JPH0317647U - - Google Patents
Info
- Publication number
- JPH0317647U JPH0317647U JP1989078464U JP7846489U JPH0317647U JP H0317647 U JPH0317647 U JP H0317647U JP 1989078464 U JP1989078464 U JP 1989078464U JP 7846489 U JP7846489 U JP 7846489U JP H0317647 U JPH0317647 U JP H0317647U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- semiconductor chip
- semiconductor
- length
- arranged around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078464U JPH0317647U (cg-RX-API-DMAC10.html) | 1989-07-03 | 1989-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078464U JPH0317647U (cg-RX-API-DMAC10.html) | 1989-07-03 | 1989-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317647U true JPH0317647U (cg-RX-API-DMAC10.html) | 1991-02-21 |
Family
ID=31621760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989078464U Pending JPH0317647U (cg-RX-API-DMAC10.html) | 1989-07-03 | 1989-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317647U (cg-RX-API-DMAC10.html) |
-
1989
- 1989-07-03 JP JP1989078464U patent/JPH0317647U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5358598A (en) | Folded bus bar leadframe and method of making | |
| JPH0317647U (cg-RX-API-DMAC10.html) | ||
| JPH04155854A (ja) | 半導体集積回路装置およびそれに用いるリードフレーム | |
| JP2539611B2 (ja) | 半導体装置の製造方法 | |
| JPS62235763A (ja) | 半導体装置用リ−ドフレ−ム | |
| JPH04277642A (ja) | ワイヤーボンディング方法 | |
| JPS63283053A (ja) | 半導体装置のリ−ドフレ−ム | |
| JPH06196609A (ja) | リードフレームおよびそれを用いた半導体装置 | |
| KR970053631A (ko) | 반도체 다핀 패키지 및 그 제조방법 | |
| JPS6416699U (cg-RX-API-DMAC10.html) | ||
| JPS62154659A (ja) | 半導体装置 | |
| JPH05243317A (ja) | 半導体装置 | |
| JPS6444647U (cg-RX-API-DMAC10.html) | ||
| JPH0317643U (cg-RX-API-DMAC10.html) | ||
| JPS6398648U (cg-RX-API-DMAC10.html) | ||
| JPH03196535A (ja) | 半導体装置 | |
| JPH04162766A (ja) | 半導体装置用リードフレーム | |
| JPH0317649U (cg-RX-API-DMAC10.html) | ||
| JPS61152031A (ja) | 半導体装置 | |
| JPS6037253U (ja) | 半導体装置 | |
| JPS63180929U (cg-RX-API-DMAC10.html) | ||
| JPH10270601A (ja) | 半導体装置 | |
| JPH0298636U (cg-RX-API-DMAC10.html) | ||
| JPH02138435U (cg-RX-API-DMAC10.html) | ||
| JPS6287437U (cg-RX-API-DMAC10.html) |