JPH03245A - 電気積層板の製造方法 - Google Patents
電気積層板の製造方法Info
- Publication number
- JPH03245A JPH03245A JP1133987A JP13398789A JPH03245A JP H03245 A JPH03245 A JP H03245A JP 1133987 A JP1133987 A JP 1133987A JP 13398789 A JP13398789 A JP 13398789A JP H03245 A JPH03245 A JP H03245A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- hole
- particulate material
- holes
- compounded resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000000945 filler Substances 0.000 claims abstract description 41
- 239000000843 powder Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002131 composite material Substances 0.000 abstract description 6
- 239000003365 glass fiber Substances 0.000 abstract description 3
- 238000000227 grinding Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 239000011236 particulate material Substances 0.000 abstract 6
- 239000000835 fiber Substances 0.000 abstract 2
- 241000531908 Aramides Species 0.000 abstract 1
- 229920003235 aromatic polyamide Polymers 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 239000008187 granular material Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- -1 Al1t O s' 3 H* O Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000004709 eyebrow Anatomy 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001494 Technora Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004950 technora Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133987A JPH03245A (ja) | 1989-05-26 | 1989-05-26 | 電気積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133987A JPH03245A (ja) | 1989-05-26 | 1989-05-26 | 電気積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03245A true JPH03245A (ja) | 1991-01-07 |
| JPH0569703B2 JPH0569703B2 (enrdf_load_stackoverflow) | 1993-10-01 |
Family
ID=15117735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1133987A Granted JPH03245A (ja) | 1989-05-26 | 1989-05-26 | 電気積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03245A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100494A (en) * | 1980-01-16 | 1981-08-12 | Fujitsu Ltd | Method of manufacturing printed circuit board |
| JPS60236294A (ja) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | 金属ベ−ス配線基板 |
-
1989
- 1989-05-26 JP JP1133987A patent/JPH03245A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100494A (en) * | 1980-01-16 | 1981-08-12 | Fujitsu Ltd | Method of manufacturing printed circuit board |
| JPS60236294A (ja) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | 金属ベ−ス配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0569703B2 (enrdf_load_stackoverflow) | 1993-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |