JPH0314002Y2 - - Google Patents
Info
- Publication number
- JPH0314002Y2 JPH0314002Y2 JP5603485U JP5603485U JPH0314002Y2 JP H0314002 Y2 JPH0314002 Y2 JP H0314002Y2 JP 5603485 U JP5603485 U JP 5603485U JP 5603485 U JP5603485 U JP 5603485U JP H0314002 Y2 JPH0314002 Y2 JP H0314002Y2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- lead frame
- thermistor element
- film thermistor
- electrode pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 30
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5603485U JPH0314002Y2 (US07754267-20100713-C00017.png) | 1985-04-17 | 1985-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5603485U JPH0314002Y2 (US07754267-20100713-C00017.png) | 1985-04-17 | 1985-04-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61173101U JPS61173101U (US07754267-20100713-C00017.png) | 1986-10-28 |
| JPH0314002Y2 true JPH0314002Y2 (US07754267-20100713-C00017.png) | 1991-03-28 |
Family
ID=30579259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5603485U Expired JPH0314002Y2 (US07754267-20100713-C00017.png) | 1985-04-17 | 1985-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0314002Y2 (US07754267-20100713-C00017.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5896157B2 (ja) * | 2012-09-06 | 2016-03-30 | 三菱マテリアル株式会社 | 温度センサ |
| JP6011286B2 (ja) * | 2012-12-03 | 2016-10-19 | 三菱マテリアル株式会社 | 温度センサ |
| JP6011285B2 (ja) * | 2012-12-03 | 2016-10-19 | 三菱マテリアル株式会社 | 温度センサ |
-
1985
- 1985-04-17 JP JP5603485U patent/JPH0314002Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61173101U (US07754267-20100713-C00017.png) | 1986-10-28 |
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