JPH0327043B2 - - Google Patents

Info

Publication number
JPH0327043B2
JPH0327043B2 JP59100658A JP10065884A JPH0327043B2 JP H0327043 B2 JPH0327043 B2 JP H0327043B2 JP 59100658 A JP59100658 A JP 59100658A JP 10065884 A JP10065884 A JP 10065884A JP H0327043 B2 JPH0327043 B2 JP H0327043B2
Authority
JP
Japan
Prior art keywords
pattern
magnification
key pattern
image
key
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59100658A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60244803A (ja
Inventor
Masanori Uga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP59100658A priority Critical patent/JPS60244803A/ja
Priority to US06/732,219 priority patent/US4757550A/en
Priority to KR1019850003480A priority patent/KR930003809B1/ko
Publication of JPS60244803A publication Critical patent/JPS60244803A/ja
Publication of JPH0327043B2 publication Critical patent/JPH0327043B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/20—Automatic control or regulation of feed movement, cutting velocity or position of tool or work before or after the tool acts upon the workpiece
    • B23Q15/22—Control or regulation of position of tool or workpiece
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20016—Hierarchical, coarse-to-fine, multiscale or multiresolution image processing; Pyramid transform
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mechanical Engineering (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP59100658A 1984-05-21 1984-05-21 自動精密位置合せシステム Granted JPS60244803A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59100658A JPS60244803A (ja) 1984-05-21 1984-05-21 自動精密位置合せシステム
US06/732,219 US4757550A (en) 1984-05-21 1985-05-09 Automatic accurate alignment system
KR1019850003480A KR930003809B1 (ko) 1984-05-21 1985-05-21 자동정밀 배열장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59100658A JPS60244803A (ja) 1984-05-21 1984-05-21 自動精密位置合せシステム

Publications (2)

Publication Number Publication Date
JPS60244803A JPS60244803A (ja) 1985-12-04
JPH0327043B2 true JPH0327043B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-04-12

Family

ID=14279904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59100658A Granted JPS60244803A (ja) 1984-05-21 1984-05-21 自動精密位置合せシステム

Country Status (3)

Country Link
US (1) US4757550A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS60244803A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR930003809B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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US4937618A (en) * 1984-10-18 1990-06-26 Canon Kabushiki Kaisha Alignment and exposure apparatus and method for manufacture of integrated circuits
US4864630A (en) * 1986-07-30 1989-09-05 Drexler Technology Corporation Method and apparatus for reading data pages on a data surface
JP2675307B2 (ja) * 1987-08-28 1997-11-12 株式会社日立製作所 プリアライナー装置
US4929893A (en) * 1987-10-06 1990-05-29 Canon Kabushiki Kaisha Wafer prober
US4866629A (en) * 1987-11-13 1989-09-12 Industrial Technology Research Institute Machine vision process and apparatus for reading a plurality of separated figures
EP0435660B1 (en) * 1989-12-29 1997-06-04 Canon Kabushiki Kaisha Method of evaluating objects based upon image processing, and inspection apparatus using said method
US5243665A (en) * 1990-03-07 1993-09-07 Fmc Corporation Component surface distortion evaluation apparatus and method
US5220614A (en) * 1991-02-22 1993-06-15 Professional Coin Grading Service, Inc. Automated coin grading system
JP3029694B2 (ja) * 1991-04-19 2000-04-04 株式会社東芝 半導体ウエハ処理装置
DE4218063C2 (de) * 1991-05-31 1995-07-20 Sumitomo Heavy Industries Bildabtastsystem für aufgedruckte Registermarken
US5495535A (en) * 1992-01-31 1996-02-27 Orbotech Ltd Method of inspecting articles
US5305099A (en) * 1992-12-02 1994-04-19 Joseph A. Morcos Web alignment monitoring system
US5500906A (en) * 1994-01-14 1996-03-19 Cognex Corporation Locating curvilinear objects using feathered fiducials
US5943089A (en) * 1996-08-23 1999-08-24 Speedline Technologies, Inc. Method and apparatus for viewing an object and for viewing a device that acts upon the object
JP3384335B2 (ja) * 1998-09-02 2003-03-10 松下電器産業株式会社 自動組立装置および自動組立方法
US6348943B1 (en) * 1998-10-30 2002-02-19 Industrial Technology Research Institute Digital non-contact blade position detection apparatus
US6847729B1 (en) 1999-04-21 2005-01-25 Fairfield Imaging Limited Microscopy
JP4542223B2 (ja) * 2000-04-14 2010-09-08 株式会社ディスコ 切削装置
US6583879B1 (en) 2002-01-11 2003-06-24 X-Rite, Incorporated Benchtop spectrophotometer with improved targeting
US6996264B2 (en) * 2002-10-18 2006-02-07 Leco Corporation Indentation hardness test system
US7054477B2 (en) * 2002-11-13 2006-05-30 Uni-Tek System, Inc. Automatic accurate alignment method for a semiconductor wafer cutting apparatus
US20040092048A1 (en) * 2002-11-13 2004-05-13 Chiu-Tien Hsu Angle control system including a display device configured with two imaging windows that simultaneously display the same image captured by a single camera
DE10253250B4 (de) * 2002-11-15 2004-09-30 Uni-Tek System Inc. Automatisches Präzisionsausrichtungsverfahren für eine Halbleiterwaferschneidevorrichtung
GB2398196B (en) * 2003-02-05 2005-06-01 Fairfield Imaging Ltd Microscope system and method
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
JP2008529304A (ja) * 2005-01-31 2008-07-31 カスケード マイクロテック インコーポレイテッド 半導体試験用の顕微鏡システム
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7538868B2 (en) * 2005-12-19 2009-05-26 Kla-Tencor Technologies Corporation Pattern recognition matching for bright field imaging of low contrast semiconductor devices
US20070278421A1 (en) * 2006-04-24 2007-12-06 Gleason K R Sample preparation technique
JP2009300230A (ja) * 2008-06-12 2009-12-24 Olympus Corp 位置合わせを行う装置、方法、およびプログラム、ならびに基準モデルを作成する装置、方法、およびプログラム
JP5324232B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
JP5602548B2 (ja) * 2010-09-01 2014-10-08 株式会社ディスコ 加工位置検出方法
CN103831665B (zh) * 2012-11-23 2016-07-06 江西昌河航空工业有限公司 一种五轴机床旋转轴定位精度检测和校正方法
JP2014203917A (ja) 2013-04-03 2014-10-27 株式会社ディスコ 板状物
JP2014211417A (ja) * 2013-04-22 2014-11-13 株式会社ニューフレアテクノロジー パターン検査装置及びパターン検査方法
JP6979312B2 (ja) * 2017-09-08 2021-12-08 株式会社ディスコ アライメントパターンの設定方法
JP7022624B2 (ja) * 2018-03-13 2022-02-18 株式会社ディスコ 位置付け方法
JP7191473B2 (ja) 2019-01-29 2022-12-19 株式会社ディスコ キーパターンの検出方法、及び装置
JP7325904B2 (ja) * 2019-07-26 2023-08-15 株式会社ディスコ 切削ユニットの位置検出方法、及び切削装置
CN119310080A (zh) * 2019-12-31 2025-01-14 深圳迈瑞生物医疗电子股份有限公司 图像分析系统和控制拍摄样本图像的方法
JP2023116910A (ja) 2022-02-10 2023-08-23 株式会社ディスコ アライメント方法
CN114973991A (zh) * 2022-04-11 2022-08-30 武汉精立电子技术有限公司 一种用于立方体三色合光棱镜与微显示屏贴合的相机对位机构、方法和系统
KR102541500B1 (ko) * 2022-11-14 2023-06-13 (주)오로스테크놀로지 상관관계 기반 오버레이 키 센터링 시스템 및 그 방법

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US3450480A (en) * 1965-04-08 1969-06-17 Optomechanisms Inc Comparison viewer
US3895854A (en) * 1973-10-18 1975-07-22 Coulter Electronics Chromatic method and apparatus for conducting microscopic examinations at a plurality of magnifications
US4019173A (en) * 1974-07-08 1977-04-19 Agency Of Industrial Science & Technology System for recognition of shape patterns
JPS5214112A (en) * 1975-07-24 1977-02-02 Nissan Motor Co Ltd Torch iginition system internal combustion engine
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector
US4244029A (en) * 1977-12-12 1981-01-06 Goodyear Aerospace Corporation Digital video correlator
JPS54157478A (en) * 1978-06-01 1979-12-12 Canon Inc Alignment method
US4310850A (en) * 1980-07-21 1982-01-12 Bethlehem Steel Corporation Solid-state video camera having a video signal processor
FR2498767A1 (fr) * 1981-01-23 1982-07-30 Cameca Micro-analyseur a sonde electronique comportant un systeme d'observation a double grandissement
JPS5974525A (ja) * 1982-10-21 1984-04-27 Toshiba Corp 自動細胞診断装置
US4672557A (en) * 1983-03-26 1987-06-09 Disco Abrasive Systems, Ltd. Automatic accurate alignment system
DE3334691C2 (de) * 1983-09-24 1985-11-28 C. Reichert Optische Werke Ag, Wien Mikroskop
US4625330A (en) * 1983-12-19 1986-11-25 Ncr Corporation Video enhancement system
US4618938A (en) * 1984-02-22 1986-10-21 Kla Instruments Corporation Method and apparatus for automatic wafer inspection

Also Published As

Publication number Publication date
KR930003809B1 (ko) 1993-05-13
US4757550A (en) 1988-07-12
JPS60244803A (ja) 1985-12-04
KR850008053A (ko) 1985-12-11

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Legal Events

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R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term