JPS59178189A - Laser working device - Google Patents

Abstract

PURPOSE:To improve working efficiency by providing a working liquid feeder which feeds the working liquid provided with ultrasonic oscillating energy to a laser working device thereby accelerating the cooling in a working part and the removal of a worked layer and preventing thermal deformation. CONSTITUTION:The working liquid provided with ultrasonic oscillating energy is injected around the irradiation point of laser light or in the position backward of the direction where working progresses with respect to the irradiation point. The excess working liquid is removed around the working point by the injection of working gas and the evaporation of the working liquid by the irradiation of laser light. The working part is covered with an adequate amt. of the working liquid film and the condensed laser light is irradiated to this part, by which working is accomplished. At the same instant, the part right after the working is cooled by the working liquid provided with ultrasonic oscillating energy, by which thermal deformation is prevented and only the desired point is worked; at the same time the working debris is efficiently removed and the laser light is supplied only to the working point.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing device, and more particularly to a laser processing device that processes a processing portion by supplying a processing liquid to the processing portion.

Laser processing equipment that focuses laser light and irradiates it onto a workpiece to process it is well known, but generally the laser oscillation efficiency of the laser processing equipment is not sufficiently high, and the processing efficiency of the laser processing equipment is low. there were. Furthermore, there is a problem in that the workpiece is altered in quality by the heat of the laser beam, resulting in a decrease in processing accuracy.

For this reason, machining waste is effectively removed from the machining area to improve machining efficiency, and machining liquid is applied to the machining area to prevent deterioration of the workpiece due to heat and ensure that only the desired area is machined. Laser machining equipment has been developed that uses machining fluid for processing, but in this case, cooling and removing machining debris using machining fluid are not effective, and the challenge is to increase the cooling effect and the removal effect of machining debris. It became.

The present invention has been made based on the above-mentioned viewpoints, and an object of the present invention is to effectively eliminate machining debris to increase machining efficiency, improve the cooling effect of machining fluid, and It is an object of the present invention to provide a laser processing device that can reliably process only a desired portion of a workpiece by preventing its deterioration due to heat.

The gist of this is that a machining fluid supply device is provided to supply a machining fluid to which ultrasonic vibration energy has been applied to the machining portion of the workpiece, and the machining fluid is supplied to the machining portion of the workpiece or to the machining portion. The purpose is to configure it so that it is ejected towards the area immediately behind it.

The present invention will be described in detail below based on the drawings.

FIG. 1 is an explanatory diagram showing one embodiment of the present invention, and FIG. 2 is an explanatory diagram showing another embodiment of the present invention.

In each figure, the same reference numerals indicate components having the same or equivalent functions, and redundant explanations will be omitted in the description of each embodiment.

In FIG. 1, 1 is a laser oscillator, 2 is a reflecting mirror, 3 is a reflecting mirror fixing member, 4.7 is a casing, 5 is a focusing lens, 6 is a lens fixing member, 8 is a motor for moving the casing 7, and 9 is a A fixed plate, 10 is a mounting member for fixing the guide rod 11 to the casing 4, 11 is a guide rod, 12 is a machining fluid supply device, 13 is a machining fluid tank, 14 is a vibrator, 15 is a rotary disk,
16 is a rotating plate mounting seat, 17 is a crank gear, 18 is a motor for moving the machining fluid supply device, 19 is a binion gear, 20 is a control device, 21 is a partition nozzle, 22 is a processing gas tank, and 23 is a processing gas supply pipe. , 24 is the workpiece,
25 is a cross table, 26 is an X-axis direction moving table,
27 is a moving table in the Y-axis direction, 28 and 29 are respectively X
Axial direction moving table 26 and Y-axis direction moving table 27
This is the motor that drives the.

As the laser oscillator 1, a gas laser such as a C02 laser or a He-Ne laser, a solid laser such as a ruby laser or a YAG laser, or the like is used.

The reflector 2 is a reflector fixing member 3 fixed to the casing 4.
is attached to reflect the laser beam oscillated in the horizontal direction from the laser oscillator 1, and change the optical path of the beam in the vertical direction.

In this embodiment, a single reflecting mirror is used to change the optical path of the laser beam, but this can be done by using multiple reflecting mirrors, prisms, etc., or by combining them as necessary. The optical path of the laser beam can be changed freely.

The focusing lens 5 is fixed to the casing 7 by the lens fixing member 6.
The laser beam reflected by the reflecting mirror 2 is focused and collected at the processing point of the workpiece.

At the joint between the casing 4 and the casing 7, both are cylindrical, the outer diameter of the casing 7 is set approximately equal to the inner diameter of the casing 4, and the gauging 7 is connected to the casing 4.
It is slidably attached to the

The motor 8 is attached to the outer peripheral surface of the casing 4 so that its drive shaft 8a is parallel to the axis of the casing 4,
The drive shaft 8a is threaded and engages with a female thread of a fixing plate 9 fixed to the casing 7.

In order to keep the casing 4 and the casing 7 coaxial, a guide rod 11 is fixed parallel to the axis of the casing 4 to a fixing member 10 provided on the outer peripheral surface of the casing 4, and this is fixed to a fixing plate 9 fixed to the casing 7. ’.

Since the joint between the casing 4 and the casing 7 is configured as described above, the casing 7 moves by small distances in the Z-Z direction in the figure in accordance with the rotation of the drive shaft 8a of the motor 8.

A predetermined flow rate of machining fluid is fed into the machining fluid tank M12 from the machining fluid supply tank 13, and this machining fluid is given ultrasonic vibration energy by the vibrator 14 and is ejected from the nozzle 12a.

For the vibrator 14, a piezoelectric vibrator or a magnetostrictive vibrator is used when generating a relatively high frequency, and an electrostrictive vibrator is used when generating a relatively low frequency.

Although the vibrator 14 may be provided singly as shown in this embodiment, a plurality of vibrators 14 may be provided to apply a plurality of ultrasonic vibration energies of different frequencies to the machining fluid.

The rotating disk 15 is a member formed in an annular shape so as to surround the outer periphery of the casing 7, and is attached to a rotating plate mounting seat I6 fixed to the casing 7 so as to rotate coaxially with the axis of the gauging 7.

The crank gear 17 meshes with a pinion gear 19 attached to the shaft of the motor 18, is fixed to the rotary disk 15 coaxially with the rotary shaft, and rotates integrally therewith.

The machining fluid supply device 12 is attached to the rotary disk 15 via a suitable attachment member and rotates together with the rotary disk 15 around the optical axis of the laser beam, so that the machining fluid spouting position can be irradiated with the laser beam. It can be rotated concentrically around a point. This ejection position is determined by the motor 18 that drives the rotary disk 15.
The control device 20 controls the rotation of the laser beam by 1% so that the machining liquid is always supplied approximately coaxially with the laser beam irradiation point or to a rear portion of the irradiation point in the processing progress direction.

A funnel-shaped partition nozzle 21 is provided within the bulging portion at the tip of the casing 7, and separates a laser beam irradiation port 21a from a processing gas jetting lower a provided in a coaxial annular shape therewith.

Processing gas such as oxygen gas, inert gas, carbon dioxide gas, etc. is supplied from the processing gas supply pipe 23 to the space surrounded by the casing 7 and the partition nozzle 21 according to the type of the workpiece 24, and the gas The jet is sprayed from the jet lower a in a concentrated manner at the irradiation point of the laser beam.

The motor 8 that moves the casing 7 in the Z-2 direction in the figure, the motor 18 that rotates the machining fluid supply device 12, the X-axis direction moving table 26 of the cross table 25, and the Y
Motors 28 that drive each of the axial movement tables 27
and 29 control device 2 according to a predetermined program.
Collectively controlled by 0.

Then, when the laser beam is oscillated from the laser oscillator 1,
After the laser beam is reflected by the reflecting mirror 2 and has its optical path changed, it is focused by the lens 5 and irradiated onto the processing point of the workpiece 22.

On the other hand, machining fluid to which ultrasonic vibration energy has been applied is injected from the machining fluid supply device 12. 20, the machining fluid is controlled so that it is always supplied approximately coaxially with the laser beam irradiation point or to a rear part in the direction of machining progress, so that the machining fluid to which the ultrasonic vibration energy has been applied is irradiated with the laser beam. It is sprayed around the point or at the rear part in the processing progress direction with respect to the irradiation point.

At this time, excess machining fluid is removed near the machining point by evaporation of machining fluid by jetting machining gas and irradiating laser light, and the machining area is covered with an appropriate amount of machining fluid film, which is focused on this area. Processing is performed by irradiating laser light.

At the same time, the part immediately after being machined is cooled by the machining fluid to which ultrasonic vibration energy has been applied, preventing deformation due to heat and ensuring that only the desired part is machined. Furthermore, machining debris is effectively removed and laser beam energy is supplied only to the machining point, increasing machining efficiency.

A machining fluid that has been given ultrasonic vibration energy has a high cooling effect, and can achieve a cooling effect that is more than twice that of a normal machining fluid. In particular, when applying two or more types of ultrasonic vibration energy with different frequencies to the machining fluid,
The cooling effect can be more than three times that of normal processing.

In addition, the machining fluid to which ultrasonic vibration energy has been applied removes the machining chips by physical peeling force due to cavitation in addition to the boiling phenomenon caused by the laser light.Especially when performing tertiary redundant machining, It is effective in eliminating machining chips that have been taken into blind holes or small areas, and it is also possible to eliminate machining knobs in a shorter time than when supplying normal machining fluid.

Furthermore, when a surfactant or the like is mixed into the machining fluid to form a foam, a cleaning action is added due to the emulsification effect, making it possible to remove machining chips more effectively. At this time, the machining part was irradiated with laser light to break bubbles in the machining fluid, remove excess machining fluid, and be covered with an appropriate amount of machining fluid film, and at the same time, ultrasonic vibration energy was applied to the part immediately after machining. Cooled by machining fluid.

According to an experiment using an embodiment of the present invention, a laser oscillator with an output of 100 W was used, and the machining fluid was heated at 500 K.
When applying ultrasonic vibration energy of Hz, 20W, the roughness of the machined surface is 5μRmax ~ machining speed 0.08g
/min.

FIG. 2 is an explanatory diagram that does not show another embodiment of the present invention.

In FIG. 2, 30 is a partition wall nozzle, and 31 is a machining liquid supply pipe.

The funnel-shaped partition nozzle 30 separates a spout for the machining gas sent from the machining gas supply pipe 23 and a spout for the machining fluid sent from the machining fluid supply pipe 31 .

After the laser beam oscillated by the laser oscillator 1 is reflected by the reflecting mirror 2 to change its optical path, it is focused by the lens 5 and irradiated onto the processing point of the workpiece 24.

On the other hand, the machining fluid supplied from the machining fluid supply device 12 is sent into the space surrounded by the partition nozzle 3o and the casing 7 by the machining fluid supply pipe 31, but at this time,
Excess machining fluid is removed from the machining point that is irradiated with the laser beam by the injection of machining gas, so the vicinity of the machining point is covered with an appropriate amount of machining fluid film, and the laser beam is irradiated on that area to complete the machining process. It will be done.

Since the present invention is configured as described above, when according to the present invention, ultrasonic vibration energy is applied to the machining liquid sprayed to the machining part or the part immediately after machining, so that machining debris is effectively removed from the machining part. It is possible to provide a laser processing apparatus that can reliably process only a desired location by increasing the processing efficiency by eliminating heat, and by increasing the cooling effect of the processing fluid to prevent deterioration of the workpiece due to heat.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram showing one embodiment of the present invention, and FIG. 2 is an explanatory diagram showing another embodiment of the present invention. 1-・----111------------------------ Laser oscillator 2-----
Reflector 4.7---------Casing 5--------------- One focusing lens 12--- −−−−−−−−−−−−−−−−
1. Processing liquid supply device 20
-,---Control device 21.30---------
−〜−−Bulkhead nosle 23−・−−−−−−−−−−−
----------- Processing gas supply pipe 25------
−−−−−−−−−−Cross table patent applicant Inoue Japax Co., Ltd. Agent (7524-) Shotabe Mogami

Claims (3)

[Claims] (1) In a laser processing device that focuses laser light emitted from a laser oscillator using a focusing lens and irradiates the workpiece with the laser beam for processing, the workpiece is processed by the laser light or immediately after processing. The above-mentioned laser processing apparatus is characterized in that a processing liquid supply device is provided for supplying processing liquid to which ultrasonic vibration energy has been applied. (2) The laser processing apparatus according to claim 1, wherein the processing liquid is a foaming liquid. (3) The laser processing apparatus according to claim 1 or 2, wherein the ultrasonic waves applied to the machining fluid are a plurality of ultrasonic waves having different frequencies.