JPH03136395A - Insulating board using wiring circuit - Google Patents

Abstract

PURPOSE:To easily and rapidly form an insulating board of one or more layer structure without labor and facility cost by providing viaholes or through holes of conductors for connecting between crossing conductor circuits on sections in which the conductor circuits, of the board are stereoscopically crossed. CONSTITUTION:Latticelike conductor circuits 20 of front and rear surfaces of a board 10a are formed in the same size of the same shape, stereoscopically crossed, and stereoscopically superposed. Viaholes 30 are provided at every other one through the board 10a at sections in which the circuits 20 of the front and rear surfaces of the board 10a are stereoscopically crossed, and the circuits 20 are connected at every other ones therebetween by the viaholes 30. Holes 40 are so provided at sections having no viaholes 30 of the sections in which the circuits 20 of the front and rear surfaces of the board 10a are stereoscopically crossed, i.e., at every other ones in the sections in which the circuits 20 are stereoscopically crossed through the board 10a.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention uses a conductor circuit, a conductor via fill or a through hole, or an insulator hole provided on an insulating substrate, and various types of The present invention relates to an insulating substrate having a wiring circuit, on which a wiring circuit can be freely formed.

[Prior Art] Examples of insulating substrates for mounting electronic components include ceramic substrates, resin substrates, and plastic substrates.

2 Among these insulating substrates, a multilayered ceramic substrate having a wiring circuit is formed as follows.

A green sheet is cut into a predetermined shape, and a conductive paste for forming a wiring circuit mixed with tungsten powder is printed on the surface of the green sheet, or a hole is drilled in the surface of the green sheet, and a hole is inserted into the hole. A via fill filled with the above-mentioned conductor pagest is printed. Next, stack multiple green sheets,
It is placed in a furnace and fired to form a ceramic substrate, and at the same time, a wiring circuit is formed on the substrate.

By the way, when forming a specific wiring circuit on the above-mentioned multilayered ceramic substrate, conventionally, a special method was used to print the above-mentioned conductive paste on the surface of a green sheet, etc., in accordance with the wiring circuit to be formed. A print mask is formed, and a special mold is formed on the surface of the green sheet to form the wire hole for forming the wire wire.

[Problem to be Solved by the Invention 1] However, when forming a specific wiring circuit on a ceramic substrate, it takes a lot of effort and time to form a special print mask, mold, etc. ,
This significantly increased manufacturing costs. This is particularly noticeable in recent ceramic substrates that are suitable for high-mix, low-volume production.

This also applies to ceramic substrates with a single layer structure, plastic substrates with a single layer or multilayer structure, and the like.

An object of the present invention is to provide an insulating substrate that solves these problems.

[Means for Solving the Problems] For the above purpose, the first insulating substrate of the present invention has a continuous conductor circuit or a conductor circuit cut in the middle on the front and back surfaces of the insulating substrate. Provided so that the conductor circuits on the back surface intersect three-dimensionally, or so that at least a portion of the conductor circuits on the front and back surfaces of the insulating substrate overlap three-dimensionally, and the conductor circuits of the insulating substrate intersect three-dimensionally. A part or three-dimensionally overlapping part is provided with a guiafil or through hole, which is a conductor that connects the intersecting conductor circuits or between the overlapping conductor circuits, or a hole, which is an insulator in the shape of a through hole or a blind hole. It is characterized by

Further, the second insulating substrate of the present invention includes a continuous conductor circuit or a conductor circuit cut in the middle on the surface of the plurality of layer members of the insulating substrate with a multilayer structure. It is provided so that the circuits intersect three-dimensionally, or so that at least a portion of the conductor circuits on the surfaces of the plurality of layer members of the insulating substrate overlap three-dimensionally, and the conductor circuits of the insulating substrate intersect three-dimensionally. A guiafil or through hole, which is a conductor that connects the intersecting conductor circuits or overlapping conductor circuits, or a hole, which is an insulator in the form of a through hole or a blind hole, is provided in the part or the part that overlaps three-dimensionally. It is characterized by becoming.

Furthermore, in the insulated substrates of the first and second aspects of the present invention, it is preferable to provide a plurality of conductor circuits in a lattice shape on the front and back surfaces of the insulated substrate or on the surfaces of a plurality of layer members of an insulated substrate having a multilayer structure. .

"Function" In the first insulating substrate having the above configuration, the midway portion of the conductor circuit at a continuous predetermined portion on the front and back surfaces of the insulating substrate is separated by etching or the like, or a predetermined portion in a separated state on the front and back surfaces of the insulating substrate is separated. The middle part of the conductor circuit of the part is connected with solder, etc., or the hole in the predetermined part of the insulating board is filled with a conductor such as solder or a layer of a conductor and an insulator such as insulating powder, and the front and back surfaces of the insulating board are Connecting conductor circuits that intersect three-dimensionally or overlap conductor circuits three-dimensionally at a predetermined location, or midway through a conductor circuit at a predetermined location that is separated by a hole on the front and back surfaces of an insulating substrate or on either side. or by drilling a through hole or a blind hole in a predetermined part of the insulating board from the front or back side of the insulating board using a drill etc. By cutting the conductor circuit midway at a predetermined location on one surface, and filling the through hole or blind hole at the predetermined location with a conductor or a conductor and an insulator in a layered manner, Connecting conductor circuits that three-dimensionally intersect or three-dimensionally overlap conductor circuits at a location, or midway through a conductor circuit at a predetermined location on the front and back surfaces of an insulating substrate, or either surface separated by the through hole or blind hole. By connecting the parts, a specific wiring circuit can be three-dimensionally formed over the front and back surfaces of the insulating substrate.

In the second insulating substrate having the above structure, the midway portion of the conductor circuit at a continuous predetermined portion of the surface of the layer member exposed to the outside of the insulating substrate is separated by etching or the like, or the surface of the layer member exposed to the outside of the insulating substrate is separated. Connect the middle parts of the conductor circuits at predetermined parts of the insulating board, which are in a separated state, by soldering or the like, or fill the holes in the predetermined parts of the insulating board with a conductor or a layer of conductors and insulators to connect multiple parts of the insulating board. Connecting conductor circuits that three-dimensionally intersect or three-dimensionally overlap at a predetermined location on the surface of a layer member, or midway through a conductor circuit at a predetermined location separated by a hole on the surface of a layer member of an insulating substrate. or by drilling a through hole or a blind hole in a predetermined part of the insulating substrate from the front or back side thereof, and using the through hole or blind hole to connect a continuous conductor circuit in a predetermined part of the surface of the layer member of the insulating board. Divide the middle part,
Furthermore, the conductor or the conductor and the insulator are filled in layers in the through holes or blind holes in the predetermined portions of the insulating substrate, and conductor circuits or three-dimensional Connecting overlapping conductor circuits,
By connecting the midway portions of the conductor circuits at predetermined locations on the surface of the layer members of the insulating substrate separated by the through holes or blind holes, a specific wiring circuit can be formed three-dimensionally over the surfaces of multiple layer members of the insulating substrate. can be formed into

[Example] Next, embodiments of the present invention will be described with reference to the drawings.

1 to 5 show preferred embodiments of the first insulating substrate of the present invention, FIG. 1 is a perspective view thereof, FIG. 2 is a perspective view showing its use, and FIG. 3 is a perspective view showing its use. A plan view showing the state, Fig. 4 is a sectional view taken along line A-A in Fig. 3, and Fig. 5 is a sectional view taken along line B in Fig. 3.
-B sectional view.

The embodiments shown in these figures will be described below.

In the figure, 1-Oa is a ceramic substrate with a single layer structure.

20 is a continuous band-shaped conductor circuit made of tungsten metallization or the like.

A plurality of conductor circuits 20 are arranged in a lattice pattern vertically and horizontally on the front and back surfaces of the substrate 10a. Further, the grid-like conductor circuits 20 on the front and back surfaces of the substrate 103 are formed to have the same shape and the same size, and the conductor circuits 20 on the front and back surfaces of the substrate 108 intersect three-dimensionally and overlap three-dimensionally. ing.

Reference numeral 30 denotes a wire fill, which is a conductor filled with a conductor such as tungsten metallized material. This viafil 30
The substrate tOa is penetrated every other part where the lattice-shaped conductor circuits 20 on the front and back surfaces of the substrate tOa intersect three-dimensionally, and the conductor circuits 20 intersect three-dimensionally.
Every other gap is connected by the via fill 30.

Reference numeral 40 denotes a hole which is an insulator and has a through-hole shape smaller in diameter than the width of the conductor circuit 20. This hole 40 is placed in a portion where the via fill 30 is not provided among the portions where the lattice-shaped conductor circuits 20 intersect in three dimensions on the front and back surfaces of the substrate 10a. A substrate tOa is provided to pass through every other intersection.

The insulating substrate shown in FIG. 1 is constructed as described above, and as shown in FIG. 2 and FIG. It can be separated by etching, etc., or as shown in Figure 4.
Holes 40 at predetermined locations on the substrate 10a are filled with conductors 50 to connect conductor circuits 20 intersecting three-dimensionally at predetermined locations on the front and back surfaces of the substrate 10a, or as shown in FIGS. 4 and 5. , a through hole 60 or a blind hole 70 having a diameter larger or smaller than the width of the conductor circuit 20 is drilled at a predetermined portion of the board 10a from the front or back surface thereof using a drill or the like.
8. The middle part of the conductor circuit 20 at a predetermined portion on the front and back surfaces or one of the surfaces is divided by the through hole 60 or the blind hole 70, or as shown in FIG. The through hole 60 or the blind hole 70 is filled with the conductor 50 or the conductor 50 and the insulator 80 in a layered manner so that the conductor circuits 20 intersect three-dimensionally or the conductor circuits 20 overlap three-dimensionally at predetermined portions on the front and back surfaces of the substrate 10a. Conductor circuits 2 at predetermined locations on the front and back surfaces of the substrate 10a, or on either side of the substrate 10a, which are connected between or separated by the through hole 60 or the blind hole 70.
By connecting the middle portions of the substrate 10a, a specific wiring circuit can be three-dimensionally formed over the front and back surfaces of the substrate 10a.

6 to 1O show other preferred embodiments of the first insulating substrate of the present invention, FIG. 6 is a perspective view thereof, FIG. 7 is a perspective view showing its usage state, and FIG. 8 9 is a sectional view taken along the line CC in FIG. 8, and FIG. 10 is a sectional view taken along the line DD in FIG. 8. The embodiments shown in these figures will be explained below.

In the illustrated insulating substrate, the middle portions 20b of the conductor circuits on the four sides of each grid of the grid-shaped conductor circuits 20 on the front and back surfaces of the ceramic substrate 10b are separated.

The rest of the structure is the same as that of the first insulating substrate of the previously described embodiment, and as shown in FIGS. Part 2
0b with solder 90 or the like, or as shown in FIG. 9, conductors 50 are filled in holes 40 at predetermined portions of the substrate IQb so as to intersect three-dimensionally at predetermined portions on the front and back surfaces of the substrate 10b. To connect between the conductor circuits 20, or as shown in FIG. 7, FIG. 8, or FIG. A hole 60 or a blind hole 70 is drilled, and the conductor circuit 20 at a predetermined portion on the front and back surfaces of the substrate 10b or one of the surfaces is separated by the through hole 60 or the blind hole 70, as shown in FIG. As shown, the conductor 50 is further inserted into the through hole 60 or the blind hole 70 at the predetermined location.
Alternatively, the conductor circuit 2 is filled with a conductor 50 and an insulator 80 in a layered manner and intersects three-dimensionally at a predetermined portion on the front and back surfaces of the substrate 10b.
0 or between conductor circuits 20 that overlap three-dimensionally, or are separated by a through hole 60 or a blind hole 70.
The substrate 10b
A specific wiring circuit can be formed three-dimensionally over the front and back surfaces of the device.

In each of the above-mentioned embodiments, one of the front and back surfaces of the substrates 10a and 10b is provided with a continuous conductor circuit in a grid pattern, and the other surface is provided with a conductor circuit with a part cut in the middle in a grid pattern. Alternatively, the front and back surfaces of the substrates 10a, 10b may be provided with conductor circuits in a lattice shape, each of which is a combination of a continuous conductor circuit and a conductor circuit that is cut in the middle. The intermediate portion of the continuous conductor circuit at a predetermined portion of the surface of the substrate 10a is divided by etching or the like.

It may also be possible to connect intermediate portions of the conductor circuit at predetermined portions on the front and back surfaces of 10b or one of the surfaces with solder or the like.

11 to 15 show preferred embodiments of the second insulating substrate of the present invention, FIG. 11 is an exploded perspective view thereof, and FIG.
13 is a sectional view taken along line EE in FIG. 12, FIG. 14 is a sectional view taken along line FF in FIG. 12, and FIG. 15 is an exploded perspective view thereof. The embodiments shown in these figures will be described below.

In the figure, 10c is a ceramic substrate having a multilayer structure (in the figure, it has a three-layer structure) formed by laminating and firing a plurality of green sheets.

20 is a continuous band-shaped conductor circuit made of tungsten metallization or the like. This conductive circuit 20 is connected to the substrate 1.
Each layer member 100a, 100b, 10 forming 0C
On the 0c surface, a plurality of them are arranged vertically and horizontally in a grid pattern. At the same time, the lattice-shaped conductor circuits 20 on the surface of each layer member are formed to have the same shape and size, and the conductor circuits 20 on the surface of each layer member 100a, 100b, 1ooc intersect three-dimensionally. At the same time, they are made to overlap three-dimensionally.

Incidentally, as shown in FIG. 15, the lattice-shaped conductor circuit 20 on the surface of the layer member 100a exposed to the outside of the substrate 10C may be separated at the middle portions 20b of the conductor circuit on the four sides of each lattice. .

30 is a wire fill filled with a conductor such as tungsten metallization. This Guia foil 30 is applied to every other part where the conductor circuits 20 on the surface of each layer member of the substrate 10c three-dimensionally intersect, each layer member 100a of the substrate,
100c and 100c are provided. and,
Every other conductor circuit 20 intersecting three-dimensionally on the surface of each layer member of the substrate IOC is connected by the diaphragm 30.

In addition, as shown in FIG. 15, the above-mentioned guiafil 30
is provided by penetrating only part of the layer members +00b of the substrate 10c, so that some of the layer members 100b, 100c of the board 10C are provided.
The wire fill 30 may be used to connect only between the conductor circuits 20 that three-dimensionally intersect on the surface or between the conductor circuits 20 that three-dimensionally overlap.

Reference numeral 40 denotes a hole which is an insulator and has a through-hole shape smaller in diameter than the width of the conductor circuit 20. This hole 40 is passed through each layer member 100a, IC) Ob, 100c of the board at every other place where the conductor circuits 20 on the surface of each layer member of the board 10c not provided with the via fill 30 intersect three-dimensionally. I'm ready.

The insulating substrates shown in FIGS. 11 and 15 are constructed as described above, and as shown in FIG. 20b by etching or the like,
As shown in FIG. 15, the midway portions 20b of the conductor circuit at predetermined portions of the surface of the layer member 100a exposed to the outside of the substrate 10c are connected with solder 90 or the like. As shown in the figure, a conductor 50 or a conductor 50 and an insulator 80 are filled in the holes 40 at a predetermined portion of the substrate 10c in a layered manner, and a predetermined portion of the surface of each layer member or a part of the layer member of the substrate 10c is filled. The conductor circuits 20 that intersect three-dimensionally can be connected, or as shown in FIGS. Or, by drilling a small diameter through hole 60 or a blind hole 70,
The conductor circuit 20 can be cut in the middle of a predetermined part of the surface of each layer member or a part of the layer member of the board 10C with the zero or blind hole 70, or as shown in FIG. The through hole 60 or the blind hole 7o is filled with the conductor 50 or the conductor 50 and the insulator 80 in a layered manner to form the substrate 10c.
Connecting conductor circuits 20 that three-dimensionally intersect or three-dimensionally overlap conductor circuits 20 at predetermined portions of the surface of each layer member or a part thereof, or connecting each layer member of the substrate 10C or a part of the layer member thereof. Each layer member 100a of the substrate 10C is connected by connecting the midway portions of the conductor circuit 20 at predetermined portions separated by the through hole 60 or the blind hole 70 on the surface.
, 100b, and 100c, a specific wiring circuit can be three-dimensionally formed.

16 to 19 show other preferred embodiments of the second insulating substrate of the present invention, FIG. 16 is an exploded perspective view thereof, FIG. 17 is a plan view showing its usage state, and FIG. 18 is the 17th
19 is a sectional view taken along line GG in the figure, and FIG. 19 is a sectional view taken along line HH in FIG. 17. The embodiments shown in these figures will be described below.

In the insulated substrate shown in the figure, a conductor circuit 2 is placed in the middle of each of the four sides of each lattice of the lattice-shaped conductor circuit 20 on the surface of each layer member 100a, 100b, 100C forming the ceramic substrate 10d.
A hole 40, which is an insulator having a diameter larger than the width of 0, is formed in each layer member 100a, 100b.

100c is provided through it. The hole 40 divides the conductive circuit 20 on the surface of each layer member of the substrate 10 at the middle of each grid on four sides.

The rest of the structure is the same as that of the second insulating substrate of the previously described embodiment, and as shown in FIG.
0b by etching or the like, or by filling the hole 40 at a predetermined portion of the substrate 10d with a conductor 50 or a conductor 50 and an insulator 80 in a layered manner as shown in FIGS. 18 and 19. Conductor circuits 20 that three-dimensionally intersect at predetermined portions on the surface of each layer member or a part of the layer member of the substrate 10d
Connecting conductor circuits 20 that overlap or three-dimensionally overlapping conductor circuits 20, or connecting conductor circuits 20 at predetermined locations that are separated by holes 40 on the surface of each layer member or a part of the layer member of the substrate 10d. , Figure 17, Figure 18, Figure 1
As shown in FIG. 9, a through hole 60 or a blind hole 70 having a diameter larger or smaller than the width of the conductor circuit 20 is bored at a predetermined portion of the substrate 10d from the front or back surface thereof.
Alternatively, a blind hole 70 may be used to cut off the middle part of the conductor circuit 20 at a predetermined portion on the surface of each layer member or a part of the layer member of the substrate 10d, or as shown in FIG. The conductor 50 or the conductor 50 and the insulator 80 are filled in the hole 60 or the blind hole 70 in a layered manner, and the conductor circuits 20 intersect three-dimensionally at a predetermined portion on the surface of each layer member or a part of the layer member of the substrate 10d. Alternatively, a midway portion of the conductor circuit 20 at a predetermined portion is connected between the conductor circuits 20 that overlap or overlap three-dimensionally, or is separated by the through hole 60 or blind hole 70 on the surface of each layer member or a part of the layer member of the substrate 10d. By connecting each layer member 100a of the substrate 10d,
, 100b, and 1ooc, a specific wiring circuit can be three-dimensionally formed.

In each of the embodiments described above, the lattice-shaped conductor circuits 20 on the front and back surfaces of the substrates 10a and 10b or on the surfaces of each layer member of the substrates toc and 10d are formed so that the lattice sizes are different in size, It may also be formed into a diagonally distorted shape. Then, the substrates 10a, 10... b front and back surfaces or substrate 10c,
A conductive circuit 20 may be formed on the surface of each layer of the lod.

In addition, on the front and back surfaces of the substrates 10a and 1Ob, or on the surface of each layer member of the substrates 10C and 10d, or on the surface of a part of the layer members thereof, diagonally cross the intersection of the lattice-shaped conductor circuits 20 on the surfaces. A more complex high-density wiring circuit can be formed three-dimensionally over the front and back surfaces of the substrates 10c, 10d or the surfaces of each layer member of the substrates IQc, 10d, by providing a continuous conductor circuit or a conductor circuit with a conductor circuit separated in the middle. You can do it like this.

Also, the substrate 10a, the front and back surfaces of the lob, or one of the surfaces thereof, the substrates 10c, 10. The conductor circuit 20 on the surface of each layer member d or a part of the layer member surface is not in a grid shape,
It may be formed into a conductor circuit consisting of a curve such as a circular arc or a series of curves and straight lines, a conductor circuit consisting of a bent straight line or curve, a radial conductor circuit, or the like.

Moreover, when trying to form a simple wiring circuit on the substrates 10a, 10b, 10c, and 10d, the substrate 10a, fob
Conductor circuits 20 are placed on the front and back surfaces or on the surfaces of each layer member of the substrates 10C and lod, so that the conductor circuits 20 on the front and back surfaces of the substrates lQa and 10b or on the surfaces of each layer member of the substrates 10c and lod intersect three-dimensionally, or in a manner that the conductor circuits 20 intersect in three dimensions ( It is also possible to simply form one or more of them in a vertical or horizontal direction so that some of them overlap three-dimensionally.

In addition, the conductor circuits 20 of the substrates 10a, 10b, 10c, and LOD that intersect three-dimensionally or between the conductor circuits 20 that overlap three-dimensionally are connected with a via fill 30 (a conductor layer made of tungsten metallization or the like is formed on the inner peripheral surface). It is possible to connect with a through hole (not shown) which is a conductor provided on the board 10a.
, IOb, IQc, lod holes 40 and substrate 10a,
10b.

A ring-shaped conductor or a ring-shaped conductor and an insulator are filled in the through holes 60 or blind holes 70 drilled in the substrates 10a, 10b, 10c, and 10d to form three-dimensionally intersecting conductors @ Holes 40 can be used to connect conductor circuits 20 that overlap three-dimensionally, or to connect the front and back surfaces of the substrates LOa and 10b, or the surfaces of each layer member of the substrates 10c and LOD, or the surface of a part of the layer members. It is also possible to connect the conductor circuit 20 in the middle where it is divided by the through hole 60 or the blind hole 70.

In addition, the holes 4 of the substrates 10a, 10b, 10c, 10d
0, a conductor circuit 2 different from the hole 40 described above is provided.
The substrate 10a, Job, 1 may have a through-hole or a blind hole with a diameter larger or smaller than the width of
A portion where the conductor circuits 20 of 0c and 10d three-dimensionally intersect or three-dimensionally overlap, and where the above-mentioned hole 40
A through hole or a blind hole having a diameter larger or smaller than the width of the conductor circuit 20 is provided in a portion different from the portion provided with the conductor circuit 20, and the hole is filled with a conductor or a conductor and an insulator in a layered manner. By doing so, the conductor circuits 20 intersecting three-dimensionally or the conductor circuits 20 overlapping three-dimensionally on the front and back surfaces of the substrates lQa and IOb, the surface of each layer member of the substrates 10C and 10d, or a part of the layer member surface thereof can be connected. , it is possible to connect the midway portion of the conductor circuit 20 on the front and back surfaces of the substrates 10a and 10b, or either one of the front and back surfaces of the substrates 10a and 10b, which are separated by the holes, and the surface of each layer member of the substrate 10G and lod, or the surface of a part of the layer member. You can do it like this.

In addition, only one of the guia foil 30 which is a conductor, the through hole, or the hole 4° which is an insulator is provided at the portion where the conductor circuits 20 of the substrates 10a, fob, 10c, and 10d intersect three-dimensionally or overlap three-dimensionally. , or the conductor circuit 20 is provided with a guiafil 30 that is a conductor or a through hole or a hole 40 that is an insulator at every two or more parts where the conductor circuit 20 three-dimensionally intersects or three-dimensionally overlaps, or the conductor circuit 20 The diaphragm 30 which is a conductor, the through hole, or the hole 40 which is an insulator may be provided only in a part of the part where the two three-dimensionally intersect or three-dimensionally overlap.

In addition, in the multilayer structure substrates 10C and 10d, the conductor circuit 20 is provided only on the surface of some of the layer members 100a and 100C, for example, the plurality of layer members 100a and 100C of the substrate.
The substrate 10c is provided so that the conductor circuits 20 on the surface of the substrate 100c intersect three-dimensionally, or so that at least a portion of the conductor circuits 20 on the surface of the plurality of layer members 100a and 100c of the substrate overlap three-dimensionally, and the substrate 10c, A via fill 30 or a through hole or a hole 40 is provided at a portion where the conductor circuits 20 of 10d three-dimensionally intersect or three-dimensionally overlap, and a plurality of layer members 100a, 100C of a part of the substrate 10c, lQd are provided on the surface. Additionally, a specific wiring circuit may be formed three-dimensionally.

Furthermore, the first and second insulating substrates of the present invention can also be used as plastic substrates with a single layer or multilayer structure.

[Effects of the Invention] As explained above, according to the first and second insulating substrates of the present invention, the conductor circuits provided on the front and back surfaces of the substrate or the surfaces of the plurality of layer members of the substrate, and the conductor circuits provided on the substrate. Using viafill or through holes, which are conductors that connect circuits, and holes, which are insulators, specific wiring circuits can be freely formed three-dimensionally over the front and back surfaces of the board or the surfaces of multiple layer members of the board. can.

Therefore, according to the first and second insulating substrates of the present invention, when a specific wiring circuit is formed over the front and back surfaces of the substrate or the surfaces of a plurality of layer members of the substrate, a special A desired specific wiring circuit can be three-dimensionally formed on a substrate without the need for a print mask, via fill, or special mold for forming through holes. Furthermore, it becomes possible to easily and quickly form a single-layer or multi-layer structure insulating substrate having a specific wiring circuit for use in test equipment or for high-mix, low-volume production without incurring any labor or equipment costs.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the first insulating substrate of the present invention, and FIGS. 2, 3, 4, and 5 are a perspective view and a plan view of the insulating substrate of FIG. 1, respectively, showing the state in which it is used. and its Δ-A sectional view and its BB sectional view, FIG. 6 is a perspective view of another first insulating substrate of the present invention, and FIGS. 7, 8, 9, and 10, respectively. FIG. 6 is a perspective view showing the usage state of the insulating substrate, its plan view, its CC sectional view, and its D-D sectional view; FIG. 11 is an exploded perspective view of the second insulating substrate of the present invention; 12, 13, and 14 are a plan view, an E-E sectional view, and an FF sectional view of the insulating substrate shown in FIG. 11, respectively, and FIG. 15 shows another example of the present invention. FIG. 16 is an exploded perspective view of another second insulating substrate of the present invention, and FIGS. 17, 18, and 19 show the use of the insulating substrate of FIG. 16, respectively. A plan view showing the state and its G-G
They are a cross-sectional view and its HH cross-sectional view. 10a, IOb, 10c, 10d=-insulating substrate, 20.
...Conductor circuit, 30...Diafil, 40...
Hole, 50...Conductor, 60...Through hole, 70...
...Blind hole, 80...Insulator.

Claims (3)

[Claims] 1. Continuous conductor circuits or conductor circuits separated in the middle are placed on the front and back surfaces of the insulating substrate so that the conductor circuits on the front and back surfaces of the insulating substrate intersect in three dimensions, or at least one of the conductor circuits on the front and back surfaces of the insulating substrate is placed. The parts of the insulating substrate are provided so that the conductor circuits overlap three-dimensionally, and a conductor is provided in the part where the conductor circuits of the insulating substrate three-dimensionally intersect or three-dimensionally overlap, to connect between the intersecting conductor circuits or between the overlapping conductor circuits. An insulating substrate with a wiring circuit comprising a via fill or through hole, or a hole that is an insulator. 2. Continuous conductor circuits or conductor circuits separated in the middle are placed on the surfaces of multiple layer members of an insulating substrate with a multilayer structure so that the conductor circuits on the surfaces of the multiple layer members of the insulating substrate intersect three-dimensionally, or so that at least a portion of the conductor circuits on the surfaces of the plurality of layer members of the insulating substrate overlap three-dimensionally,
In addition, a via fill or through hole, which is a conductor that connects the intersecting conductor circuits or the overlapping conductor circuits, or insulation is provided in the portion of the insulating substrate where the conductor circuits three-dimensionally intersect or three-dimensionally overlap. An insulating substrate with wiring circuits and holes that form the body. 3. A lattice-shaped conductor circuit is provided with a plurality of conductor circuits on the front and back surfaces of an insulating substrate, or on the surfaces of multiple layer members of an insulating substrate with a multilayer structure.
An insulating substrate having the wiring circuit according to claim 1 or 2.