JPS6037285A - Laser working device - Google Patents

Abstract

PURPOSE:To reduce working time by providing a work in the direction where laser light is oscillated and outputted from a laser oscillator so as to face said oscillator and selecting a suitable focusing lens in accordance with working conditions and the material of the work. CONSTITUTION:A work 12 is provided in the direction where laser light is oscillated and outputted from a laser oscillator 1 so as to face said oscillator. A control device 19 feeds a signal to a motor 6 in compliance with the program predetermined according to the material, working shape, etc. of the work 12. The motor 6 moves a member 4 for fixing a focusing lens to select the lens for focusing the laser light from the oscillator 1 among the focusing lenses 3a, 3b, 3c attached to the member 4. Laser working is executed in the above-mentioned way.

Description

[Detailed description of the invention] The present invention relates to a laser processing device.

2. Description of the Related Art Laser processing apparatuses that focus laser light using a focusing lens and perform processing while irradiating a workpiece with the laser light are well known and widely used.

Conventional laser processing equipment changes the optical path of a laser beam oscillated from a laser oscillator using a plurality of reflecting mirrors, and then focuses the laser beam with a focusing lens and irradiates it onto the processing part of the workpiece. It was configured to perform processing.

However, in the above-mentioned laser processing equipment, if the laser oscillator is used at high output, the reflecting mirror will be damaged by the laser beam, so the output of the laser oscillator cannot be made very high, especially when used for a long time. When processing is performed, the reflecting mirror has to be replaced each time the processing is performed. In addition, since the optical path is changed using multiple reflecting mirrors, the position of the laser beam irradiation changes due to slight vibrations, etc. Especially when performing precision processing on the workpiece, the laser beam irradiation position changes. There was a problem in that measures had to be taken to prevent vibrations from affecting the entire processing equipment.

The present invention has been developed from the viewpoint of ridges, and its purpose is to process a workpiece in a short time by operating a laser oscillator at high output for a long period of time. It is an object of the present invention to provide a laser processing apparatus which is not affected by vibrations and the like and which can perform precision processing in a short period of time.

The above object is to provide a laser processing apparatus in which a laser beam outputted from a laser oscillator is focused by a focusing lens and a workpiece is processed while being irradiated with the laser beam. This is achieved by arranging the objects to be processed facing each other in the optical oscillation output direction and by providing a focusing lens selection device that selects a focusing lens suitable for processing depending on the processing conditions, the material of the objects to be processed, and the like.

That is, without changing the optical path of the laser beam output from the laser oscillator using a reflecting mirror or the like, the laser beam is directly focused by a focusing lens and irradiated onto the workpiece. Moreover, since the above-mentioned focusing lens is selected and used each time, it is suitable for the material of the workpiece and the shape to be processed, etc., so laser processing can be performed efficiently in a short time and without being affected by vibrations, etc. This is possible.

Furthermore, by rotating a large number of lenses of the same type, it is possible to prevent the lenses from becoming hot.

Hereinafter, the details of the present invention will be specifically explained with reference to the drawings.

FIG. 1 is an explanatory diagram showing one embodiment of a laser processing apparatus according to the present invention, FIG. 2 is an explanatory diagram showing another embodiment, and FIG.
The figures are a sectional view taken along the line AA in FIG. 2, FIG. 4 is an explanatory diagram showing still another embodiment, and FIG. 5 is an explanatory diagram showing still another embodiment.

First, the explanation will be given with reference to FIG.

In FIG. 1, 1 is a laser oscillator, 2 is a housing, 28 is a hole formed in the housing 2, 3a13b and 3c
4 is a focusing lens, and 4 is the above-mentioned focusing lens 3a, 3b, and 3.
5 is a rack attached to one wheel of the focusing lens fixing member 4 in its longitudinal direction; 6 is a motor attached to the outer peripheral wall of the housing 2; 7 is a shaft of the motor 6; 8 and 9 are processing gas supply pipes, and 10 and 11 are processing gases for supplying processing gas such as halogen gas through the processing gas supply pipes 8 and 9. 12 is a workpiece, 13 and 1
4 is a cross slide table for moving the workpiece 12 in the X-axis direction and the Y-axis direction, 15 is a turntable provided on the cross slide table 13 for giving rotational motion to the workpiece 12, and 16 .17
and】8 are cross slide tables 13 and 1, respectively.
4. The motor 19 that drives the turntable 15 selects the output of the laser oscillator 1 and the focusing lenses 3as 3b and 3c that are most suitable for the processing according to a predetermined program, and also controls the size of the beam spot of the laser beam and the processing The amount of processing gas supplied from the gas supply bags W10 and W11, the motor 16 that moves the cross slide tables 13 and 14, and the turntable 15, respectively.
This is a control device that includes a numerical 1ii control device that collectively controls 17, 18, etc.

The laser oscillator 1 is housed in a housing 2 so as to face the workpiece 12 in the laser beam oscillation output direction, and the laser beam oscillated from the laser oscillator 1 is reflected by a reflecting mirror or the like. The output light from the oscillator 1 is directly focused by a focusing lens 3a, 3b, or 3c without changing the optical path, and is irradiated onto the processing portion of the workpiece 12.

For the laser oscillator 1, a gas laser such as a C02 laser or a ll5-Ne laser, a solid laser such as a ruby laser, a YA laser, or a G laser is used, and if necessary, the output can be further increased by a Q-switch method or the like. It is configured so that it can be done. The output and focus of the laser oscillator 1 are appropriately controlled by a control device 19, and the laser light output of the laser oscillator 1 can be made continuous, strong or weak, or pulsed.゛The focusing lens fixing member 4 is inserted through the hole 2a of the housing 2 across the housing 2 and is slidably housed therein. The upper 11 lens fixing member 4 has a plurality of focusing lenses 3a
, 3b and 3c are fixed, and a rack 5 is provided at one end thereof.

The rack 5 has a pinion gear 7 attached to the shaft of a motor 6 fixed to the outer peripheral wall of the housing 2.
As the motor 6 rotates, the focusing lens fixing member 4 moves in the left and right directions in the figure, thereby switching between the focusing lenses 3a, 3b, and 3c.

When laser machining is performed by the laser machining apparatus according to the present invention, the control device w19 is predetermined according to the material and machining shape of the workpiece 12, and the progera l
, a signal is sent to the motor 6 to move the focusing lens fixing member 4, and the focusing lens 38.3b attached to the focusing lens fixing member 4 and the focusing lens for focusing the laser beam from the laser oscillator 1 are sent to the motor 6 to move the focusing lens fixing member 4. Machining is performed after a predetermined programmed one is selected and set from among 3c.

That is, when precision cutting is performed, it is necessary to sufficiently focus the laser beam emitted from the laser oscillator 1, so a focusing lens with a high focusing rate is selected, and in the case of welding work, etc., the focusing lens with a high focusing rate is selected. A focusing lens with a low .

Furthermore, for any type of processing, by preparing a large number of lenses of the same type and using them in rotation, it is possible to prevent the lenses from becoming hot due to absorption of laser light.・Thus, the laser beam oscillated from the laser oscillator 1 facing the workpiece 12 is directed to the part of the workpiece 12 to be processed by the focusing lens 3b selected by the control device 19. The fastest beam spot is irradiated, and processing gas such as halogen gas is supplied to the above portion from processing gas supply devices 10 and 11 via processing gas supply pipes 8 and 9 to perform processing. Ru. In addition,
The processing gas is not limited to halogen gas, and various fluorocarbon gases, water vapor, oxygen gas, etc., or mixed gases made by appropriately mixing these gases may be used depending on the material and processing shape of the workpiece 12. .

To feed the workpiece 12, the numerical control device in the control device 19 sends signals to the motors 16, 17, and 18 that move the cross slide tables 13 and 14 and the turntable 15, respectively, according to a predetermined program. Since the machining is performed while the machining feed rate is controlled, the workpiece 12 is machined with extremely high precision in a short time.

As mentioned above, in the laser processing apparatus according to the present invention,
The optical path of the laser beam emitted from the laser generator 1 is changed by a reflector, etc., and the workpiece 12 is directly irradiated through the focusing lens 3a, 3b or 3c for processing. Even if some vibration is applied, the position of the beam spot will not change.

Next, FIGS. 2, 3, and 4 will be explained.

In FIGS. 2, 3, and 4, the same numbers as in FIG. 1 indicate the same components, and 20 is a fluid supply device for processing fluid, 20a is a nozzle of the fluid supply device 20, 21 is a rotary disk, 22 is a rotary disk mounting seat, 23 is a crank gear, 24 is a motor, and 25 is attached to the shaft of the motor 24, and the crank gear 2
It is a pinion gear that meshes with 3.

In the apparatus shown in FIG. 2, the focusing lens fixing member 4 is formed into a disk shape, the shaft of the motor 6 is fixed at the center thereof, and the focusing lens fixing member 4 is provided with different focusing ratios. It is equipped with four focusing lenses 3a, 3b, 3c and 3d. Therefore, in this apparatus, W* can be achieved by changing the focusing rate over a wider range, so that it can be applied to even more various types of processing.

The apparatus shown in FIG. 4 is the apparatus shown in FIG. 2 with a fluid supply device 20 such as a machining liquid added thereto. It is sufficiently focused and supplied to the part to be processed of the workpiece 1z, and processing gas such as halogen gas is supplied to the part from processing gas supply devices lo and 11 via processing gas supply pipes 8 and 9. A gas is supplied, and the fluid supply device 20 supplies a machining liquid suitable for the material of the workpiece 12, machining conditions, etc., such as IIcL, diluted H2so4,
KOJ1 aqueous solution, 11F aqueous solution, acidic or alkaline machining liquid such as hydrocarbon, or non-cleaning liquid or gas as a thin jet stream or mist droplets from the nozzle 20a at the tip of the high-pressure injection liquid supply device 20, or as an inert gas. Since the processing is carried out by supplying a predetermined limited amount as a spray using an appropriate gas, the workpiece 12 can be processed with higher precision in a shorter time.

Next, FIG. 5 will be explained.

In FIG. 5, the same numbers as in FIGS. 1, 2, and 3 indicate the same components, 26 is a laser oscillator, 27 is a housing, 28a, 28b, 28c, and 28d. (However, 28b and 28d are omitted in the figure.) 29 is a focusing lens, 29 is a focusing lens fixing member for fixing the focusing lens, 30 is a motor, 31 and 32 are processing gas supply pipes, and 33 and 34 are halogen A processing gas supply device for supplying processing gas such as gas; 35 and 36 are cross slide tables; 37 is a base on which the cross slide tables 35 and 36 are mounted; 38 and 39 are cross slide tables 35 and 36; 40 is a motor that moves the laser oscillators 1 and 26 in accordance with a predetermined program, a motor 30 that drives the focusing lens fixing member, processing gas supply devices 10, 11, 33 and 34, This is a control device including a numerical control device that collectively controls motors 38 and 39 that drive cross slide tables 35 and 36.

In this embodiment, the laser oscillators 1 and 26 are provided facing each other, and the workpiece 12 is attached between them for processing, and the cross to which the workpiece 12 is attached is used. A base 3 to which the slide tables 35, 36 and the cross slide tables 35 and 36 are attached.
The central part of 7 is cut through and formed into a frame shape, and when processing is performed while irradiating the workpiece 12 with laser light emitted from both laser oscillators 1 and 26 while sandwiching the workpiece 12 and facing each other. , is configured so as not to interfere with the irradiation of the laser beam.

When laser processing is performed, the control device 40 is controlled in accordance with a predetermined program according to the material and processing shape of the workpiece 12, as in the apparatuses shown in FIGS. 1, 2, and 4. Then, a signal is sent to the motors 6 and 30 to move the focusing lens fixing members 4 and 29 (and attach the focusing lenses for focusing the laser beams from the laser oscillators 1 and 26 to the focusing lens fixing members 4 and 29. focused focusing lenses 3a, 3
b, 3c, 3d and 28a, 28b, 28c
, 28d, after a predetermined programmed one is selected, processing is performed.

Thus, by the selected focusing lenses 3a and 28a,
The laser oscillators 1 and 26 are irradiated with sufficient focus to the part to be machined of the workpiece 12, and the numerical control device controls the oscillation frequencies of the laser oscillators 1 and 26 according to a predetermined program. , IL33 and 34,
Since signals are sent and controlled to the motors 38 and 39 that move the cross slide tables 35 and 36, respectively, the workpiece 12 can be machined with high precision in a short time.

In particular, in this embodiment, since the laser oscillators 1 and 26 are provided facing each other, when the laser beam from one of the laser oscillators 1 is supplied to the part of the workpiece 12 to be processed, From the other laser oscillator 26, the workpiece 12 is
From &1iii, 14 rays are emitted at a position corresponding to the irradiation point irradiated by the laser oscillator 1 or at a position slightly preceding the irradiation point in the direction of machining progress. It is possible to perform high quality processing.

Since the present invention is constructed like a ridge, when the laser processing apparatus according to the present invention is used, the optical path of the laser beam oscillated from the laser oscillator is not changed by a reflecting mirror or the like, so the laser oscillator can be operated at high output. It can be operated for a long time, and the position of the laser beam spot does not become distorted due to vibrations, so the workpiece can be processed with high precision in a short time.

Note that the present invention is not limited to the embodiment on ridges. For example, in this embodiment, the focusing lens fixing member is driven by a motor. After using the lens or during a predetermined processing interruption period during use, the focusing lens may be cooled by cooling gas or liquid. One or both of the distances between them may be configured to be relatively changeable and adjustable in order to adjust the focusing degree of the laser beam and the focusing position.Also, the number of focusing lenses attached to the focusing lens fixing member may be adjusted. The installation method, the method of supplying machining fluid by the machining fluid supply device, the method of supplying machining gas from the machining gas supply device, etc. can be freely changed within the scope of the purpose of the present invention. Therefore, the present invention encompasses all of them.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing one embodiment of a laser processing apparatus according to the present invention, FIG. 2 is an explanatory diagram showing another embodiment, and FIG.
The figures are a sectional view taken along the line AA in FIG. 2, FIG. 4 is an explanatory diagram showing still another embodiment, and FIG. 5 is an explanatory diagram showing still another embodiment. 1.26−・−1−−−−−−−−−−−−−−−−−
-11--Laser oscillation 2■2.27--------
---------Housing 2a, 2Ta----
-----------～------One hole 3a, 3b, 3r
,, 3d 28a, 28b, 28c, 28d -1 Focusing lens 4.29--1...--1--
------- Lens fixing member 8.9.31.32
-----------...-11----Processing gas supply pipe 10
．． 11.33.34--m-----・----- Processing gas supply device 12--------------
---------・--1----Workpiece 13.14.3
5.36-------------Cross slide table 13-------------------
-----------Turntable 6.16.17.
18 30, 38.3!1------・------11---
- Motor 19.4 (1--
1-----...---1----11-----Fluid supply device 20 a------------------1----- ---Nozzle 21-・----1・・---
1・〜−−−−−−−−−−−−−−・・−Rotary plate 22
−・−・−−1−−−−−−−−・−m−−−−−・−
---111 Turntable mounting seat 23---------・-・-・
−1−−−−−−−−−−・−・−−−−−Crank gear 24−1−−−−−−−−−−−−−−−−−−−−
−・−−−１１−−Binion gear 37− ・−−m−・
−・−１−−−−−−−−−−−−−−−・・−Base patent applicant Inoue Japax Institute Co., Ltd. Agent (
7524) Mogami Seitabu

Claims (1)

[Scope of Claims] In a laser processing device that focuses a laser beam output from a laser oscillator using a focusing lens and processes a workpiece while irradiating the laser beam with the laser beam, the laser beam oscillation output of the laser oscillator includes: The object to be processed is provided facing each other in the direction, and a focusing lens selection device is provided for selecting a focusing lens suitable for processing according to the processing conditions, the material of the object to be processed, etc. laser processing equipment.