JPH0314070Y2 - - Google Patents
Info
- Publication number
- JPH0314070Y2 JPH0314070Y2 JP1980066615U JP6661580U JPH0314070Y2 JP H0314070 Y2 JPH0314070 Y2 JP H0314070Y2 JP 1980066615 U JP1980066615 U JP 1980066615U JP 6661580 U JP6661580 U JP 6661580U JP H0314070 Y2 JPH0314070 Y2 JP H0314070Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- hole
- land
- land seat
- bus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Power Sources (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980066615U JPH0314070Y2 (cg-RX-API-DMAC7.html) | 1980-05-15 | 1980-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980066615U JPH0314070Y2 (cg-RX-API-DMAC7.html) | 1980-05-15 | 1980-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56167592U JPS56167592U (cg-RX-API-DMAC7.html) | 1981-12-11 |
| JPH0314070Y2 true JPH0314070Y2 (cg-RX-API-DMAC7.html) | 1991-03-28 |
Family
ID=29660683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980066615U Expired JPH0314070Y2 (cg-RX-API-DMAC7.html) | 1980-05-15 | 1980-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0314070Y2 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7024656B2 (ja) * | 2018-08-08 | 2022-02-24 | 日本電産株式会社 | モータ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441341Y2 (cg-RX-API-DMAC7.html) * | 1975-03-14 | 1979-12-04 | ||
| JPS5749407Y2 (cg-RX-API-DMAC7.html) * | 1976-06-11 | 1982-10-29 | ||
| JPS54149648U (cg-RX-API-DMAC7.html) * | 1978-04-10 | 1979-10-18 |
-
1980
- 1980-05-15 JP JP1980066615U patent/JPH0314070Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56167592U (cg-RX-API-DMAC7.html) | 1981-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100281813B1 (ko) | 열및전기적으로개선된볼그리드패키지 | |
| US6396141B2 (en) | Tape ball grid array with interconnected ground plane | |
| US5095407A (en) | Double-sided memory board | |
| JPH0314070Y2 (cg-RX-API-DMAC7.html) | ||
| JPS6256664B2 (cg-RX-API-DMAC7.html) | ||
| JPH098488A (ja) | 回路基板の設計方法及び回路基板 | |
| JPH01225196A (ja) | 積層混成集積回路の製造方法 | |
| JPS5835993A (ja) | プリント配線基板 | |
| JPH0555719A (ja) | 回路基板装置 | |
| JPH11121933A (ja) | 多層プリント配線板および電子部品を実装したプリント配線板 | |
| JP2778235B2 (ja) | 半導体装置 | |
| JP2633889B2 (ja) | 両面メモリーボード | |
| JPS6120080U (ja) | 多層プリント配線板 | |
| JPH0230843Y2 (cg-RX-API-DMAC7.html) | ||
| JP2697345B2 (ja) | 混成集積回路 | |
| JP2532975Y2 (ja) | 回路基板装置 | |
| JPS63197334U (cg-RX-API-DMAC7.html) | ||
| JPS59127268U (ja) | 混成集積回路装置 | |
| JPS63174481U (cg-RX-API-DMAC7.html) | ||
| JPS5939960U (ja) | プリント配線基板 | |
| JPH01228137A (ja) | 混成集積回路用配線基板 | |
| JPH01184984A (ja) | 電子回路装置 | |
| JPH066008A (ja) | 電子部品実装用補助基板 | |
| JPS611872U (ja) | 集積回路装置 | |
| JPH08307096A (ja) | 電子部品実装方法および電子部品実装板 |