JPH02142173A - Integrated circuit part and mounting structure thereof - Google Patents
Integrated circuit part and mounting structure thereofInfo
- Publication number
- JPH02142173A JPH02142173A JP29658388A JP29658388A JPH02142173A JP H02142173 A JPH02142173 A JP H02142173A JP 29658388 A JP29658388 A JP 29658388A JP 29658388 A JP29658388 A JP 29658388A JP H02142173 A JPH02142173 A JP H02142173A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- substrate
- board
- circuit component
- networks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 239000003985 ceramic capacitor Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 abstract description 17
- 239000004020 conductor Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、積層型セラミックコンデンサネットワークま
たはインダクタネットワークまたはこれらを一体化した
ものを基板とし、該基板の表面と裏面に厚膜印刷配線を
施し、＃各配線から引き出された端部を、基板側面に施
した外部端子を通して結線してなる集積回路部品と、そ
の取付は基板への実装構造に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention uses a multilayer ceramic capacitor network, an inductor network, or a combination thereof as a substrate, and thick-film printed wiring is applied to the front and back surfaces of the substrate. , # An integrated circuit component formed by connecting the ends drawn out from each wiring through an external terminal provided on the side surface of the board, and its attachment relates to a mounting structure on the board.
（従来の技術）
第５図は従来の積層型セラミラフコンデンサを基板とし
た集積回路部品を示すもので、基板ｌは、誘電体２と複
数組の対をなす内部電極３とからなり、これらによりコ
ンデンサネットワーク２０を構成している。基板ｌの裏
面には、−次導体４、二次導体５、ガラス等の絶縁層６
および抵抗層７からなる抵抗回路２１を形成している。(Prior Art) Fig. 5 shows an integrated circuit component using a conventional multilayer ceramic rough capacitor as a substrate. A capacitor network 20 is configured by the above. On the back side of the substrate l, there are a negative conductor 4, a secondary conductor 5, and an insulating layer 6 made of glass or the like.
A resistive circuit 21 is formed of the resistive layer 7 and the resistive layer 7.
基板ｌの表面にはランド８を形成し、ラント８にトラン
ジスタあるいはＩＣ等の電子部品９の端子ｌＯを半田１
１により接続して゛電子部品９を搭載している。基板１
の側面には、内蔵コンデンサと電子部品９．あるいは抵
抗回路２１とを接続する複数個の外部端子電極１２を形
成している。また、取付は基板１３に実装する場合１図
示のように、Ｍ抗回路形成面を取付は基板１３側に対面
させ、取付は基板１３の導体パターン１４に外部端子電
極１２のうちの所定のものを半ｌ１１１１によって接続
している。A land 8 is formed on the surface of the substrate l, and a terminal lO of an electronic component 9 such as a transistor or an IC is connected to the land 8 with solder 1.
1, and an electronic component 9 is mounted thereon. Board 1
Built-in capacitors and electronic components 9. Alternatively, a plurality of external terminal electrodes 12 are formed to connect to the resistance circuit 21. In addition, when mounting on the board 13, as shown in Figure 1, the M anti-circuit forming surface faces the board 13 side, and a predetermined one of the external terminal electrodes 12 is mounted on the conductor pattern 14 of the board 13. are connected by half l1111.
第６図は従来の集積回路部品の他の実装構造を示す図で
あり、アルミナ等の基板１５の表裏面にｔｃ７の゛電子
部品１６．１７を搭載し、基板１５をリート１８を介し
て取付は基板１３に取付けている。FIG. 6 is a diagram showing another mounting structure of conventional integrated circuit components, in which electronic components 16 and 17 of TC7 are mounted on the front and back surfaces of a substrate 15 made of alumina, etc., and the substrate 15 is attached via a REIT 18. is attached to the board 13.
（発明か解決しようとする課題）
第５図に示した集積回路部品は、電子部品９を搭載する
基板ｌ自体かコンデンサネットワークであることと、基
板１の内面に導体配線を行ない。(Problem to be Solved by the Invention) The integrated circuit component shown in FIG. 5 is a capacitor network on which the electronic component 9 is mounted on the substrate 1 itself, and conductor wiring is provided on the inner surface of the substrate 1.
裏面に抵抗回路を形成していること等により実装密度を
上げている。The packaging density is increased by forming a resistance circuit on the back side.
ここで、このような集積回路部品を２個使用するような
回路、例えばステレオ再生装置の左右のチャンネル回路
のように、同じ回路を２回路必要とする場合、２つの集
積回路部品を取付は基板１３に取付けなければならず、
前記のような構造によって実装密度を上げても、なおそ
の２倍の部品スペースが必要なことに変わりはないとい
う問題点があった。Here, if a circuit that uses two such integrated circuit components requires two circuits of the same circuit, such as the left and right channel circuits of a stereo playback device, the two integrated circuit components should be mounted on the board. Must be attached to 13,
Even if the packaging density is increased by the structure described above, there is a problem in that twice as much component space is still required.
そこで第６図の回路構成を採用し、基板１５の表裏面に
同し電子部品１６．１７を搭載することが考えられるが
、基板１５の裏面に搭載した部品１６．１７が取付は基
板１３に当接しない程度のスペースを必要とし、高さ方
向の寸法が大きくなるという問題点かあった。Therefore, it is possible to adopt the circuit configuration shown in FIG. 6 and mount the same electronic components 16 and 17 on the front and back surfaces of the board 15, but the components 16 and 17 mounted on the back surface of the board 15 are not attached to the board 13. There was a problem in that it required a sufficient amount of space so that they would not touch each other, and the height dimension increased.
本発明は、上記従来技術の問題点に鑑み、２つの同じ回
路を構成する場合、集積回路部品の寸法および実装スペ
ースを最小限にしうる構造の集積回路部品とその実装構
造を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, an object of the present invention is to provide an integrated circuit component and its mounting structure that can minimize the size and mounting space of the integrated circuit component when two identical circuits are configured. shall be.
（課題を解決するための手段）
未発１ノは、上記の目的を達成するため、植層型セラミ
ックコンデンサネッｌ−ワークまたはインダクタネット
ワークもしくはこれらを重ねたものを基板とし、該基板
の表面と裏面にＮ−膜印刷配線を施し、該各配線から引
き出された端部を、基板側面に施した外部端子を通して
結線してなる集積回路部品において、前記基板内に同じ
機能を有する２組のネットワークを内蔵し、各ネットワ
ークに接続される外部端子電極を、前記基板の側面部に
交互に配設したことを特徴とする。(Means for Solving the Problem) In order to achieve the above-mentioned purpose, the undeveloped method uses a layered ceramic capacitor network, an inductor network, or a stack of these as a substrate, and a surface of the substrate In an integrated circuit component in which N-film printed wiring is applied to the back surface and the ends drawn out from each wiring are connected through external terminals applied to the side surface of the substrate, two sets of networks having the same function are provided in the substrate. It is characterized in that external terminal electrodes connected to each network are alternately arranged on the side surface of the substrate.
また１本発明は、萌記各ネ・ントヮークに接続される電
子部品を、前記基板の表面および裏面にそれぞれ搭載し
、このような集積回路部品を実装する取付は基板に、集
積回路部品よりやや小さな穴を設け、該穴内に前記基板
の片面側の電子部品を挿入して集積回路部品を取付は基
板に実装したことを特徴とする。In addition, in the present invention, electronic components to be connected to each network are mounted on the front and back surfaces of the substrate, and the mounting of such integrated circuit components is carried out on the substrate slightly more than the integrated circuit components. The present invention is characterized in that a small hole is provided, and an electronic component on one side of the substrate is inserted into the hole to mount the integrated circuit component on the substrate.
また本発明は、前記ノ、（板内に同じ機能を有する２組
のネットワークを内蔵し、各ネットワークにｖｉ続され
る外部端７−電極を、前記基板の側面部に基板の厚さ方
向に分割して配設し、また、必要に応じて基板の表裏面
に各ネットワークに接続される電子部品を搭・成して集
積回路部品を構成し、方４該集積回路部品を実装する取
付けＪ、’；板に、集積回路部品よりやや大きい穴を、
没け、該穴内に前記基板を挿入して集積回路部品を取付
は基板に実装したことを特徴とする。Further, the present invention provides the above-mentioned feature (2 sets of networks having the same function are built into the board, and an external end 7-electrode connected to each network is provided on the side surface of the board in the thickness direction of the board. Method 4: Mounting the integrated circuit components by dividing and arranging them, and, if necessary, mounting electronic components connected to each network on the front and back surfaces of the board to form integrated circuit components. ,';Cut a hole in the board that is slightly larger than the integrated circuit component,
The integrated circuit component is mounted on the board by inserting the board into the hole.
（作用）
本発明の集積回路部品の構造においては、２組の回路を
１つの基板内に内蔵し、かつ電子部品を基板の表面に搭
載したので、同じ回路を２つ備える場合、実装面積が従
来の１／２てすむ。(Function) In the structure of the integrated circuit component of the present invention, two sets of circuits are built into one board, and the electronic components are mounted on the surface of the board, so when two of the same circuits are provided, the mounting area is reduced. It takes 1/2 the time of the conventional one.
また、集積回路部品よりやや小さい穴を取付は基板に設
け、その中に基板片面の゛電子部品を挿入して実装する
構造においては、取付は基板からの高さ方向についての
集積回路部品の突出幅か小となる。In addition, in a structure in which a hole that is slightly smaller than the integrated circuit component is provided on the board, and the electronic component on one side of the board is inserted and mounted into the hole, the integrated circuit component protrudes from the board in the height direction. Width or small.
また、取付は基板に集積回路部品よりやや大きい穴を設
け、その穴に基板を挿入して実装する構造においては、
取付は基板からの集積回路部品の突出幅をさらに小とす
ることかてきる。In addition, in a structure where mounting is done by creating a hole in the board that is slightly larger than the integrated circuit component, and then inserting the board into that hole,
Mounting can be accomplished by further reducing the protrusion width of the integrated circuit component from the board.
（実施例）
第１図は本発明の一実施例を、集積回路部品の取付はノ
＾板への実装状ＩＥて示す断面ｌ″Ｌ第２１’４はその
分解斜視図である。ノ＾板ｌＡは、前記従来例と異なり
、−ヒート２組のコンデンサネットワーク２０ａ、２０
ｂを構成する内部電極３ａ、３ｂを、誘電体２内に内蔵
した形て有し、また、抵抗回路２１ａ、２１ｂは、それ
ぞれコンデンサネットワーク２０ａ、２０ｂに対応して
、基板ＩＡの図面上］−下面に形成し、トランジスタや
ＩＣ等の電子部品９ａ、９ｂも、それぞれ、コンデンサ
ネットワーク２０ａ、２０ｂに対応して、基板ＬＡの表
裏面に、ラン１−８に端子１０をｆ田１１によって接続
することにより、搭載している。(Embodiment) Fig. 1 shows an embodiment of the present invention, and cross section 1''L 21'4 is an exploded perspective view of the mounting of integrated circuit components on a board. The plate 1A differs from the conventional example in that it includes two heat capacitor networks 20a, 20;
The internal electrodes 3a and 3b constituting the circuit board IA are built into the dielectric 2, and the resistance circuits 21a and 21b correspond to the capacitor networks 20a and 20b, respectively, on the drawing of the board IA]- Electronic components 9a and 9b such as transistors and ICs are formed on the lower surface, and terminals 10 are connected to runs 1-8 on the front and back surfaces of the substrate LA by f-fields 11, corresponding to capacitor networks 20a and 20b, respectively. Therefore, it is equipped.
また、各コンデンサネットワーク２０ａ、２０ｂと、こ
れらにそれぞれ対応した抵抗回路２１ａ、２１ｂ、およ
び′重子部品９ａ、９ｂとを接続する外部端子電極は、
第２図に示すように、し′４面一に］一方のコンデンサ
ネットワーク２０ａに対応した外部端子電極１２ａと、
図面上下方のコンデンサネットワーク２０ｂに対応した
外部端子電極１２ｂとか、基板ＩＡの側面に周方向に交
互に配設される。なお、この交り一装置は、図示のよう
な１個ごとの交Ｗ配置ではなく、２個以１−の交互配置
としても良い。Further, the external terminal electrodes connecting each capacitor network 20a, 20b, the corresponding resistance circuit 21a, 21b, and the heavy element components 9a, 9b are as follows:
As shown in FIG. 2, an external terminal electrode 12a corresponding to one capacitor network 20a, and
External terminal electrodes 12b corresponding to the capacitor networks 20b in the upper and lower portions of the drawing are arranged alternately in the circumferential direction on the side surface of the substrate IA. Note that this intersecting device may not be arranged one by one as shown in the figure, but may be arranged alternately with two or more intersecting devices.
このような構造とすれば、第２図に示す縦横のｌ１ｌｒ
Ｉｌａ、ｂは従来と同様で良く、２個の回路か１つにま
とめられ、約１／２の占有面積ですむ。If such a structure is used, the vertical and horizontal l1lr shown in Figure 2
Ila and b may be the same as conventional ones, and two circuits can be combined into one, which occupies approximately 1/2 the area.
また、第２図に示すように、プリント基板等でなる取付
はノ、（板１３には、基板ＩＡよりやや小さい穴２２
（ａ＞ｃ、ｂ＞ｄ）を設け、穴２２の周辺には、前記外
部端子電極１２ａ、１２ｂにそれぞれ接続する必要のあ
る導体パターン２３ａ、２３ｂが形成され、第１図に示
すように、基板ＩＡの裏面の電子部品９ｂを穴２２内に
挿入した状７ｇで取付は基板１３に搭載し、それぞれ取
付は基板１３上の導体パターン２３ａ、２３ｂに外部端
子電極１２ａ、１２ｂをそれぞれ半田１１により接続す
る。In addition, as shown in Fig. 2, when mounting with a printed circuit board, etc., (the board 13 has a hole 22 that is slightly smaller than the board IA).
(a>c, b>d), and conductor patterns 23a and 23b that need to be connected to the external terminal electrodes 12a and 12b, respectively, are formed around the hole 22, as shown in FIG. The electronic component 9b on the back side of the board IA is inserted into the hole 22 and mounted on the board 13, and the external terminal electrodes 12a and 12b are attached to the conductor patterns 23a and 23b on the board 13 by soldering 11, respectively. Connecting.
この構造によれば、取付は基板１３から電子部品９ａの
に而まての突出幅か少なくてすむ。According to this structure, the protrusion width of the electronic component 9a from the board 13 can be reduced for mounting.
第３図およびｉ ４１ｉＩは本発明の他の実施例であり
、コンデンサネットワーク２０ａ、２０ｂに接続される
外部端７−電極１２ｃ、１２ｄを、基板ＩＢの側面部に
基板ＩＢの厚さ方向に分割して配置没すると共に、各コ
ンデンサネットワーク２゜ａ、２０ｂに接続される電子
部品９ａ、９ｂを、前記同様に基板ＩＢの表面および裏
面にそれぞれｐＳ佐して集積回路部品を構成し、一方、
第４図に示すように、該集積回路部品を実装する取付は
基板１３に、集積回路部品よりやや大きい穴２４を設け
（ａ＜ｅ、ｂ＜ｆ）、該穴２４内に前記基板ＩＢを挿入
し、取付は基板１３の表裏面にそれぞれ形成した導体パ
ターン２３ｃ、２３ｄを対応する外部端子電極１２ｃ、
１２ｄに半ＩＴＩ ｌ １により接続したしのである。3 and 41iI show another embodiment of the present invention, in which the external ends 7--electrodes 12c, 12d connected to the capacitor networks 20a, 20b are divided in the thickness direction of the substrate IB on the side surface of the substrate IB. The electronic components 9a and 9b connected to the capacitor networks 2a and 20b are placed on the front and back surfaces of the board IB in the same manner as described above to form an integrated circuit component.
As shown in FIG. 4, in order to mount the integrated circuit component, a hole 24 that is slightly larger than the integrated circuit component is provided in the board 13 (a<e, b<f), and the board IB is mounted in the hole 24. The conductor patterns 23c and 23d formed on the front and back surfaces of the board 13 are inserted and attached to the corresponding external terminal electrodes 12c,
12d by a half ITI l1.
この構造によれば、第２図の゛実施例に比較し、取付は
基板１３からの′電子部品９ａのＬ面または９ｂのド面
まての突出幅か小となる。According to this structure, compared to the embodiment shown in FIG. 2, the protrusion width of the electronic component 9a from the substrate 13 to the L side or the dot side of the electronic component 9b is smaller.
１−記実施例においては、基板内にコンデンサネットワ
ークのみか内蔵されている例について示したか、本発明
は、基板内にインダクタネウトワークか単独、またはコ
ンデンサネットワークと一体に内蔵されるものについて
も適用てきる。また、基板の表裏面に電子部品９ａ、９
ｂを設けないものとして構成することも可能である。1- In the embodiment described above, an example is shown in which only a capacitor network is built into the board, but the present invention is also applicable to an inductor network built into the board alone or integrated with a capacitor network. I'll come. In addition, electronic components 9a and 9 are provided on the front and back surfaces of the board.
It is also possible to configure the device without b.
（発明の効果）
請求項１の集積回路部品によれば、同じ機能を有する２
組の回路を１つの基板内に内蔵したのて、同し回路を２
つ備える場合、実装面桔か従来の１／２ですむ。従って
小型、軽量の集積回路部品を提供することかできる。(Effect of the invention) According to the integrated circuit component of claim 1, two devices having the same function
A set of circuits is built into one board, and the same circuit is connected to two
If one is provided, the mounting surface size can be reduced to 1/2 of the conventional size. Therefore, it is possible to provide small and lightweight integrated circuit components.
請求項２の実装構造によれば、前記実装部活の減少に加
え、取付は基板からの高さ方向についての集積回路部品
の突出幅か小となり、これらのことから、集積回路部品
を取付ける機器の小型、軽研化に益する。According to the mounting structure of claim 2, in addition to the reduction in the mounting work, the protrusion width of the integrated circuit component in the height direction from the board is also reduced, and for these reasons, the mounting structure of the device on which the integrated circuit component is mounted is reduced. Small size, beneficial for light research.
請求項３の実装構造によれば、取付は基板からの集積回
路部品の突出幅かさらに小となり、集積回路部品を取付
ける機器の小型、軽罎化のヒてさらに有効である。According to the mounting structure of the third aspect, the protruding width of the integrated circuit component from the substrate can be further reduced during mounting, making it even more effective to reduce the size and weight of the equipment to which the integrated circuit component is attached.
請求項４の実装構造によれば、集積回路部品の基板から
の突出幅を小さくする効果をさらに高めることかできる
。According to the mounting structure of the fourth aspect, the effect of reducing the protrusion width of the integrated circuit component from the substrate can be further enhanced.
第１！ＬＡは本発明の集積回路部品およびその実装構造
の一実施例を示す断面Ｆ′３４、第２図はその分解斜視
ｌＡ、第３図は本発明の集積回路部品の実装構造の他の
実施例を示す断面図、第４図はその分解斜視図、第５図
は従来の集積回路部品およびその実装構造を一例を示す
断面図、第６図は従来の集積回路部品およびその実装構
造の他の例を示す側面図である。1st! LA is a cross section F'34 showing one embodiment of the integrated circuit component and its mounting structure of the present invention, FIG. 2 is an exploded perspective view IA thereof, and FIG. 3 is another embodiment of the integrated circuit component mounting structure of the present invention. 4 is an exploded perspective view thereof, FIG. 5 is a sectional view showing an example of a conventional integrated circuit component and its mounting structure, and FIG. 6 is another example of a conventional integrated circuit component and its mounting structure. It is a side view which shows an example.
Claims (4)
ンダクタネットワークもしくはこれらを一体化したもの
を基板とし、該基板の表面と裏面に厚膜印刷配線を施し
、該各配線から引き出された端部を、基板側面に施した
外部端子電極を通して結線してなる集積回路部品におい
て、前記基板内に同じ機能を有する２組のネットワーク
を内蔵し、各ネットワークに接続される外部端子電極を
、前記基板の側面部に交互に配設したことを特徴とする
集積回路部品。1. A multilayer ceramic capacitor network, an inductor network, or a combination of these is used as a substrate, thick-film printed wiring is applied to the front and back sides of the substrate, and the ends drawn out from each wiring are connected to an external layer formed on the side of the substrate. An integrated circuit component formed by connecting wires through terminal electrodes, wherein two sets of networks having the same function are built into the substrate, and external terminal electrodes connected to each network are arranged alternately on the side surface of the substrate. An integrated circuit component characterized by:
に接続される電子部品を，前記ネットワークを内蔵した
基板の表面および裏面にそれぞれ搭載し、集積回路部品
を実装する取付け基板に、集積回路部品よりやや小さな
穴を設け、該穴内に前記基板の片面側の電子部品を挿入
して集積回路部品を取付け基板に実装したことを特徴と
する集積回路部品の実装構造。2. Electronic components connected to each of the two networks incorporated in the substrate of claim 1 are mounted on the front and back surfaces of the substrate containing the networks, respectively, and the integrated circuit components are mounted on the mounting substrate on which the integrated circuit components are mounted. A mounting structure for an integrated circuit component, characterized in that the integrated circuit component is mounted on the mounting board by providing a slightly smaller hole and inserting the electronic component on one side of the board into the hole.
ンダクタネットワークもしくはこれらを一体化したもの
を基板とし、該基板の表面と裏面に厚膜印刷配線を施し
、該各配線から引き出された端部を、基板側面に施した
外部端子電極を通して結線してなる集積回路部品におい
て、前記基板内に同し機能を有する２組のネットワーク
を内蔵し、各ネットワークに接続される外部端子電極を
、前記基板の側面部に基板の厚さ方向に分割して配設し
て集積回路部品を構成し、一方、該集積回路部品を実装
する取付け基板に、集積回路部品よりやや大きい穴を設
け、該穴内に前記基板を挿入して集積回路部品を取付け
基板に実装したことを特徴とする集積回路部品の実装構
造。3. A multilayer ceramic capacitor network, an inductor network, or a combination of these is used as a substrate, thick-film printed wiring is applied to the front and back sides of the substrate, and the ends drawn out from each wiring are connected to an external layer formed on the side of the substrate. In an integrated circuit component formed by connecting wires through terminal electrodes, two sets of networks having the same function are built into the substrate, and external terminal electrodes connected to each network are attached to the side surface of the substrate by the thickness of the substrate. An integrated circuit component is constructed by dividing and arranging the integrated circuit component in one direction, and on the other hand, a mounting board on which the integrated circuit component is mounted is provided with a hole slightly larger than the integrated circuit component, and the board is inserted into the hole to form an integrated circuit component. A mounting structure for integrated circuit components, characterized in that the components are mounted on a mounting board.
ワークに接続される電子部品を、前記基板の表面および
裏面にそれぞれ搭載したことを特徴とする集積回路部品
の実装構造。4. 4. The integrated circuit component mounting structure according to claim 3, wherein electronic components connected to each network built into the substrate are mounted on the front and back surfaces of the substrate, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29658388A JP2656585B2 (en) | 1988-11-23 | 1988-11-23 | Integrated circuit components and their mounting structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29658388A JP2656585B2 (en) | 1988-11-23 | 1988-11-23 | Integrated circuit components and their mounting structures |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02142173A true JPH02142173A (en) | 1990-05-31 |
| JP2656585B2 JP2656585B2 (en) | 1997-09-24 |
Family
ID=17835427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29658388A Expired - Fee Related JP2656585B2 (en) | 1988-11-23 | 1988-11-23 | Integrated circuit components and their mounting structures |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2656585B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5604328A (en) * | 1992-07-27 | 1997-02-18 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
| US5635669A (en) * | 1992-07-27 | 1997-06-03 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
| US6031726A (en) * | 1995-11-06 | 2000-02-29 | Vlt Corporation | Low profile mounting of power converters with the converter body in an aperture |
| US6434005B1 (en) | 2000-10-27 | 2002-08-13 | Vlt Corporation | Power converter packaging |
| US7361844B2 (en) | 2002-11-25 | 2008-04-22 | Vlt, Inc. | Power converter package and thermal management |
-
1988
- 1988-11-23 JP JP29658388A patent/JP2656585B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5604328A (en) * | 1992-07-27 | 1997-02-18 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
| US5635669A (en) * | 1992-07-27 | 1997-06-03 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
| US5635670A (en) * | 1992-07-27 | 1997-06-03 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
| US6031726A (en) * | 1995-11-06 | 2000-02-29 | Vlt Corporation | Low profile mounting of power converters with the converter body in an aperture |
| US6434005B1 (en) | 2000-10-27 | 2002-08-13 | Vlt Corporation | Power converter packaging |
| US7361844B2 (en) | 2002-11-25 | 2008-04-22 | Vlt, Inc. | Power converter package and thermal management |
| US7799615B2 (en) | 2002-11-25 | 2010-09-21 | Vlt, Inc. | Power converter package and thermal management |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2656585B2 (en) | 1997-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |