JPH0313944B2 - - Google Patents

Info

Publication number
JPH0313944B2
JPH0313944B2 JP1097476A JP9747689A JPH0313944B2 JP H0313944 B2 JPH0313944 B2 JP H0313944B2 JP 1097476 A JP1097476 A JP 1097476A JP 9747689 A JP9747689 A JP 9747689A JP H0313944 B2 JPH0313944 B2 JP H0313944B2
Authority
JP
Japan
Prior art keywords
chip
circuit board
printed circuit
solder bumps
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1097476A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02280961A (ja
Inventor
Katsumichi Kamyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP1097476A priority Critical patent/JPH02280961A/ja
Publication of JPH02280961A publication Critical patent/JPH02280961A/ja
Publication of JPH0313944B2 publication Critical patent/JPH0313944B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/072—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07178—
    • H10W72/07235—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1097476A 1989-04-19 1989-04-19 Ｉｃチップのはんだ付け方法 Granted JPH02280961A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1097476A JPH02280961A (ja) 1989-04-19 1989-04-19 Ｉｃチップのはんだ付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1097476A JPH02280961A (ja) 1989-04-19 1989-04-19 Ｉｃチップのはんだ付け方法

Publications (2)

Publication Number Publication Date
JPH02280961A JPH02280961A (ja) 1990-11-16
JPH0313944B2 true JPH0313944B2 (cg-RX-API-DMAC10.html) 1991-02-25

Family

ID=14193349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1097476A Granted JPH02280961A (ja) 1989-04-19 1989-04-19 Ｉｃチップのはんだ付け方法

Country Status (1)

Country Link
JP (1) JPH02280961A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737911A (ja) * 1993-07-19 1995-02-07 Mitsubishi Electric Corp 半導体素子のダイボンド装置、及びダイボンド方法
US6098271A (en) * 1994-10-04 2000-08-08 Fujitsu Limited Method for assembling a magnetic disk drive with a relaying flexible printed circuit sheet
JPH08106617A (ja) 1994-10-04 1996-04-23 Fujitsu Ltd 磁気ディスク装置
US7271364B1 (en) * 2004-03-22 2007-09-18 Cardiac Pacemakers, Inc. Laser welding fixture and method
US8168920B2 (en) * 2007-09-11 2012-05-01 Shibuya Kogyo Co., Ltd. Bonding device
JP5126711B2 (ja) * 2007-09-11 2013-01-23 澁谷工業株式会社 ボンディング装置

Also Published As

Publication number Publication date
JPH02280961A (ja) 1990-11-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term