JPS59166390A - Hydrogen atom working device - Google Patents

Abstract

PURPOSE:To provide a titled device which improves working efficiency and speed and enables fine working by the constitution in which laser light is focused and irradiated to the surface of a body to be worked by a focusing lens while a cooling liquid is supplied thereto and gaseous hydrogen is supplied and interposed. CONSTITUTION:The laser light emitted from a laser oscillator 1 is focused to the working part of a body 20 to be worked by a reflecting mirror 2 and a focusing lens 5, and gaseous hydrogen to be introduced through a gaseous hydrogen supplying pipe 10 into a casting 7 is ejected through a hole 7a to the working part. The body 20 is efficiently worked by the energy released in the stage of ionizing the gas by the laser light and recombining the same. The body 20 is disposed via a turntable 16 and cross slide tables 14, 15 into a cooling liquid tank 12 controlled by a numerical control device 21. A cooling liquid 13 such as water is run at a specified speed at which the liquid disturbance does not arise to cool the surface of the body 20. Only the very small part or desired point of the body 20 is thus surely worked.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hydrogen atom processing apparatus that processes using a combination of laser light and hydrogen gas.

2. Description of the Related Art Laser processing apparatuses that perform processing while focusing laser light on a workpiece by focusing it on a focusing lens are well known and widely used. In addition, as another device, a laser processing device that uses a laser, an oscillator, a plasma generator, etc. in combination to perform processing with improved processing efficiency has been developed and is being used.

However, although the processing efficiency and processing speed of each of the above-mentioned laser processing apparatuses has been significantly improved compared to conventional general laser processing apparatuses, the processing efficiency and processing speed are still low.

In order to solve this problem, a hydrogen atom processing device was developed that ionizes hydrogen molecules in hydrogen gas with a laser beam and processes the hydrogen molecules using the energy generated when the ionized hydrogen molecules recombine. This hydrogen atom processing apparatus has much higher processing efficiency and processing speed than the apparatus that uses a combination of laser light and arc discharge, or the above-mentioned laser light and plasma.

However, this hydrogen atom processing device that uses a combination of laser light and hydrogen gas has high processing efficiency and processing speed, but cannot reliably process only a minute part of the workpiece or a desired location on the workpiece. The problem was that it was difficult to do so.

The present invention has been made based on the above-mentioned viewpoints, and its purpose is to further improve the processing efficiency and processing speed of a hydrogen atom processing device that performs processing using a combination of laser light and hydrogen gas. In addition, it is an object of the present invention to provide a hydrogen atom processing apparatus that can reliably process only a minute portion of a workpiece or a desired location of the heavily processed workpiece.

The gist of this is that the Q from the laser oscillator
7. In the elementary atom processing apparatus, the IM laser beam is focused by a focusing lens and irradiated onto the workpiece, and hydrogen gas is supplied to the surface of the workpiece for processing.
The object of the present invention is to provide a device for supplying a cooling liquid to the surface of the workpiece.

Hereinafter, the details of the present invention will be specifically explained with reference to the drawings.

The drawing is an explanatory diagram showing an embodiment of the hydrogen atom processing apparatus according to the present invention.

In Figure 1, 1 is a laser oscillator, 2 is a laser beam reflecting mirror,
3 is a reflecting mirror fixing member for fixing the reflecting mirror 2, 4 is a casing for the reflecting diaphragm 2 and the reflecting mirror fixing member 3, 5 is a focusing lens, 6 is a focusing lens fixing member for fixing the focusing lens 5, and 7 is a focusing lens. A casing for the lens 5 and the lens fixing member 6, 1a is a hole formed in the casing 7, 8 is a motor, 8a is a shaft of the motor 8, 9 is a fixing plate whose one end is fixed to the casing 7, 10 is a hydrogen gas supply pipe, 11 is a coolant supply vibe, 12 is a coolant tank,
13 is a coolant; 14 and 15 are cross-slide tables that move the coolant tank 12 in the X-axis and Y-axis directions, respectively; 16 is a turn provided on the cross-slide table 14 to give rotational motion to the coolant [12]; table,
17.18 and 19 are motors that drive the cross slide table 14.15 and turntable 16, respectively;
20 is a workpiece; 21 is a numerical control device that collectively controls the motor 8, motors 17, 18 and 19 of the cross slide table 14, 15, and turntable 16 according to a predetermined program; 22 is a filter; 23
is a pump, and 24 is a cooling liquid supply tank.

Therefore, the laser oscillator 1 is equipped with a CO□ laser or a He-N laser.
It is configured to use a gas laser such as an e-laser, a solid laser such as a ruby laser or a YAG laser, and to further increase the output by a Q-switch method or the like if necessary.

The reflecting mirror 2 is attached to a reflecting mirror fixing member 3, and reflects the laser light emitted from the laser oscillator 1 to change its optical path. 2. The reflecting mirror fixing member 3 is fixed to the casing 4 and is configured to be constantly cooled by cooling water supplied from a cooling water supply device (not shown).

Furthermore, the positions of the reflecting mirror 2, the reflecting mirror fixing member 3, and the casing 4 are fixed with respect to the laser oscillator 1.

The focusing lens 5 is fixed to the inner wall of the casing 7 by a focusing lens fixing member 6, and focuses the laser beam reflected by the reflecting mirror 2 onto the processing portion of the workpiece 20.

At the joint between the casing 7 and the casing 4, the outer diameter of the casing 7 is set to be approximately equal to the inner diameter of the casing 4, and the casing 7 is slidably attached to the casing 4. Further, a motor 8 is attached to one end of the outer peripheral wall surface of the casing 4, and its shaft 8a is threaded and meshes with a female thread of a fixing plate 9 fixed to the casing 7. Therefore, the casing 7 is attached to the motor 8.
It is possible to move in the Z-Z direction in the figure according to the rotation of .

The hydrogen gas supply pipe 10 is connected near the part of the casing 7 that faces the workpiece 20, from which hydrogen gas for processing is supplied to the space inside the casing 7, and
It is sprayed toward the processing portion of the workpiece 20 from the hole 7a formed at the tip.

The motor 8 that moves the casing 7 in the Z-Z direction and the motors 17, 18 and 19 that drive the cross slide table 14, 15 and turntable 16, respectively, are collectively controlled by the numerical controller 21 according to a predetermined brodalum. is configured to be

When processing is performed by the hydrogen atom processing apparatus according to the present invention, the coolant 13 is supplied to the coolant supply tank 2.
4, the coolant 13 is slowly fed into the coolant tank 12 by the pump 23 via the filter 22 and the coolant supply pipe 11, preferably without causing any liquid disturbance. The cooling liquid flows quietly in the cooling liquid tank 12 and sufficiently cools the entire surface of the workpiece 20 housed in the cooling liquid tank 12.

Thereafter, a laser beam is emitted from the laser oscillator 1, and the emitted laser beam is sufficiently focused by the focusing lens 5 and irradiated onto the part of the workpiece 20 to be processed. At the same time, the hydrogen gas supply pipe 10 is passed through the casing 7 to the hole 7 of the casing 7 to the processing part of the workpiece 20.
Hydrogen gas is supplied from a, and the processed part is heated due to the hydrogen gas ingestion and the high temperature of the part of the workpiece at the laser beam irradiation point.
The circular portion with a small radius becomes an exposed surface portion of the workpiece 20 from which the cooling liquid 13 has been removed, and processing is performed in this exposed portion. Since the circular exposed portion is cooled by the cooling liquid 13 from the surrounding area, excessive machining of the surrounding area is prevented.

The molecules of the hydrogen gas supplied from the hole 7a of the gauging 7 are heated by the focused laser beam, whereby the molecules of the hydrogen gas are ionized. However, since this ionized state is unstable, the molecules of this ionized hydrogen gas instantly try to return to their original molecular state and recombine. Since high energy is released when the gases are recombined, the portion of the workpiece 20 to be processed can be processed using the heat of this released energy.

In the hydrogen atom processing apparatus according to the present invention, the workpiece 20' is housed in the cooling liquid tank 12 and is sufficiently cooled by the cooling liquid 13, so that the workpiece 20' is irradiated with the laser beam. The hydrogen gas in only the part is heated, and the thermal energy at the time of recombination is supplied to the processing part of the workpiece 20, so that only the desired part of the workpiece 20 can be processed reliably in a short time. It can be done.

In particular, using a C02 laser of 200 degrees, 1Qcc/
When processing is performed by supplying min. of hydrogen gas,
The machined surface roughness of the workpiece surface could be set to 1oμRmax% and the processing speed to 0.23 g/min. In addition,
When machining was performed using conventional laser machining equipment, the roughness of the surface of the workpiece was 12 μRma, and the machining speed was 0.06 g/min.

Since the present invention is configured as described above, when using the hydrogen atom processing apparatus according to the present invention, only the part of the workpiece to be processed or the desired part of the workpiece can be processed reliably and in a short time. It is possible.

-It should be noted that the present invention is not limited to the embodiments described above. That is, for example, in this embodiment, hydrogen gas is blown out from the hole in the casing, but a hydrogen gas supply device may be attached to the side wall surface of the casing. Other aspects such as the method of focusing the laser beam, the method of supplying the cooling liquid, and the method of controlling each part can be freely changed within the scope of the purpose of the present invention, and the present invention encompasses all of them. .

[Brief explanation of the drawing]

The drawings are explanatory diagrams showing one embodiment of a hydrogen atom processing apparatus according to the present invention. 1−=−−−−−−−−−−−−−−−−・−Laser oscillator 2−−−−−−−−−・−−11−−−−−−Laser light reflecting mirror 3− −−−−−−−−−−−−−−−−−−
1.Reflector fixing member 4~----------・---------
--------Casing 5 of the reflecting mirror 2 and the reflecting mirror fixing member 3-----------One focusing lens 6-------- −−−−−−−−−・Focusing lens fixing member 7−−−−−−−−−−−−−−−1−
--- Casing 8 of lens 5 and lens fixing member 6 -----------------11-Motor 8
a -------------------Shaft 9---------------, ----- One fixed plate i o ----- -------------------Hydrogen gas supply pipe i 1--------------- Cooling liquid supply vibe 12----- −−−−〜−−−
Cooling liquid tank i 3-----1--Cooling liquid 14.15--------Cross slurry/f tochie
Pull IG--------Turntable 20-----1~=---------------Workpiece 21-----1 Numerical controller 22-----1 11------- Filter 23-
-------・--1-----Pump 24--
------1 Coolant Supply Tank Special d'F Applicant Inoue Japax Research Institute Agent (7524) Shotabe Mogami

Claims (1)

[Claims] 1) Hydrogen atom processing in which a laser beam oscillated from a laser oscillator is focused by a focusing lens and irradiated onto a workpiece, and hydrogen gas is supplied to the surface of the workpiece to perform processing. The hydrogen atom processing apparatus described above, characterized in that the apparatus is provided with a device for supplying a cooling liquid to the surface of the corrugated body. 2) The hydrogen atom processing apparatus according to claim f81, wherein the cooling liquid flows at a constant speed on the surface of the workpiece. 3) The hydrogen atom processing apparatus according to claim 1 or 2, wherein the cooling liquid is water.