JPH0319227Y2 - - Google Patents
Info
- Publication number
- JPH0319227Y2 JPH0319227Y2 JP1985043795U JP4379585U JPH0319227Y2 JP H0319227 Y2 JPH0319227 Y2 JP H0319227Y2 JP 1985043795 U JP1985043795 U JP 1985043795U JP 4379585 U JP4379585 U JP 4379585U JP H0319227 Y2 JPH0319227 Y2 JP H0319227Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- integrated circuit
- hybrid integrated
- circuit device
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 14
- 230000035882 stress Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985043795U JPH0319227Y2 (US07652168-20100126-C00068.png) | 1985-03-28 | 1985-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985043795U JPH0319227Y2 (US07652168-20100126-C00068.png) | 1985-03-28 | 1985-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61162059U JPS61162059U (US07652168-20100126-C00068.png) | 1986-10-07 |
| JPH0319227Y2 true JPH0319227Y2 (US07652168-20100126-C00068.png) | 1991-04-23 |
Family
ID=30555788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985043795U Expired JPH0319227Y2 (US07652168-20100126-C00068.png) | 1985-03-28 | 1985-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0319227Y2 (US07652168-20100126-C00068.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069959A (ja) * | 2011-09-26 | 2013-04-18 | Nissan Motor Co Ltd | パワーモジュールの冷却構造 |
-
1985
- 1985-03-28 JP JP1985043795U patent/JPH0319227Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61162059U (US07652168-20100126-C00068.png) | 1986-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04188795A (ja) | 電子回路部品の放熱構造 | |
| JPH10335580A (ja) | 半導体パッケージおよびこれを用いた半導体モジュール | |
| JPH0319227Y2 (US07652168-20100126-C00068.png) | ||
| JP2002016196A (ja) | リードフレーム、およびそれを用いた樹脂封止形半導体装置 | |
| JPH0631723Y2 (ja) | 半導体装置 | |
| JP2538636B2 (ja) | 半導体装置 | |
| JP2906635B2 (ja) | 混成集積回路装置 | |
| JP3318511B2 (ja) | カード型半導体装置の実装構造 | |
| JPH0747915Y2 (ja) | 電子部品実装構造体 | |
| JPH0528800Y2 (US07652168-20100126-C00068.png) | ||
| JPH0799272A (ja) | 電子回路実装体 | |
| JP2562812Y2 (ja) | ハイブリッド集積回路装置 | |
| JPH0644110Y2 (ja) | 半導体装置 | |
| JPH056715Y2 (US07652168-20100126-C00068.png) | ||
| JPH0631194U (ja) | 混成集積回路装置 | |
| JP2589641Y2 (ja) | 混成集積回路装置 | |
| JP2522583Y2 (ja) | 放熱フイン付きジヤンパ線ユニツト | |
| JPH0729670Y2 (ja) | 電源装置 | |
| JPS607522Y2 (ja) | マイクロ波装置 | |
| JPS6176998U (US07652168-20100126-C00068.png) | ||
| JPH02265265A (ja) | 集積回路装置 | |
| JPS605143U (ja) | ヒ−トシンク構造 | |
| JPH09121008A (ja) | 半導体装置のパッケージ | |
| JPH01174940U (US07652168-20100126-C00068.png) | ||
| JPH01272198A (ja) | 電子回路装置 |
