JPH0310705Y2 - - Google Patents

Info

Publication number
JPH0310705Y2
JPH0310705Y2 JP1985152137U JP15213785U JPH0310705Y2 JP H0310705 Y2 JPH0310705 Y2 JP H0310705Y2 JP 1985152137 U JP1985152137 U JP 1985152137U JP 15213785 U JP15213785 U JP 15213785U JP H0310705 Y2 JPH0310705 Y2 JP H0310705Y2
Authority
JP
Japan
Prior art keywords
electronic component
cooling
metal member
metal
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985152137U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6276591U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985152137U priority Critical patent/JPH0310705Y2/ja
Priority to US06/914,942 priority patent/US4879632A/en
Priority to DE86307669T priority patent/DE3688962T2/de
Priority to EP86307669A priority patent/EP0217676B1/en
Publication of JPS6276591U publication Critical patent/JPS6276591U/ja
Priority to US07/079,877 priority patent/US4783721A/en
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/261,904 priority patent/US5126919A/en
Application granted granted Critical
Publication of JPH0310705Y2 publication Critical patent/JPH0310705Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1985152137U 1985-10-04 1985-10-04 Expired JPH0310705Y2 (enrdf_load_stackoverflow)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP1985152137U JPH0310705Y2 (enrdf_load_stackoverflow) 1985-10-04 1985-10-04
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985152137U JPH0310705Y2 (enrdf_load_stackoverflow) 1985-10-04 1985-10-04

Publications (2)

Publication Number Publication Date
JPS6276591U JPS6276591U (enrdf_load_stackoverflow) 1987-05-16
JPH0310705Y2 true JPH0310705Y2 (enrdf_load_stackoverflow) 1991-03-15

Family

ID=31069842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985152137U Expired JPH0310705Y2 (enrdf_load_stackoverflow) 1985-10-04 1985-10-04

Country Status (1)

Country Link
JP (1) JPH0310705Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6276591U (enrdf_load_stackoverflow) 1987-05-16

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