JPH0314226B2 - - Google Patents

Info

Publication number
JPH0314226B2
JPH0314226B2 JP27788084A JP27788084A JPH0314226B2 JP H0314226 B2 JPH0314226 B2 JP H0314226B2 JP 27788084 A JP27788084 A JP 27788084A JP 27788084 A JP27788084 A JP 27788084A JP H0314226 B2 JPH0314226 B2 JP H0314226B2
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
suction nozzle
punching
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP27788084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61150342A (ja
Inventor
Yasunobu Suzuki
Hisao Ishida
Akihiro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP27788084A priority Critical patent/JPS61150342A/ja
Publication of JPS61150342A publication Critical patent/JPS61150342A/ja
Publication of JPH0314226B2 publication Critical patent/JPH0314226B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP27788084A 1984-12-25 1984-12-25 アウタ−リ−ドボンデイング装置 Granted JPS61150342A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27788084A JPS61150342A (ja) 1984-12-25 1984-12-25 アウタ−リ−ドボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27788084A JPS61150342A (ja) 1984-12-25 1984-12-25 アウタ−リ−ドボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61150342A JPS61150342A (ja) 1986-07-09
JPH0314226B2 true JPH0314226B2 (enrdf_load_stackoverflow) 1991-02-26

Family

ID=17589574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27788084A Granted JPS61150342A (ja) 1984-12-25 1984-12-25 アウタ−リ−ドボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61150342A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS61150342A (ja) 1986-07-09

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