony Corp | Composite electronic part |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51141356U (US07709020-20100504-C00041.png) * | 1975-05-09 | 1976-11-13 | ||
| JPS5488666U (US07709020-20100504-C00041.png) * | 1977-12-07 | 1979-06-22 | ||
| JPS629741Y2 (US07709020-20100504-C00041.png) * | 1980-12-02 | 1987-03-06 |
-
1985
- 1985-05-07 JP JP1985066476U patent/JPH0331085Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5618448A (en) * | 1979-07-24 | 1981-02-21 | Sony Corp | Composite electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61182045U (US07709020-20100504-C00041.png) | 1986-11-13 |
