JPH0319307B2 - - Google Patents

Info

Publication number
JPH0319307B2
JPH0319307B2 JP19555085A JP19555085A JPH0319307B2 JP H0319307 B2 JPH0319307 B2 JP H0319307B2 JP 19555085 A JP19555085 A JP 19555085A JP 19555085 A JP19555085 A JP 19555085A JP H0319307 B2 JPH0319307 B2 JP H0319307B2
Authority
JP
Japan
Prior art keywords
plating
nickel
plated
electroplating
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19555085A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6256591A (ja
Inventor
Tooru Murakami
Hiroshi Uotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP19555085A priority Critical patent/JPS6256591A/ja
Publication of JPS6256591A publication Critical patent/JPS6256591A/ja
Publication of JPH0319307B2 publication Critical patent/JPH0319307B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
JP19555085A 1985-09-04 1985-09-04 電気めつき方法 Granted JPS6256591A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19555085A JPS6256591A (ja) 1985-09-04 1985-09-04 電気めつき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19555085A JPS6256591A (ja) 1985-09-04 1985-09-04 電気めつき方法

Publications (2)

Publication Number Publication Date
JPS6256591A JPS6256591A (ja) 1987-03-12
JPH0319307B2 true JPH0319307B2 (enExample) 1991-03-14

Family

ID=16342964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19555085A Granted JPS6256591A (ja) 1985-09-04 1985-09-04 電気めつき方法

Country Status (1)

Country Link
JP (1) JPS6256591A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04116191A (ja) * 1990-09-04 1992-04-16 C Uyemura & Co Ltd 電気めっき方法
JPH05331676A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JPH05331677A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JP5013104B2 (ja) * 2008-01-17 2012-08-29 住友電気工業株式会社 ピンホールの評価方法
JP5013103B2 (ja) * 2008-01-17 2012-08-29 住友電気工業株式会社 ピンホールの評価方法
TWI758252B (zh) 2015-06-30 2022-03-21 美商麥克達米德恩索龍股份有限公司 微電子中之互連的鈷填充
EP3485069B1 (en) * 2016-07-18 2021-04-28 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling

Also Published As

Publication number Publication date
JPS6256591A (ja) 1987-03-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees