JPH0314070Y2 - - Google Patents
Info
- Publication number
- JPH0314070Y2 JPH0314070Y2 JP1980066615U JP6661580U JPH0314070Y2 JP H0314070 Y2 JPH0314070 Y2 JP H0314070Y2 JP 1980066615 U JP1980066615 U JP 1980066615U JP 6661580 U JP6661580 U JP 6661580U JP H0314070 Y2 JPH0314070 Y2 JP H0314070Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- hole
- land
- land seat
- bus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Power Sources (AREA)
Description
【考案の詳細な説明】
本考案は電子回路パツケージに使用される電源
バス取付構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a power bus mounting structure used in an electronic circuit package.
電子計算機等の電子機器において、電子回路パ
ツケージの実装密度の向上、IC（集積回路素子）
およびLSI（高密度集積回路素子）の集積度の向
上による単位体積当りの電流容量の増加、電子機
器の動作速度の高速化および電圧変動の抑制等が
要求されている現在前記パツケージには大容量電
流を供給するための電源バスが取付けられてい
る。 In electronic devices such as computers, improvements in the packaging density of electronic circuit packages and IC (integrated circuit elements)
Currently, there are demands for increased current capacity per unit volume due to improved integration of LSIs (high-density integrated circuit elements), faster operating speeds for electronic equipment, and suppression of voltage fluctuations. A power bus is installed to supply current.
第１図は従来のパツケージへの電源バス取付機
造を示す図であり、プリント板１の電源受電用ラ
ンド４があり、該ランド４にはプリント板１の内
部電源層に接続するためのスルーホール２とバス
取付穴３とが設けられている。一方、電源バス５
にはタツプ穴６が設けられている。バス取付穴３
にネジ７を貫通させ、さらに、電源バス５のタツ
プ穴６と係合させて電源を電源バス５からプリン
ト板１に供給する構造を有している。 FIG. 1 is a diagram showing a conventional power supply bus attachment mechanism to a package. There is a land 4 for receiving power on a printed board 1, and the land 4 has a through hole for connecting to the internal power layer of the printed board 1. A hole 2 and a bus attachment hole 3 are provided. On the other hand, power bus 5
is provided with a tapped hole 6. Bus mounting hole 3
It has a structure in which a screw 7 is passed through the power supply bus 5 and is engaged with a tap hole 6 of the power supply bus 5 to supply power from the power supply bus 5 to the printed board 1.
回路を高密度化・高速化するためには回路素子
間を接続する信号パターンを高密度化し、信号パ
ターンの長さを短かくする必要がある。しかし、
従来の取付構造では、プリント板１上に形成され
た信号パターン１６はランド４部分には信号パタ
ーンを形成することができないため、信号パター
ン本数が減り、信号パターン１６にような遠まわ
りのパターンになりパターンの長さが長くなると
いう欠点がある。 In order to increase the density and speed of circuits, it is necessary to increase the density of signal patterns that connect circuit elements and shorten the length of the signal patterns. but,
In the conventional mounting structure, the signal pattern 16 formed on the printed board 1 cannot be formed on the land 4 portion, so the number of signal patterns is reduced, and the signal pattern 16 is a long circuit. The disadvantage is that the length of the pattern becomes longer.
本考案の目的は上述の欠点を除去した電源バス
取付構造を提供することにある。 The object of the present invention is to provide a power bus mounting structure that eliminates the above-mentioned drawbacks.
下部にプリント板のスルーホールと係合する複
数のリードを有しかつ上部に電源バスに設けられ
た穴を貫通するスタツドを有するランド座と、前
記ランド座のスタツドと係合するナツトと、前記
ランド座と前記プリント板とを絶縁するために前
記ランド座と前記プリント板との間に設けられた
絶縁体とから構成されている。 a land seat having a plurality of leads that engage with through holes in a printed board at a lower part and a stud passing through a hole provided in a power supply bus at an upper part; a nut that engages with a stud of the land seat; An insulator is provided between the land seat and the printed board to insulate the land seat and the printed board.
次に本考案について図面を参照して詳細に説明
する。 Next, the present invention will be explained in detail with reference to the drawings.
第２図は本考案の一実施例を示す図であり、プ
リント板１には内部電源層接続用スルーホール２
が設けられ、スルーホール２の壁面には導電膜２
ａが形成され、導電膜２ａはプリント板１内の電
源層１７と電気的に接続されている（第３図参
照）。さらに、ランド座１０の下部に設けられた
リード１５が絶縁体８の穴９を貫通してスルーホ
ール２に半田付け等により接続されている。ラン
ド座１０の上部にはネジ山を有したスタツド１１
が溶接等により取り付けられており、スタツド１
１は電源バス１２に設けられた穴１３を貫通し
て、ナツト１４と係合し、これにより電源バスが
取り付けられる構造を有している。 FIG. 2 is a diagram showing an embodiment of the present invention, in which a printed circuit board 1 has through holes 2 for connecting an internal power layer.
A conductive film 2 is provided on the wall surface of the through hole 2.
a is formed, and the conductive film 2a is electrically connected to the power supply layer 17 in the printed board 1 (see FIG. 3). Further, a lead 15 provided at the lower part of the land seat 10 passes through a hole 9 in the insulator 8 and is connected to the through hole 2 by soldering or the like. At the top of the land seat 10 is a stud 11 having a screw thread.
is attached by welding etc., and stud 1
1 has a structure in which it passes through a hole 13 provided in a power bus 12 and engages with a nut 14, thereby attaching the power bus.
したがつて、プリント板１には従来構造の説明
で述べたようなランドがなく、また、ランド座１
０は絶縁体８によりプリント板１とは絶縁されて
いるため、信号パターン１６は従来構造のランド
が形成されている部分にも信号パターン１６を形
成することができ、信号パターンの本数を増加さ
せ、また、最短距離配線が可能となる。 Therefore, the printed board 1 does not have a land as described in the explanation of the conventional structure, and the land seat 1
0 is insulated from the printed board 1 by the insulator 8, the signal pattern 16 can be formed even in the area where the lands of the conventional structure are formed, increasing the number of signal patterns. In addition, the shortest distance wiring is possible.
以上、本考案には、信号パターン本数を減少さ
せることなくまた信号パターンを長くすることな
く電源バスの取り付けが行なえるという効果があ
る。 As described above, the present invention has the effect that a power supply bus can be attached without reducing the number of signal patterns or increasing the length of the signal patterns.
第１図は従来例を示す斜視図および第２図は本
考案の一実施例を示す斜視図ならびに第３図は本
実施例の一部の断面図である。
図において、１……プリント板、２……スルー
ホール、３……バス取付穴、４……ランド、５…
…電源バス、６……タツプ穴、７……ネジ、８…
…絶縁体、９……穴、１０……ランド座、１１…
…スタツド、１２……電源バス、１３……穴、１
４……ナツト、１５……リード、１６……信号パ
ターン。
FIG. 1 is a perspective view showing a conventional example, FIG. 2 is a perspective view showing an embodiment of the present invention, and FIG. 3 is a sectional view of a part of this embodiment. In the figure, 1... printed board, 2... through hole, 3... bus mounting hole, 4... land, 5...
...Power bus, 6...Tap hole, 7...Screw, 8...
...Insulator, 9...Hole, 10...Land seat, 11...
...Stud, 12...Power bus, 13...Hole, 1
4...Natsu, 15...Lead, 16...Signal pattern.
Claims (1)
数のリードを有しかつ上部に電源バスに設けられ
た穴を貫通するスタツドを有するランド座と、 前記ランド座のスタツドと係合するナツトと、 前記ランド座と前記プリント板上の前記ランド
座に対向する領域に形成される信号パターンとを
絶縁するために前記ランド座と前記プリント板と
の間に設けられた絶縁体とから構成されたことを
特徴とする電源バス取付構造。[Claims for Utility Model Registration] A land seat that has a plurality of leads that engage with through holes in a printed board at its lower part and a stud that passes through a hole provided in a power supply bus at its upper part; and the stud of the land seat. and an insulator provided between the land seat and the printed board to insulate the land seat and a signal pattern formed in an area facing the land seat on the printed board. A power bus mounting structure characterized by comprising a body and a body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980066615U JPH0314070Y2 (en) | 1980-05-15 | 1980-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980066615U JPH0314070Y2 (en) | 1980-05-15 | 1980-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56167592U JPS56167592U (en) | 1981-12-11 |
| JPH0314070Y2 true JPH0314070Y2 (en) | 1991-03-28 |
Family
ID=29660683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980066615U Expired JPH0314070Y2 (en) | 1980-05-15 | 1980-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0314070Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7024656B2 (en) * | 2018-08-08 | 2022-02-24 | 日本電産株式会社 | motor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441341Y2 (en) * | 1975-03-14 | 1979-12-04 | ||
| JPS5749407Y2 (en) * | 1976-06-11 | 1982-10-29 | ||
| JPS54149648U (en) * | 1978-04-10 | 1979-10-18 |
-
1980
- 1980-05-15 JP JP1980066615U patent/JPH0314070Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56167592U (en) | 1981-12-11 |
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