JPS59178189A - レ−ザ加工装置 - Google Patents

レ−ザ加工装置

Info

Publication number
JPS59178189A
JPS59178189A JP58051580A JP5158083A JPS59178189A JP S59178189 A JPS59178189 A JP S59178189A JP 58051580 A JP58051580 A JP 58051580A JP 5158083 A JP5158083 A JP 5158083A JP S59178189 A JPS59178189 A JP S59178189A
Authority
JP
Japan
Prior art keywords
working
machining
laser
processing
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58051580A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325273B2 (enrdf_load_stackoverflow
Inventor
Kiyoshi Inoue
潔 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP58051580A priority Critical patent/JPS59178189A/ja
Publication of JPS59178189A publication Critical patent/JPS59178189A/ja
Publication of JPH0325273B2 publication Critical patent/JPH0325273B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP58051580A 1983-03-29 1983-03-29 レ−ザ加工装置 Granted JPS59178189A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58051580A JPS59178189A (ja) 1983-03-29 1983-03-29 レ−ザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58051580A JPS59178189A (ja) 1983-03-29 1983-03-29 レ−ザ加工装置

Publications (2)

Publication Number Publication Date
JPS59178189A true JPS59178189A (ja) 1984-10-09
JPH0325273B2 JPH0325273B2 (enrdf_load_stackoverflow) 1991-04-05

Family

ID=12890875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58051580A Granted JPS59178189A (ja) 1983-03-29 1983-03-29 レ−ザ加工装置

Country Status (1)

Country Link
JP (1) JPS59178189A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01104493A (ja) * 1987-10-16 1989-04-21 Mitsubishi Electric Corp レーザ加工機
US6835319B2 (en) * 2001-10-25 2004-12-28 Data Storage Institute Method of patterning a substrate
CN103212845A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 用于薄壁管材激光微加工的同轴水射流装置
CN103286446A (zh) * 2013-05-23 2013-09-11 昆山丞麟激光科技有限公司 一种激光加工同步碎屑清除装置及方法
CN109746572A (zh) * 2017-11-07 2019-05-14 株式会社迪思科 激光加工装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58221690A (ja) * 1982-06-18 1983-12-23 Nippon Telegr & Teleph Corp <Ntt> 固体の加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58221690A (ja) * 1982-06-18 1983-12-23 Nippon Telegr & Teleph Corp <Ntt> 固体の加工方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01104493A (ja) * 1987-10-16 1989-04-21 Mitsubishi Electric Corp レーザ加工機
US6835319B2 (en) * 2001-10-25 2004-12-28 Data Storage Institute Method of patterning a substrate
CN103212845A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 用于薄壁管材激光微加工的同轴水射流装置
CN103286446A (zh) * 2013-05-23 2013-09-11 昆山丞麟激光科技有限公司 一种激光加工同步碎屑清除装置及方法
CN109746572A (zh) * 2017-11-07 2019-05-14 株式会社迪思科 激光加工装置
CN109746572B (zh) * 2017-11-07 2022-04-01 株式会社迪思科 激光加工装置

Also Published As

Publication number Publication date
JPH0325273B2 (enrdf_load_stackoverflow) 1991-04-05

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