JPH0325273B2 - - Google Patents
Info
- Publication number
- JPH0325273B2 JPH0325273B2 JP58051580A JP5158083A JPH0325273B2 JP H0325273 B2 JPH0325273 B2 JP H0325273B2 JP 58051580 A JP58051580 A JP 58051580A JP 5158083 A JP5158083 A JP 5158083A JP H0325273 B2 JPH0325273 B2 JP H0325273B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- cleaning
- processing
- casing
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 claims description 53
- 239000002826 coolant Substances 0.000 claims description 42
- 239000000110 cooling liquid Substances 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 3
- 238000005187 foaming Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 description 16
- 239000007789 gas Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 8
- 238000005192 partition Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
本発明はレーザ加工装置、特に加工部分に洗浄
冷却液を供給して加工するレーザ加工装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing apparatus, and particularly to a laser processing apparatus that processes a processing part by supplying a cleaning coolant to the processing part.
レーザ光を集束して被加工物に照射し加工する
レーザ加工装置は公知であるが、一般にレーザ加
工装置のレーザ発振の効率は充分に高いものでは
なく、レーザ加工装置の加工効率は低いものであ
つた。又、被加工物がレーザ光の熱によつて変質
を起し、加工精度が低下するという問題があつ
た。 Laser processing equipment that focuses laser light and irradiates it onto a workpiece to process it is well known, but generally the laser oscillation efficiency of the laser processing equipment is not sufficiently high, and the processing efficiency of the laser processing equipment is low. It was hot. Additionally, there is a problem in that the workpiece is altered in quality by the heat of the laser beam, resulting in a decrease in processing accuracy.
このため、加工部から加工屑を効果的に排除し
て加工効率を向上されると共に、被加工物の熱に
よる変質を防止して所望の箇所のみを確実に加工
できるよう、加工部分に洗浄冷却液を供給して加
工するレーザ加工装置が開発されているが、この
場合に洗浄冷却液による冷却及び加工屑の排除が
効果的でなく、この冷却効果を高めると共に、加
工屑の排除効果を高めることが課題となつてい
た。 For this reason, machining debris is effectively removed from the machining area to improve machining efficiency, and the machining area is cleaned and cooled to prevent deterioration of the workpiece due to heat and ensure that only the desired area is machined. Laser processing equipment that processes by supplying liquid has been developed, but in this case, cooling and removal of processing debris using a cleaning cooling liquid are not effective, and it is necessary to increase this cooling effect and increase the removal effect of processing debris. This had become an issue.
本発明は叙上の観点に立つてなされたものであ
り、本発明の目的とするところは、加工屑を効果
的に排除して加工効率を高めると共に、洗浄冷却
液による冷却効果を向上させ、被加工物の熱によ
る変質を防止して所望の箇所のみを確実に加工す
るレーザ加工装置を提供することにある。 The present invention has been made based on the above-mentioned viewpoints, and an object of the present invention is to effectively eliminate processing debris to increase processing efficiency, and to improve the cooling effect of the cleaning coolant. It is an object of the present invention to provide a laser processing device that can reliably process only a desired portion of a workpiece by preventing its deterioration due to heat.
而して、その要旨とするところは、被加工体の
加工部分に超音波振動エネルギを付与した蒸留水
等の洗浄冷却液を供給する洗浄冷却液供給装置を
設け、上記洗浄冷却液が被加工物の加工部乃至は
加工直後の部分に向けて噴出されるよう構成する
ことにある。 The gist of this is that a cleaning cooling liquid supply device is provided to supply a cleaning cooling liquid such as distilled water to which ultrasonic vibration energy has been applied to the processing part of the workpiece, and the cleaning cooling liquid is supplied to the processing part of the workpiece. The object is to be configured so that it is ejected toward the processed part of the object or the part immediately after processing.
以下図面に基づいて本発明の詳細を説明する。 The details of the present invention will be explained below based on the drawings.
第１図は本発明の一実施例を示す説明図、第２
図は本発明の他の一実施例を示す説明図である。 FIG. 1 is an explanatory diagram showing one embodiment of the present invention, and FIG.
The figure is an explanatory diagram showing another embodiment of the present invention.
尚、各図中、同一の符号を付したものは同一或
いは同等の機能を有する構成要素を示すものであ
り、各実施例の説明に於て、重複する説明は省略
するものとする。 In each figure, the same reference numerals indicate components having the same or equivalent functions, and redundant explanations will be omitted in the description of each embodiment.
第１図中、１はレーザ発振器、２は反射鏡、３
は反射鏡固定部材、４，７はケーシング、５は集
束レンズ、６はレンズ固定部材、８はケーシング
７を移動せしめるモータ、９は固定板、１０は案
内棒１１をケーシング４に固定する取付部材、１
１は案内棒、１２は洗浄冷却液供給装置、１３は
洗浄冷却液タンク、１４は振動子、１５は回転
盤、１６は回転盤取付座、１７はクランクギア、
１８は洗浄冷却液供給装置を移動せしめるモー
タ、１９はピニオンギア、２０は制御装置、２１
は隔壁ノズル、２２は加工用ガスタンク、２３は
加工用ガス供給管、２４被加工物、２５はクロス
テーブル、２６はＸ軸方向移動テーブル、２７は
Ｙ軸方向移動テーブル、２８，２９はそれぞれＸ
軸方向移動テーブル２６及びＹ軸方向移動テーブ
ル２７を駆動するモータである。 In Figure 1, 1 is a laser oscillator, 2 is a reflecting mirror, and 3 is a laser oscillator.
4 and 7 are the reflecting mirror fixing members, 4 and 7 are the casings, 5 is the focusing lens, 6 is the lens fixing member, 8 is the motor that moves the casing 7, 9 is the fixing plate, and 10 is the mounting member that fixes the guide rod 11 to the casing 4. ,1
1 is a guide rod, 12 is a cleaning coolant supply device, 13 is a cleaning coolant tank, 14 is a vibrator, 15 is a rotary disk, 16 is a rotary disk mounting seat, 17 is a crank gear,
18 is a motor for moving the cleaning coolant supply device, 19 is a pinion gear, 20 is a control device, 21
2 is a partition wall nozzle, 22 is a processing gas tank, 23 is a processing gas supply pipe, 24 is a workpiece, 25 is a cross table, 26 is an X-axis moving table, 27 is a Y-axis moving table, 28 and 29 are each an
This is a motor that drives the axial direction moving table 26 and the Y-axis direction moving table 27.
レーザ発振器１には、CO2レーザやHe−Neレ
ーザ等の気体レーザ、ルビーレーザやYAGレー
ザ等の固体レーザ、その他を用いる。 As the laser oscillator 1, a gas laser such as a CO 2 laser or a He-Ne laser, a solid laser such as a ruby laser or a YAG laser, or the like is used.
反射鏡２はケーシング４に固定された反射鏡固
定部材３に取り付けられ、レーザ発振器１から水
平方向に発振されたレーザ光を反射して、これを
鉛直方向に光路変更せしめる。 The reflecting mirror 2 is attached to a reflecting mirror fixing member 3 fixed to the casing 4, and reflects the laser beam oscillated in the horizontal direction from the laser oscillator 1, and changes the optical path of the laser beam in the vertical direction.
本実施例ではレーザ光を光路変更せしめるた
め、反射鏡を単独で用いたものを示したが、これ
は必要に応じて複数の反射鏡やプリズム等を用い
たり、或いはこれらを組み合せることにより、自
由にレーザ光の光路を変更することができる。 In this embodiment, a single reflecting mirror is used to change the optical path of the laser beam, but this can be done by using multiple reflecting mirrors, prisms, etc., or by combining them as necessary. The optical path of the laser beam can be changed freely.
集束レンズ５はレンズ固定部材６によつてケー
シング７内に取り付けられており、反射鏡２に反
射したレーザ光を集束して被加工体の加工点に集
める。 A focusing lens 5 is attached within the casing 7 by a lens fixing member 6, and focuses the laser beam reflected by the reflecting mirror 2 to a processing point on the workpiece.
ケーシング４とケーシング７の接合部に於て、
両者は共に円筒状であり、ケーシング７の外径は
ケーシング４の内径と略等しく設定され、ケーシ
ング７はケーシング４に摺動自在に取り付けられ
ている。 At the joint between casing 4 and casing 7,
Both have a cylindrical shape, the outer diameter of the casing 7 is set approximately equal to the inner diameter of the casing 4, and the casing 7 is slidably attached to the casing 4.
モータ８はケーシング４の外周面にその駆動軸
８ａがケーシング４の軸と平行となるよう取り付
けられており、駆動軸８ａにはねじが切られ、ケ
ーシング７に固定された固定板９のめねじと噛み
合つている。 The motor 8 is attached to the outer circumferential surface of the casing 4 so that its drive shaft 8a is parallel to the axis of the casing 4. The drive shaft 8a is threaded, and a fixed plate 9 fixed to the casing 7 is threaded. It's meshing with each other.
又、ケーシング４とケーシング７を同軸に保つ
ため、ケーシング４の外周面に設けた固定部材１
０にケーシング４の軸と平行に案内棒１１を固定
し、これをケーシング７に固定された固定板９′
に挿通する。 In addition, in order to keep the casing 4 and the casing 7 coaxial, a fixing member 1 is provided on the outer peripheral surface of the casing 4.
0, a guide rod 11 is fixed parallel to the axis of the casing 4, and this is fixed to the fixing plate 9' fixed to the casing 7.
Insert into.
ケーシング４とケーシング７の接合部は上記の
ように構成されるから、ケーシング７はモータ８
の駆動軸８ａの回転に応じて微小距離ずつ図中Ｚ
−Ｚ方向に移動する。 Since the joint between the casing 4 and the casing 7 is configured as described above, the casing 7 is connected to the motor 8.
Z in the figure by small distances according to the rotation of the drive shaft 8a.
-Move in the Z direction.
洗浄冷却液供給装置１２には洗浄冷却液供給タ
ンク１３から所定流量の洗浄冷却液が送り込ま
れ、この洗浄冷却液は振動子１４よてつ超音波振
動エネルギが付与され、ノズル１２ａから噴出す
る。 A predetermined flow rate of cleaning coolant is fed into the cleaning coolant supply device 12 from a cleaning coolant supply tank 13, and this cleaning coolant is given ultrasonic vibration energy by a vibrator 14 and is ejected from a nozzle 12a.
洗浄冷却液としては、被加工物２４の材質と化
学反応を生じることのな蒸留水等が使用される。 As the cleaning coolant, distilled water or the like that does not cause a chemical reaction with the material of the workpiece 24 is used.
振動子１４には、比較的高周波を発生させると
きに、圧電振動子或いは磁歪振動子を、比較的低
周波を発生させるときに、電歪振動子を用いる。 For the vibrator 14, a piezoelectric vibrator or a magnetostrictive vibrator is used when generating a relatively high frequency, and an electrostrictive vibrator is used when generating a relatively low frequency.
振動子１４は本実施例で示す如く単独で設けて
もよいが、これを複数個設け、周波数の異なる複
数の超音波振動エネルギを加工液に付与するよう
にしてもよい。 Although the vibrator 14 may be provided singly as shown in this embodiment, a plurality of vibrators 14 may be provided to apply a plurality of ultrasonic vibration energies of different frequencies to the machining fluid.
回転盤１５はケーシング７の外周を囲むよう円
環状に形成された部材であり、ケーシング７に固
定された回転盤取付座１６に、ケーシング７の軸
と同軸に回動するよう取り付けられる。 The rotary disk 15 is a member formed in an annular shape so as to surround the outer periphery of the casing 7, and is attached to a rotary disk mounting seat 16 fixed to the casing 7 so as to rotate coaxially with the axis of the casing 7.
クランクギア１７はモータ１８の軸に取り付け
たピニオンギア１９と噛み合い、回転盤１５にそ
の回転軸と同軸に固定されて、これと一体に回転
する。 The crank gear 17 meshes with a pinion gear 19 attached to the shaft of the motor 18, is fixed to the rotary disk 15 coaxially with the rotary shaft, and rotates integrally therewith.
洗浄冷却液供給装置１２は回転盤１５に適宜に
取付部材を介して取り付けられ、レーザ光の光軸
を中心として回転盤１５と一体に回動するから、
洗浄冷却液の噴出位置をレーザ光の照射点を中心
として同心円状に回動させることができる。この
噴出位置は回転盤１５を駆動するモータ１８の回
転を制御する制御装置２０によつて、常にレーザ
光の照射点と略同軸乃至は照射点の加工進行方向
に於いて後方部位に洗浄冷却液が供給されるよう
制御される。 The cleaning coolant supply device 12 is attached to the rotary disk 15 via an appropriate mounting member, and rotates together with the rotary disk 15 around the optical axis of the laser beam.
The spraying position of the cleaning coolant can be rotated concentrically around the irradiation point of the laser beam. This spouting position is determined by the control device 20 that controls the rotation of the motor 18 that drives the rotary disk 15 so that the cleaning coolant is always positioned approximately coaxially with the laser beam irradiation point or at a location behind the irradiation point in the processing progress direction. is controlled so that it is supplied.
漏斗状の隔壁ノズル２１はケーシング７の先端
膨出部内に設けられ、レーザ光の照射口２１ａ
と、これと同軸環状に設けられた加工用ガス噴出
口７ａとを分離する。 A funnel-shaped partition wall nozzle 21 is provided inside the swollen tip of the casing 7, and serves as a laser beam irradiation port 21a.
and a machining gas outlet 7a provided in a coaxial annular shape.
加工用ガス供給管２３からは被加工物２４の種
類に応じて酸素ガス、不活性ガス、炭酸ガス等の
加工用ガスがケーシング７と隔壁ノズル２１とで
囲まれた空所に供給され、ガス噴出口７ａよりレ
ーザ光の照射点に集中して吹き付けられる。 Processing gas such as oxygen gas, inert gas, carbon dioxide gas, etc. is supplied from the processing gas supply pipe 23 to the space surrounded by the casing 7 and the partition nozzle 21 according to the type of the workpiece 24, and the gas The laser beam is sprayed from the jet port 7a in a concentrated manner at the irradiation point of the laser beam.
尚、ケーシング７を図中Ｚ−Ｚ方向に移動せし
めるモータ８、洗浄冷却液供給装置１２を回動せ
しめるモータ１８及びクロステーブル２５のＸ軸
方向移動テーブル２６、Ｙ軸方向移動テーブル２
７をそれぞれ駆動するモータ２８及び２９は予め
定められたプログラムに従い制御装置２０よつて
一括制御される。 In addition, a motor 8 that moves the casing 7 in the Z-Z direction in the figure, a motor 18 that rotates the cleaning coolant supply device 12, an X-axis moving table 26 of the cross table 25, and a Y-axis moving table 2.
The motors 28 and 29 that respectively drive the motors 7 are collectively controlled by the control device 20 according to a predetermined program.
而して、レーザ発振器１からレーザ光が発振さ
れると、レーザ光は反射鏡２に反射して光路変更
された後、レンズ５によつて集束され被加工物２
２の加工点に照射される。 When a laser beam is emitted from the laser oscillator 1, the laser beam is reflected by the reflecting mirror 2 to change its optical path, and is then focused by the lens 5 and directed toward the workpiece 2.
2 processing points are irradiated.
一方、洗浄冷却液供給装置１２からは超音波振
動エネルギが付与された洗浄冷却液が噴射される
のであるが、洗浄冷却液供給装置１２の位置は回
転盤１５を駆動するモータ１８の回転を制御する
制御装置２０によつて、洗浄冷却液が常にレーザ
光の照射点と略同軸乃至は加工進行方向に於ける
後方部位に供給されるよう制御されるから、超音
波振動エネルギが付与された洗浄冷却液はレーザ
光の照射点の廻り乃至は照射点に対して加工進行
方向の後方部位に噴射される。 On the other hand, the cleaning coolant supply device 12 injects the cleaning coolant to which ultrasonic vibration energy has been applied, and the position of the cleaning coolant supply device 12 controls the rotation of the motor 18 that drives the rotary disk 15. Since the cleaning coolant is controlled by the control device 20 so that it is always supplied to a part approximately coaxial with the laser beam irradiation point or to a rear part in the direction of processing, the cleaning coolant is supplied with ultrasonic vibration energy. The cooling liquid is injected around the irradiation point of the laser beam or at a rear region in the machining progress direction with respect to the irradiation point.
このとき、加工点の近傍は加工用ガスの噴射及
びレーザ光の照射による洗浄冷却液の蒸発によつ
て余分な洗浄冷却液が除去され、加工部分は適量
の加工液膜で覆われ、この部分に集束されたレー
ザ光が照射されて加工が行われる。 At this time, excess cleaning coolant is removed near the machining point by evaporation of the cleaning coolant by jetting the machining gas and irradiating the laser beam, and the machining area is covered with an appropriate amount of machining liquid film. Processing is performed by irradiating the laser beam with a focused laser beam.
これと同時に、加工直後の部分は超音波振動エ
ネルギが付与された洗浄冷却液によつて冷却さ
れ、熱により変形が防止されて所望の箇所のみが
確実に加工される。又、加工屑が効果的に排除さ
れてレーザ光のエネルギが加工点にのみ供給さ
れ、加工効率が高められる。 At the same time, the part immediately after processing is cooled by a cleaning coolant to which ultrasonic vibration energy has been applied, preventing deformation due to heat and ensuring that only the desired part is processed. Furthermore, machining debris is effectively removed and laser beam energy is supplied only to the machining point, increasing machining efficiency.
超音波振動エネルギが付与された洗浄冷却液は
冷却効果が高く、通常の洗浄冷却液による場合に
比べて２倍以上の冷却効果をあげることができ
る。特に、洗浄冷却液に周波数の異なる二種以上
の超音波振動エネルギを付与したときは、通常の
洗浄冷却液による場合に比べて３倍以上の冷却効
果をあげることができるものである。 The cleaning coolant to which ultrasonic vibration energy has been applied has a high cooling effect, and can achieve a cooling effect that is more than twice that of a normal cleaning coolant. In particular, when two or more types of ultrasonic vibration energy having different frequencies are applied to the cleaning coolant, the cooling effect can be three times or more greater than when using a normal cleaning coolant.
又、超音波振動エネルギが付与された洗浄冷却
液はレーザ光による沸騰現象に加えて、キヤビテ
ーシヨンによる物理的剥離力により加工チツプを
排除するものであり、特に、３次元の加工を行う
場合は、盲孔や細部に取り込まれた加工チツプを
排除する上で効果的であり、又、通常の洗浄冷却
液を供給する場合に比べて短時間で加工チツプを
排除するができる。 In addition, the cleaning coolant to which ultrasonic vibration energy has been applied removes processed chips by the physical peeling force caused by cavitation in addition to the boiling phenomenon caused by the laser light.Especially when performing three-dimensional processing, This method is effective in removing processed chips that have been taken into blind holes or small areas, and can also remove processed chips in a shorter time than in the case of supplying a normal cleaning coolant.
更に、洗浄冷却液に表面活性剤等を混入し、こ
れを泡状とした場合は乳化作用による洗浄作用が
加わり、加工チツプをより効果的に排除すること
ができる。このとき、加工部分はレーザ光の照射
により洗浄冷却液が破泡されて余分な洗浄冷却液
が除去され、適量の洗浄冷却液で覆われると同時
に、加工直後の部分は超音波振動エネルギが付与
された加工液によつて冷却される。 Furthermore, if a surfactant or the like is mixed into the cleaning coolant to form a foam, a cleaning effect due to emulsification is added, and processed chips can be removed more effectively. At this time, the processing part is irradiated with laser light to break the bubbles in the cleaning coolant, remove excess cleaning coolant, and be covered with an appropriate amount of cleaning coolant, while at the same time applying ultrasonic vibration energy to the part immediately after processing. It is cooled by the processed fluid.
本発明の一実施例を用いた実験によれば、レー
ザ発振器として100W出力のものを用い、洗浄冷
却液に500KHz、20Wの超音波振動エネルギを付
与したときは、加工面の荒さ5μRmax、加工速度
0.08ｇ／minで加工を行うことができた。 According to an experiment using an embodiment of the present invention, when a laser oscillator with an output of 100W was used and ultrasonic vibration energy of 500KHz and 20W was applied to the cleaning coolant, the roughness of the machined surface was 5μRmax, and the machining speed was
Processing was possible at 0.08g/min.
第２図は本発明の他の一実施例を示す説明図で
ある。 FIG. 2 is an explanatory diagram showing another embodiment of the present invention.
第２図中、３０は隔壁ノズル、３１は洗浄冷却
液供給管である。 In FIG. 2, 30 is a partition nozzle, and 31 is a cleaning coolant supply pipe.
漏斗状に隔壁ノズル３０は加工用ガス供給管２
３から送り込まれる加工用ガスの噴出口と、洗浄
冷却液供給管３１から送り込まれる洗浄冷却液の
噴出口とを分離する。 The funnel-shaped partition wall nozzle 30 is connected to the processing gas supply pipe 2
The processing gas jet port sent from the cleaning cooling liquid supply pipe 31 and the cleaning cooling liquid jet port sent from the cleaning cooling liquid supply pipe 31 are separated.
而して、レーザ発振器１から発振されたレーザ
光は反射鏡２に反射して光路変更された後、レン
ズ５によつて集束する被加工物２４の加工点に照
射される。 The laser beam oscillated from the laser oscillator 1 is reflected by the reflecting mirror 2 to change its optical path, and then is irradiated onto the processing point of the workpiece 24, which is focused by the lens 5.
一方、洗浄冷却液供給装置１２から供給された
洗浄冷却液は洗浄冷却液供給管３１によつて隔壁
ノズル３０とケーシング７で囲まれた空所に送り
込まれるのであるが、このとき、余分な洗浄冷却
液は加工用ガスの噴射によつてレーザ光が照射さ
れる加工点から除去されるから、加工点の近傍は
適量の洗浄冷却液膜で覆われ、その部分にレーザ
光が照射されて加工が行われる。 On the other hand, the cleaning coolant supplied from the cleaning coolant supply device 12 is sent into the space surrounded by the partition nozzle 30 and the casing 7 through the cleaning coolant supply pipe 31. The cooling liquid is removed from the processing point that is irradiated with the laser beam by the injection of processing gas, so the vicinity of the processing point is covered with an appropriate amount of cleaning cooling liquid film, and the laser beam is irradiated to that area and the processing is performed. will be held.
本発明は叙上の如く構成されるから、本発明に
よるときは、加工部乃至加工直後の部分に噴射さ
れる洗浄冷却液に超音波振動エネルギが付与され
るので、加工部から加工屑が効果的に排除されて
加工効率が高められ、且つ洗浄冷却液による冷却
効果が高められて被加工物の熱による変質が防止
され、所望の箇所のみを加工するレーザ加工装置
を提供することができる。 Since the present invention is constructed as described above, when according to the present invention, ultrasonic vibration energy is imparted to the cleaning coolant that is sprayed to the machined part or the part immediately after processing, so that machining debris from the machined part is effectively removed. It is possible to provide a laser processing apparatus that can process only a desired location by eliminating the heat and improving processing efficiency, and by increasing the cooling effect of the cleaning coolant to prevent deterioration of the workpiece due to heat.
第１図は本発明の一実施例を示す説明図、第２
図は本発明の他の一実施例を示す説明図である。
１……レーザ発振器、２……反射鏡、４，７…
…ケーシング、５……集束レンズ、１２……洗浄
冷却液供給装置、２０……制御装置、２１，３０
……隔壁ノズル、２３……加工用ガス供給管、２
５……クロステーブル。
FIG. 1 is an explanatory diagram showing one embodiment of the present invention, and FIG.
The figure is an explanatory diagram showing another embodiment of the present invention. 1... Laser oscillator, 2... Reflector, 4, 7...
...Casing, 5...Focusing lens, 12...Cleaning coolant supply device, 20...Control device, 21, 30
...Partition nozzle, 23...Processing gas supply pipe, 2
5...Cross table.
Claims (1)
レンズによつて集束し、これを被加工物に照射し
て加工するレーザ加工装置に於て、上記被加工物
のレーザ光による加工部乃至は加工直後の部分に
のみ超音波振動エネルギを付与した洗浄冷却液を
供給する洗浄冷却供給装置を設けたことを特徴と
する上記のレーザ加工装置。 ２ 上記洗浄冷却液が発泡液である特許請求の範
囲第１項記載のレーザ加工装置。 ３ 上記洗浄冷却液に付与される超音波が周波数
の異なる複数の超音波である特許請求の範囲第１
項又は第２項記載のレーザ加工装置。[Scope of Claims] 1. In a laser processing device that focuses laser light emitted from a laser oscillator using a focusing lens and irradiates the workpiece with the focused laser beam, the workpiece is processed by the laser beam. The above-mentioned laser processing apparatus is characterized in that it is provided with a cleaning cooling supply device that supplies a cleaning cooling liquid to which ultrasonic vibration energy has been applied only to the processing section or the section immediately after processing. 2. The laser processing apparatus according to claim 1, wherein the cleaning coolant is a foaming liquid. 3. Claim 1, wherein the ultrasonic waves applied to the cleaning coolant are a plurality of ultrasonic waves with different frequencies.
2. Laser processing apparatus according to item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58051580A JPS59178189A (en) | 1983-03-29 | 1983-03-29 | Laser working device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58051580A JPS59178189A (en) | 1983-03-29 | 1983-03-29 | Laser working device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59178189A JPS59178189A (en) | 1984-10-09 |
| JPH0325273B2 true JPH0325273B2 (en) | 1991-04-05 |
Family
ID=12890875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58051580A Granted JPS59178189A (en) | 1983-03-29 | 1983-03-29 | Laser working device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59178189A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01104493A (en) * | 1987-10-16 | 1989-04-21 | Mitsubishi Electric Corp | Laser processing machine |
| SG121697A1 (en) * | 2001-10-25 | 2006-05-26 | Inst Data Storage | A method of patterning a substrate |
| CN103212845A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Coaxial water jet device used for laser micro machining of thin-walled tube |
| CN103286446B (en) * | 2013-05-23 | 2016-08-24 | 昆山丞麟激光科技有限公司 | A kind of Laser Processing synchronizes chip and removes device |
| JP6998178B2 (en) * | 2017-11-07 | 2022-01-18 | 株式会社ディスコ | Laser processing equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58221690A (en) * | 1982-06-18 | 1983-12-23 | Nippon Telegr & Teleph Corp <Ntt> | Working method of solid body |
-
1983
- 1983-03-29 JP JP58051580A patent/JPS59178189A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58221690A (en) * | 1982-06-18 | 1983-12-23 | Nippon Telegr & Teleph Corp <Ntt> | Working method of solid body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59178189A (en) | 1984-10-09 |
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