JPH0325273B2 - - Google Patents
Info
- Publication number
- JPH0325273B2 JPH0325273B2 JP58051580A JP5158083A JPH0325273B2 JP H0325273 B2 JPH0325273 B2 JP H0325273B2 JP 58051580 A JP58051580 A JP 58051580A JP 5158083 A JP5158083 A JP 5158083A JP H0325273 B2 JPH0325273 B2 JP H0325273B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- cleaning
- processing
- casing
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58051580A JPS59178189A (ja) | 1983-03-29 | 1983-03-29 | レ−ザ加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58051580A JPS59178189A (ja) | 1983-03-29 | 1983-03-29 | レ−ザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59178189A JPS59178189A (ja) | 1984-10-09 |
JPH0325273B2 true JPH0325273B2 (enrdf_load_stackoverflow) | 1991-04-05 |
Family
ID=12890875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58051580A Granted JPS59178189A (ja) | 1983-03-29 | 1983-03-29 | レ−ザ加工装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59178189A (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01104493A (ja) * | 1987-10-16 | 1989-04-21 | Mitsubishi Electric Corp | レーザ加工機 |
SG121697A1 (en) * | 2001-10-25 | 2006-05-26 | Inst Data Storage | A method of patterning a substrate |
CN103212845A (zh) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | 用于薄壁管材激光微加工的同轴水射流装置 |
CN103286446B (zh) * | 2013-05-23 | 2016-08-24 | 昆山丞麟激光科技有限公司 | 一种激光加工同步碎屑清除装置 |
JP6998178B2 (ja) * | 2017-11-07 | 2022-01-18 | 株式会社ディスコ | レーザー加工装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS608147B2 (ja) * | 1982-06-18 | 1985-03-01 | 日本電信電話株式会社 | 固体の加工方法 |
-
1983
- 1983-03-29 JP JP58051580A patent/JPS59178189A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59178189A (ja) | 1984-10-09 |
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