JPH0315832B2 - - Google Patents
Info
- Publication number
- JPH0315832B2 JPH0315832B2 JP22120985A JP22120985A JPH0315832B2 JP H0315832 B2 JPH0315832 B2 JP H0315832B2 JP 22120985 A JP22120985 A JP 22120985A JP 22120985 A JP22120985 A JP 22120985A JP H0315832 B2 JPH0315832 B2 JP H0315832B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- electronic component
- point metal
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22120985A JPS6281098A (ja) | 1985-10-04 | 1985-10-04 | 冷却構造 |
| EP86307669A EP0217676B1 (en) | 1985-10-04 | 1986-10-03 | Cooling system for electronic circuit device |
| DE19863650687 DE3650687T2 (de) | 1985-10-04 | 1986-10-03 | Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis |
| DE86307669T DE3688962T2 (de) | 1985-10-04 | 1986-10-03 | Kühlsystem für eine elektronische Schaltungsanordnung. |
| EP92100518A EP0483108B1 (en) | 1985-10-04 | 1986-10-03 | Cooling modules for electronic circuit components |
| US06/914,942 US4879632A (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit device |
| US07/079,876 US4920574A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/079,877 US4783721A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/261,904 US5126919A (en) | 1985-10-04 | 1988-10-25 | Cooling system for an electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22120985A JPS6281098A (ja) | 1985-10-04 | 1985-10-04 | 冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6281098A JPS6281098A (ja) | 1987-04-14 |
| JPH0315832B2 true JPH0315832B2 (enrdf_load_stackoverflow) | 1991-03-04 |
Family
ID=16763171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22120985A Granted JPS6281098A (ja) | 1985-10-04 | 1985-10-04 | 冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6281098A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7697270B2 (ja) * | 2021-06-03 | 2025-06-24 | 三菱電機株式会社 | フェーズドアレイアンテナ |
-
1985
- 1985-10-04 JP JP22120985A patent/JPS6281098A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6281098A (ja) | 1987-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7595991B2 (en) | Using the wave soldering process to attach motherboard chipset heat sinks | |
| US7342306B2 (en) | High performance reworkable heatsink and packaging structure with solder release layer | |
| US6979899B2 (en) | System and method for high performance heat sink for multiple chip devices | |
| US4561011A (en) | Dimensionally stable semiconductor device | |
| JP3971296B2 (ja) | 金属−セラミックス接合基板およびその製造方法 | |
| EP0097782A2 (en) | Thermal conduction bridge element for semiconductor device packages | |
| JPS5928989B2 (ja) | 回路パツケ−ジ及びその製造方法 | |
| US5761048A (en) | Conductive polymer ball attachment for grid array semiconductor packages | |
| JPS6054785B2 (ja) | 集積回路アセンブリの製造方法 | |
| EP0219674A1 (en) | Cooling device for electronic parts | |
| JPS59115548A (ja) | 熱伝導橋渡しエレメント | |
| US5146981A (en) | Substrate to heatsink interface apparatus and method | |
| KR20100105641A (ko) | 열분해 흑연-매설형 히트싱크의 형성 방법 | |
| US20020088605A1 (en) | Device for cooling of electronic components | |
| EP1430532A2 (en) | Encapsulation of pin solder for maintaining accuracy in pin position | |
| US4897764A (en) | Conductive cooling cup module | |
| JPH0315832B2 (enrdf_load_stackoverflow) | ||
| US6227434B1 (en) | Reworking of a ball grid array module | |
| JPH0310705Y2 (enrdf_load_stackoverflow) | ||
| JPS58199546A (ja) | 半導体冷却装置 | |
| US11439043B2 (en) | Multi-device cooling structure having assembly alignment features | |
| JPH04122053A (ja) | 半導体チップの実装方法 | |
| JPH05160306A (ja) | 放熱構造 | |
| JPS59155156A (ja) | Icモジユ−ル | |
| JPH01206634A (ja) | 半導体装置 |