JPH0314897B2 - - Google Patents
Info
- Publication number
- JPH0314897B2 JPH0314897B2 JP61007008A JP700886A JPH0314897B2 JP H0314897 B2 JPH0314897 B2 JP H0314897B2 JP 61007008 A JP61007008 A JP 61007008A JP 700886 A JP700886 A JP 700886A JP H0314897 B2 JPH0314897 B2 JP H0314897B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- press punching
- alloy
- lead material
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 18
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 16
- 239000012535 impurity Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 238000004080 punching Methods 0.000 description 22
- 230000000694 effects Effects 0.000 description 10
- 239000000203 mixture Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP700886A JPS62164843A (ja) | 1986-01-16 | 1986-01-16 | 半導体装置用Ｃｕ合金リ−ド素材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP700886A JPS62164843A (ja) | 1986-01-16 | 1986-01-16 | 半導体装置用Ｃｕ合金リ−ド素材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19645590A Division JPH0375325A (ja) | 1990-07-25 | 1990-07-25 | 半導体装置用Ｃｕ合金リード素材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62164843A JPS62164843A (ja) | 1987-07-21 |
| JPH0314897B2 true JPH0314897B2 (no) | 1991-02-27 |
Family
ID=11654030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP700886A Granted JPS62164843A (ja) | 1986-01-16 | 1986-01-16 | 半導体装置用Ｃｕ合金リ−ド素材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62164843A (no) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07116536B2 (ja) * | 1989-02-10 | 1995-12-13 | 三菱伸銅株式会社 | 高強度Ｃｕ合金 |
| JP2501636B2 (ja) * | 1989-02-10 | 1996-05-29 | 三菱伸銅株式会社 | スタンピング金型の摩耗抑制効果にすぐれた半導体装置のリ―ドフレ―ム用Ｃｕ合金素材 |
| JP2606397B2 (ja) * | 1990-02-21 | 1997-04-30 | 日立電線株式会社 | プレス性の優れたリードフレーム用銅合金材料 |
| JP4950584B2 (ja) * | 2006-07-28 | 2012-06-13 | 株式会社神戸製鋼所 | 高強度および耐熱性を備えた銅合金 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147420A (no) * | 1974-05-20 | 1975-11-26 | ||
| JPS58113334A (ja) * | 1981-12-28 | 1983-07-06 | Tamagawa Kikai Kinzoku Kk | 熱間加工性のすぐれたりん青銅 |
| JPS60245752A (ja) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | 高力高導電銅合金 |
| JPS6167738A (ja) * | 1984-08-31 | 1986-04-07 | オリン コーポレーシヨン | 高強度、高導電性銅基合金 |
| JPS61242052A (ja) * | 1985-04-19 | 1986-10-28 | Mitsubishi Shindo Kk | 半導体装置用銅合金リ−ド材 |
-
1986
- 1986-01-16 JP JP700886A patent/JPS62164843A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147420A (no) * | 1974-05-20 | 1975-11-26 | ||
| JPS58113334A (ja) * | 1981-12-28 | 1983-07-06 | Tamagawa Kikai Kinzoku Kk | 熱間加工性のすぐれたりん青銅 |
| JPS60245752A (ja) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | 高力高導電銅合金 |
| JPS6167738A (ja) * | 1984-08-31 | 1986-04-07 | オリン コーポレーシヨン | 高強度、高導電性銅基合金 |
| JPS61242052A (ja) * | 1985-04-19 | 1986-10-28 | Mitsubishi Shindo Kk | 半導体装置用銅合金リ−ド材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62164843A (ja) | 1987-07-21 |
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