JPH0329012B2 - - Google Patents

Info

Publication number
JPH0329012B2
JPH0329012B2 JP60038144A JP3814485A JPH0329012B2 JP H0329012 B2 JPH0329012 B2 JP H0329012B2 JP 60038144 A JP60038144 A JP 60038144A JP 3814485 A JP3814485 A JP 3814485A JP H0329012 B2 JPH0329012 B2 JP H0329012B2
Authority
JP
Japan
Prior art keywords
mold
molding
optical glass
glass element
aln
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60038144A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61197430A (ja
Inventor
Takao Shibazaki
Yoshiki Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP3814485A priority Critical patent/JPS61197430A/ja
Publication of JPS61197430A publication Critical patent/JPS61197430A/ja
Publication of JPH0329012B2 publication Critical patent/JPH0329012B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
    • C03B11/06—Construction of plunger or mould
    • C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
    • C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
    • C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00—Press-moulding glass
    • C03B2215/02—Press-mould materials
    • C03B2215/08—Coated press-mould dies
    • C03B2215/10—Die base materials
    • C03B2215/11—Metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00—Press-moulding glass
    • C03B2215/02—Press-mould materials
    • C03B2215/08—Coated press-mould dies
    • C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
    • C03B2215/22—Non-oxide ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP3814485A 1985-02-27 1985-02-27 光学ガラス素子成形用金型とその製造方法 Granted JPS61197430A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3814485A JPS61197430A (ja) 1985-02-27 1985-02-27 光学ガラス素子成形用金型とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3814485A JPS61197430A (ja) 1985-02-27 1985-02-27 光学ガラス素子成形用金型とその製造方法

Publications (2)

Publication Number Publication Date
JPS61197430A JPS61197430A (ja) 1986-09-01
JPH0329012B2 true JPH0329012B2 (enrdf_load_stackoverflow) 1991-04-22

Family

ID=12517222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3814485A Granted JPS61197430A (ja) 1985-02-27 1985-02-27 光学ガラス素子成形用金型とその製造方法

Country Status (1)

Country Link
JP (1) JPS61197430A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2572047B2 (ja) * 1986-10-06 1997-01-16 オリンパス光学工業株式会社 ガラスプレス装置部材
JP2711580B2 (ja) * 1990-01-12 1998-02-10 アルプス電気株式会社 成形金型の製造方法
US8887532B2 (en) 2010-08-24 2014-11-18 Corning Incorporated Glass-forming tools and methods

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2529473C3 (de) * 1975-07-02 1980-11-20 Danfoss A/S, Nordborg (Daenemark) Gleitschuhanordnung, insbesondere für Axial- und Radialkolbenmaschinen

Also Published As

Publication number Publication date
JPS61197430A (ja) 1986-09-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term