JPH0569703B2 - - Google Patents
Info
- Publication number
- JPH0569703B2 JPH0569703B2 JP1133987A JP13398789A JPH0569703B2 JP H0569703 B2 JPH0569703 B2 JP H0569703B2 JP 1133987 A JP1133987 A JP 1133987A JP 13398789 A JP13398789 A JP 13398789A JP H0569703 B2 JPH0569703 B2 JP H0569703B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- filler
- resin
- prepreg
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1133987A JPH03245A (ja) | 1989-05-26 | 1989-05-26 | 電気積層板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1133987A JPH03245A (ja) | 1989-05-26 | 1989-05-26 | 電気積層板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03245A JPH03245A (ja) | 1991-01-07 |
JPH0569703B2 true JPH0569703B2 (enrdf_load_stackoverflow) | 1993-10-01 |
Family
ID=15117735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1133987A Granted JPH03245A (ja) | 1989-05-26 | 1989-05-26 | 電気積層板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03245A (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56100494A (en) * | 1980-01-16 | 1981-08-12 | Fujitsu Ltd | Method of manufacturing printed circuit board |
JPS60236294A (ja) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | 金属ベ−ス配線基板 |
-
1989
- 1989-05-26 JP JP1133987A patent/JPH03245A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH03245A (ja) | 1991-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |