JPH0322915Y2 - - Google Patents
Info
- Publication number
- JPH0322915Y2 JPH0322915Y2 JP1985037899U JP3789985U JPH0322915Y2 JP H0322915 Y2 JPH0322915 Y2 JP H0322915Y2 JP 1985037899 U JP1985037899 U JP 1985037899U JP 3789985 U JP3789985 U JP 3789985U JP H0322915 Y2 JPH0322915 Y2 JP H0322915Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- chip carrier
- film
- base
- fine wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 36
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985037899U JPH0322915Y2 (US07122603-20061017-C00045.png) | 1985-03-16 | 1985-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985037899U JPH0322915Y2 (US07122603-20061017-C00045.png) | 1985-03-16 | 1985-03-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61156244U JPS61156244U (US07122603-20061017-C00045.png) | 1986-09-27 |
| JPH0322915Y2 true JPH0322915Y2 (US07122603-20061017-C00045.png) | 1991-05-20 |
Family
ID=30544405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985037899U Expired JPH0322915Y2 (US07122603-20061017-C00045.png) | 1985-03-16 | 1985-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322915Y2 (US07122603-20061017-C00045.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2532039B2 (ja) * | 1987-05-29 | 1996-09-11 | 新光電気工業株式会社 | 高周波用半導体装置 |
| US4912547A (en) * | 1989-01-30 | 1990-03-27 | International Business Machines Corporation | Tape bonded semiconductor device |
| JP2839083B2 (ja) * | 1996-03-19 | 1998-12-16 | 日本電気株式会社 | 半導体装置 |
-
1985
- 1985-03-16 JP JP1985037899U patent/JPH0322915Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61156244U (US07122603-20061017-C00045.png) | 1986-09-27 |
