JPS59110488A - Light working device - Google Patents
Light working deviceInfo
- Publication number
- JPS59110488A JPS59110488A JP57220093A JP22009382A JPS59110488A JP S59110488 A JPS59110488 A JP S59110488A JP 57220093 A JP57220093 A JP 57220093A JP 22009382 A JP22009382 A JP 22009382A JP S59110488 A JPS59110488 A JP S59110488A
- Authority
- JP
- Japan
- Prior art keywords
- laser light
- light
- laser
- workpiece
- worked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は被加工体にレーザ光を照射して、種々の加工を
行う光加工装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical processing apparatus that performs various processing by irradiating a workpiece with laser light.
レーザ発振器によってレーザ光を発振させ、このレーザ
光を集光装置によって集束して、これを被加工体に照射
して穴あけ、溶接、切断、トリミング等を行う光加工装
置は公知である。2. Description of the Related Art Optical processing apparatuses that oscillate laser light using a laser oscillator, focus the laser light using a focusing device, and irradiate a workpiece with the laser light to perform drilling, welding, cutting, trimming, etc. are well known.
然しなから、レーザ光のみによって加工を行う光加工装
置に於ては、レーザ発振器の効率が例えば約20%以下
と夕・ずしも充分高いものではないので、レーザ光を高
出力のものとして装置の性能を高めるためにはレーザ発
振器を大型にしたり、ボンピング光エネルギをより大き
くする必要があり、そのため装置が高価なものとなると
いう問題点があった。However, in optical processing equipment that processes only with laser light, the efficiency of the laser oscillator is not high enough, for example, about 20% or less, so it is necessary to use a high-power laser light. In order to improve the performance of the device, it is necessary to increase the size of the laser oscillator and the bombing light energy, which poses a problem in that the device becomes expensive.
本発明は紅玉の観点に立ってなされたものであり、比較
的低出力のレーザ発振器を用いて高出力のレーザ発振器
を用いた光加工装置と同等の性能を持つよう構成し、こ
れによって同等の性能を有する光加工装置に比べて安価
な光加工装置を提供することを目的とする。The present invention was made from the viewpoint of Kogyoku, and uses a relatively low-output laser oscillator to configure it to have the same performance as an optical processing device using a high-output laser oscillator. The purpose of the present invention is to provide an optical processing device that is cheaper than an optical processing device that has high performance.
而して、本発明の要旨とするところは、レーザ発振器と
、通常光を発生する光源と、レーザ光及び通常光を被加
工体の同一の照射点に集束させる集光装置とを設け、上
記レーザ発振器から発生ずるレーザ光及び上記光源から
発生する通常光を集光装置によって被加工体の同一の照
射点に集束させ、通常光によって被加工体の加工すべき
位置及びその周囲近傍を加熱し、レーザ光による加工を
容易にし、比較的低い出力のレーザ光によって加工を行
い得るよう構成することにある。Therefore, the gist of the present invention is to provide a laser oscillator, a light source that generates normal light, and a condensing device that focuses the laser light and the normal light on the same irradiation point of the workpiece, The laser beam generated from the laser oscillator and the normal light generated from the light source are focused on the same irradiation point of the workpiece by a condenser, and the position of the workpiece to be processed and the vicinity thereof is heated by the normal light. The object of the present invention is to facilitate processing using a laser beam, and to configure the apparatus so that the processing can be performed using a relatively low output laser beam.
以下図面によって本発明の詳細な説明する。The present invention will be explained in detail below with reference to the drawings.
第1図は本発明の一実施例を示す説明図、m2図は本発
明の他の一実施例を示す説明図である。FIG. 1 is an explanatory diagram showing one embodiment of the present invention, and FIG. m2 is an explanatory diagram showing another embodiment of the present invention.
第1図中、1はレーザ発振器、2は通常光を発生する光
源、3は凹面鏡、4.5は平面鏡、6は集束レンズ、7
は被加工体、8はクロステーブル、9は載物台である。In Figure 1, 1 is a laser oscillator, 2 is a light source that generates normal light, 3 is a concave mirror, 4.5 is a plane mirror, 6 is a focusing lens, and 7
8 is a workpiece, 8 is a cross table, and 9 is a stage.
L’ −41’ fa m器1には炭酸ガスレーザやア
ルゴンガスレーザ等のガスレーザ、ルビーレーザやYA
Gレーザ等の固体レーザその他を用い、通常の加工に於
ては連続発振させるが、加工に高い精度が要求されると
きは、被加工体7の切断すべき輪郭に応じて連続発振と
パルス発振とを使い分けることが出来る。この場合には
、レーザ発振器1を被加工体7の切断すべき輪郭の直線
部分に於ては連続発振させ、曲線部分或いは角部分に於
てはパルス発振させるか又は適宜遮光するよう構成する
。L'-41' Fa m device 1 uses a gas laser such as a carbon dioxide laser or an argon gas laser, a ruby laser or a
A solid-state laser such as a G laser is used for continuous oscillation in normal processing, but when high precision is required for processing, continuous oscillation and pulse oscillation are used depending on the contour of the workpiece 7 to be cut. You can use it properly. In this case, the laser oscillator 1 is configured to cause continuous oscillation in a straight line portion of the outline of the workpiece 7 to be cut, and to cause pulse oscillation or to appropriately shield light from a curved portion or a corner portion.
通常光を発生する光源2にはクセノンランプやアーク放
電灯等を用い、これは凹面鏡3の焦点位置にその発光点
が位置決めされる。A xenon lamp, an arc discharge lamp, or the like is used as the light source 2 that generates normal light, and its light emitting point is positioned at the focal point of the concave mirror 3.
凹面鏡3は光源2から放射状に発生する光を平行光線に
して平面鏡5に反射する。The concave mirror 3 converts the light radially generated from the light source 2 into parallel light beams and reflects them onto the plane mirror 5.
平面鏡4はレーザ発振器1の発生するレーザ光を反射し
て集束レンズ6に送り、平面鏡5は凹面鏡3によって平
行にされた光を反射して集束レンズ6に送る。The plane mirror 4 reflects the laser light generated by the laser oscillator 1 and sends it to the focusing lens 6, and the plane mirror 5 reflects the light made parallel by the concave mirror 3 and sends it to the focusing lens 6.
この場合、収束レンズ6は図示の如く1個設けるか、又
は平面鏡4及び5に夫々対応して2組設けるようにして
もよい。In this case, one converging lens 6 may be provided as shown in the figure, or two sets may be provided corresponding to the plane mirrors 4 and 5, respectively.
集束レンズ6は平面鏡4.5によって反射されたレーザ
光及び通常光を被加工体7に集束する。A focusing lens 6 focuses the laser light and normal light reflected by the plane mirror 4.5 onto the workpiece 7.
ここで、集束されたレーザ光は被加工体7の表面上の加
工すべき一点に集まり、通常光は被加工体7の表面上で
レーザ光の集束点を中心として所定の大きさの広がりを
持つよう構成する。Here, the focused laser beam gathers at one point on the surface of the workpiece 7 to be processed, and the normal light spreads to a predetermined size on the surface of the workpiece 7 centered on the focal point of the laser beam. Configure to have.
本実施例に於ては、凹面鏡3、平面鏡4.5及び集束レ
ンズ6によって集光装置が構成される。In this embodiment, a condenser mirror 3, a plane mirror 4.5, and a condenser lens 6 constitute a condensing device.
被加工体7は適宜の取り付は具を介してクロステーブル
8の載物台9に取り付けられ、載物台9は図示しない制
御装置の数値制御等によって同一平面上で2次元的に移
動する。The workpiece 7 is attached to a workpiece stand 9 of a cross table 8 through appropriate attachment tools, and the workpiece stand 9 is moved two-dimensionally on the same plane by numerical control of a control device (not shown). .
レーザ発振器1によって発振されたレーザ光は平面鏡4
に反射して集束レンズ6に到達する。The laser beam oscillated by the laser oscillator 1 passes through the plane mirror 4
and reaches the focusing lens 6.
一方、光源2から発生した光は凹面鏡3によって集めら
れ、平面鏡5に反射して集束レンズ6に到達する。On the other hand, light generated from a light source 2 is collected by a concave mirror 3, reflected by a plane mirror 5, and reaches a focusing lens 6.
集束レンズ6に到達したレーザ光及び通常光は、集束レ
ンズ6によって被加工体7の表面上の照射点に集められ
る。The laser beam and normal light that have reached the focusing lens 6 are focused by the focusing lens 6 onto an irradiation point on the surface of the workpiece 7 .
被加工体7の照射点に集められた通常光及びレーザ光の
うち、通常光は被加工体7の切断すべき個所及びその周
囲近傍部分を一定の温度まで加熱する。Of the normal light and laser light collected at the irradiation point of the workpiece 7, the normal light heats the part of the workpiece 7 to be cut and the vicinity thereof to a certain temperature.
この場合、被加工体7の材質、厚さ及び表面の状態如何
によっては、通常光のみによって被加工体7をその融点
に近い温度にまで加熱することも可能である。In this case, depending on the material, thickness, and surface condition of the workpiece 7, it is possible to heat the workpiece 7 to a temperature close to its melting point using only normal light.
レーザ光は通常光によって加熱された被加工体7をその
高いエネルギー密度によって穿孔、溝掘り、又は切断す
る。The laser light normally perforates, grooves, or cuts the workpiece 7 heated by the light due to its high energy density.
被加工体7が取り付けられた載物台9は数値制御によっ
て予め定められた移動をするので、被加工体7は所望の
輪郭で切断等される。Since the stage 9 to which the workpiece 7 is attached moves in a predetermined manner through numerical control, the workpiece 7 is cut into a desired contour.
m2図は集光装置の構成及び被加工体の取り付は方法を
異にし、被加工体に穴あけを行う本発明の他の実施例を
示す説明図である。Figure m2 is an explanatory diagram showing another embodiment of the present invention in which the structure of the condensing device and the mounting method of the workpiece are different, and the workpiece is drilled.
1〜5は第1図に示すものと同一の構成要素を示し、7
1は被加工体、9′は載物台、10.15は固定壁、1
1は平面鏡、12.13はレンズ、14は平面鏡固定部
材、16は油圧シーリングである。1 to 5 indicate the same components as shown in FIG. 1, and 7
1 is a workpiece, 9' is a stage, 10.15 is a fixed wall, 1
1 is a plane mirror, 12 and 13 are lenses, 14 is a plane mirror fixing member, and 16 is a hydraulic seal.
平面鏡固定部材14には平面鏡4.5が固定されており
、平面鏡固定部材14は固定壁15に摺動自在に取り付
けられ、図中X−X方向に移動する。A plane mirror 4.5 is fixed to the plane mirror fixing member 14, and the plane mirror fixing member 14 is slidably attached to the fixed wall 15 and moves in the XX direction in the figure.
被加工体7′を固定した載物台91は固定壁10に摺動
自在に取り付けられ、油圧シリンダ16によって図中Y
−Y方向に移動する。A workpiece 91 on which a workpiece 7' is fixed is slidably attached to a fixed wall 10, and is moved by a hydraulic cylinder 16 to Y in the figure.
-Move in the Y direction.
本実施例では、レーザ発振器1にパルス発振のCO2レ
ーザを用いる。In this embodiment, a pulse oscillation CO2 laser is used as the laser oscillator 1.
レーザ発振器1によって発振されたレーザ光は平面鏡1
1及び平面鏡4に反射して被加工体7′の表面上の照射
点に集まる。The laser beam oscillated by the laser oscillator 1 passes through the plane mirror 1
1 and plane mirror 4, and converges on the irradiation point on the surface of the workpiece 7'.
尚、図示していないが、平面鏡4.5と被加工体との間
に集束レンズを設け、更に収束レンズの集束焦点距離を
適宜の手段で変更及び制tiillできるように構成し
てもよい。Although not shown, a converging lens may be provided between the plane mirror 4.5 and the workpiece, and the converging focal length of the converging lens may be changed and controlled by appropriate means.
一方、光源2から発生した光は凹面鏡3によっ平行にさ
れた後、レンズ12.13によって集束された平行光線
となり、平面鏡5に反射して被加工体7′の表面上の照
射点に集まる。On the other hand, the light generated from the light source 2 is made parallel by the concave mirror 3, then becomes a parallel beam focused by the lens 12.13, reflected by the plane mirror 5, and concentrated at the irradiation point on the surface of the workpiece 7'. .
被加工体71に集められた通常光は被加工体7′上のレ
ーザ光の照射点の近傍部分を一定の温度まで加熱する。The normal light collected on the workpiece 71 heats a portion of the workpiece 7' near the laser beam irradiation point to a certain temperature.
この場合、被加工体7′の材質、厚さ及び表面の状態如
何によっては、通常光のみによって被加工体71をその
融点に近い温度にまで加熱することも可能である。In this case, depending on the material, thickness, and surface condition of the workpiece 7', it is possible to heat the workpiece 71 to a temperature close to its melting point using only ordinary light.
被加工体71に集められたレーザ光は、通常光によって
力1ハヘされた被加工体7′の所望の位置にその高いエ
ネルギー密度によって穴をあける。The laser beam focused on the workpiece 71 uses its high energy density to make a hole at a desired position in the workpiece 7', which has been subjected to a force of 1 by normal light.
平面鏡4.5が取り付けられた平面鏡固定部材I4及び
被加工体7′が取り付けられた載物台9′は数値制御に
よっ′C予め定められた位置に移動するので被加工体7
′の所望の位置に穴あけがされる。The plane mirror fixing member I4 to which the plane mirror 4.5 is attached and the stage 9' to which the workpiece 7' is attached are moved to a predetermined position by numerical control.
' A hole is drilled at the desired position.
本発明は紅玉の如(構成されるから、本発明によるとき
は、比較的低出力のレーザ発振器を用いて高出力のレー
ザ発振器を用いた光加工装置と同等の性能を持たせ、こ
れによって同等の性能を有する光加工装置に比べて安価
な光加工装置を提供することをかできる。Since the present invention is structured like a red ball, in accordance with the present invention, a relatively low output laser oscillator is used to provide the same performance as an optical processing device using a high output laser oscillator. It is possible to provide an optical processing device that is cheaper than an optical processing device that has the performance of .
尚、本発明の構成は紅玉の実施例に限定されるものでは
なく、集光器の構成、被加工体の設置方法は本発明の目
的の範囲内で自由に設計変更できるものであり、本発明
はこれらの一切を包摂するものである。The configuration of the present invention is not limited to the embodiment of Kogyoku, and the configuration of the condenser and the method of installing the workpiece can be freely changed within the scope of the purpose of the present invention. The invention encompasses all of these.
第1図は本発明の一方8%例を示す説明図、第2図は本
発明の他の一実施例を示す説明図である。
i −−−−−−−−−〜−−−−・−−−−−−一−
レーザ発振器2−−−−−−−−−−−−・−−−一−
−−−−−通常光を発生する光源3−一−−−−−−−
−−−−−−−−−−−−−一凹面鏡4.5.11−−
−−−−−−−−一平面鏡6.12.13−−−−−−
−−−レンズ7.7/−−−−−−、−・−−−一被加
工体特許出願人 株式会社井上ジャパックス研究所代理
人(7524)最上正太部FIG. 1 is an explanatory diagram showing one 8% example of the present invention, and FIG. 2 is an explanatory diagram showing another embodiment of the present invention. i −−−−−−−−−−−−−・−−−−−−1−
Laser oscillator 2-----------------1-
--------Light source 3-1 that generates normal light------
−−−−−−−−−−−−−One concave mirror 4.5.11−−
----------- Single plane mirror 6.12.13------
---Lens 7.7/--------, ----One workpiece patent applicant Inoue Japax Research Institute Agent (7524) Shotabe Mogami
Claims (2)
レーザ発振器から発生ずるレーザ光及び上記光源から発
生する通常光を被加工体の同一の照射点に集束させる集
光装置とを具備することを特徴とする光加工装置。(1) A laser oscillator, a light source that generates normal light, and a condensing device that focuses the laser beam generated from the laser oscillator and the normal light generated from the light source onto the same irradiation point of the workpiece. An optical processing device characterized by:
択して使用し得る特許請求の範囲第1項記載の光加工装
置。(2) The optical processing apparatus according to claim 1, in which the laser beam can be used by selecting pulsed or continuous laser light depending on the processing shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57220093A JPS59110488A (en) | 1982-12-17 | 1982-12-17 | Light working device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57220093A JPS59110488A (en) | 1982-12-17 | 1982-12-17 | Light working device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59110488A true JPS59110488A (en) | 1984-06-26 |
Family
ID=16745811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57220093A Pending JPS59110488A (en) | 1982-12-17 | 1982-12-17 | Light working device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59110488A (en) |
-
1982
- 1982-12-17 JP JP57220093A patent/JPS59110488A/en active Pending
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