JPH02140988A - Printed wiring board and manufacture thereof - Google Patents

Abstract

PURPOSE: To reduce the time for manufacturing a wiring board product by forming mesh-shaped equally positioned and formed metal plating wires on both sides of a material board while crossing, and forming a through-hole, to which a metal plating layer is formed, connected and conducted with the metal wires on the front and rear sides through the surface of an inner wall. CONSTITUTION: A large number of metal plating wires 4 are formed on both the front and rear sides of a material board, which is formed from a non- conductive materials, while crossing in the shape of mesh having the same position and the same form on the front and rear sides. At the sections of these metal plating wires 4, numerous through-holes 2 are formed at prescribed arranged intervals, while forming a metal plating layer 5 communicating with the metal plating wires 4 on both the front and rear sides on the surface of the inner wall. Therefore, when forming a required circuit while using this board, it is sufficient to merely cut the required section of metal wires into independent wire blocks. Thus, the time for manufacturing the wiring board product can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Application of Tojo The present invention provides a printed wiring board X2 which is useful for use in various printed wiring boards used in the electronic industry, especially for experimental use. It's about the board.

Currently, the electronics industry is developing at a remarkable rate, and manufacturers are continuously focusing on developing new products one after another. However, in the process of starting ryR, testing and improvement are extremely important. Therefore, test circuit boards are one of the indispensable test tools in the electronic industry.

In addition to the above, test wiring boards are also very important for students in electronics-related subjects and related subjects, and for these students, circuit testing is important, so test wiring boards are This is for the most basic experimental use.

Currently, there are three types of wiring boards for testing. Part 1 is Br
ead Board (sleeping board), part 2 is -e
lding Versatile [1oard (the one with the hanger is a multi-use board) - Part 3 is the old ring Ver.
This is a satile board (a board with a lot of wiring). These 311M test wiring boards are generally known.

<Problems to be Solved by the Invention> However, these conventionally known test wiring boards each have advantages and disadvantages. In detail below: () Bread Board ([1 board) Features: 1
0 Good repeatability, low cost 2. Easy to remove and correct mistakes.

Disadvantages: 10 Due to its large volume, it cannot be installed on machines or products for testing.

2. Installing circuit parts by hand This saves time and effort as it connects Ru.

3. Since there is only one big item, it is duplicated. You must reconnect when you Must be.

(D) Welding Versatile Boa
rd (The one with a hanger is a multi-use board) Features: 12 Small volume and low cost.

Disadvantages: Requires 10 people to hang it by hand, which takes time and effort.

2. It is difficult to remove or correct mistakes.

3. Circuit sheeting is likely to occur.

4. Since there is only one actual item, this is When duplicated, the new hanging must add a line.

(3) WiriB Versatile Board
(Wiring-intensive board) Waiting: 1. No soldering required.

Lack i, :i, Cost is high (, Volume is large.

2. The lines must be connected manually It won't happen.

3. Since there is only one real item, there are no duplicates. When you want a new wire, connect a new wire. must continue.

Therefore, the present invention provides such conventional i! In order to solve this problem, mesh-like metal plated wires in the same position and shape are formed in a cross pattern on both sides of the material substrate, and a metal plating layer that connects and conducts with the metal wires on the front and back sides is applied to the inner wall surface. By using a printed circuit board with through-holes formed through it, and using this board to cut out the metal wire layer in areas unnecessary for circuit formation,
An object of the present invention is to provide a printed wiring board on which an independent linear block circuit which is electrically non-conductive is formed, and a manufacturing method thereof.

Means for Solving the Problem> The structure of the present invention for achieving the object will be explained using FIGS. 1 to 3 corresponding to the embodiment.
The vI structure of the printed wiring board of the invention is such that a large number of metal plated IQ stripes (4) are arranged in the same position and in the same shape on both the front and back surfaces of the material substrate (1) made of a non-conductive material. The metal plated filaments (4)...
These metal plated lines (4) and (4
) through-holes (2) formed on the inner wall surface with metal plating layers (5) that communicate with The structure is such that a large number of through holes are formed at each interval.

In addition, as shown in FIGS. 5 and 6, (i) using the printed wiring board, the metal plated wires (4) on the same parts of the front and back sides of the board (A) are partially cut transversely ( 3)...a large number of independent linear blocks (2) containing at least two through holes (2), (2)...
6)... may be formed (ii) The plating thickness of the metal plated filament (4) may be the same on the front and back sides, or may be different thicknesses.

(iii) The plating thickness of the metal plated wire (4) and the thickness of the plating layer (5) on the inner wall surface of the through hole (2) may be the same or may be different.

Further, in the method for manufacturing a printed wiring board, which is an invention of a method, the method for forming the cut WS portion (3) of the metal wire (4) is a manufacturing method using a cutting tool, a cutter, a cutting tool, or a computer cutting system. Furthermore, as another method, as shown in FIGS. 9 and 10, a manufacturing method using chemical action as a means for forming the cut portion (3) of the metal wire (2) may be used.

Effect> Since the printed wiring board of the first invention has the above-mentioned 1iIII structure, plating is applied to the inner wall surfaces of all the holes in the wiring board into which electronic components are inserted, and all through-holes are plated. The hole and the metal wire are in a state where they can be electrically connected. Therefore, in order to form the required circuit using this, the required portion of the metal wire is cut with a tool such as a cutter, and the metal wire is made into an independent wire block with two or more through holes. Just let it happen.

In addition, the cut II portion can also be formed by chemical means such as etching to dissolve unnecessary portions of the gold R filament.

By cutting the unnecessary portions of the metal wires in this way and properly laying out the circuit, the necessary wiring board can be obtained.

<Example> Embodiments of the present invention will be described below based on the drawings.

Figures 1 to 3 in the drawings show the wiring board (A) of the first invention.
Figure 1 shows a basic example of Bakelite,
・A large number of parallel metal wires (4) formed in a mesh shape on the first surface (surface) of a material substrate (1) made of a non-conductive material such as synthetic U1 resin... and these metal wires ( 4)...
It shows the distribution state with a large number of through holes (2) located above, and the X! w Xi+1. . . . are parallel metal wires formed in the horizontal direction in the figure, and Y i =
Y i + 1 t..., etc. are parallel metal wires formed in the same longitudinal direction.

Each of these filaments is formed on the back surface of the material substrate (1) at the same position and in the same shape as on the front surface.

A hole for inserting a leg of an electronic component is formed at every other intersection among the intersections of the longitudinal and lateral lines.

As shown enlarged in FIGS. 2 and 3, each of these formulas has metal plating (5) applied to its inner wall surface, and each metal plating layer (5) is attached to the material substrate (1). Through-holes (2) are formed on both sides of the metal wires (4) to be electrically connected to each other.

FIG. 4 is an example of a simple electric circuit in which two capacitors (40), (41) and two resistors (50), (51) are installed.

Figures 5 and 6 show the implementation of a wiring board product (8) in which the electric circuit shown in Figure 4 of Moeki is formed using the basic wiring board (A) shown in Figures 1 to 3 above. Figure (3) shows the cut portion where the metal wire (4) was cut out on the tjS1 surface (front surface) of the material substrate (1), and all the cut portions ( 3) is cut in the same way on both sides (not shown).

In this way, a wiring board product (It) in which a predetermined circuit is formed using the wiring board (A) shown in FIGS. 1 to 3 is obtained.

In practice, the alignment of the upper and lower surfaces of two or more through holes (2) (the upper and lower surfaces of the wiring board (A)) is made using metal wire (
Coordinate values can be given in advance so that the predetermined length portions of 4) can be made independent to form independent linear blocks (6). When connecting one circuit, first make a soufflé hole (
2), select the cutting point (3) to be cut depending on the circuit connection situation, and set these coordinate values to a separately designed Hunbueter cutting point.
Key in to the system. The system has vertical and horizontal controls according to the keyed-in coordinate values 6. When working, just place the wiring board (A) in the specified position of the system, turn on the switch, and the cutter of the system will automatically operate. Cut the specified location point.

In addition, the above computer cutting system uses one X-pongee motor and one Y-sleeve motor to move the X-axis and YIIII for one cutter.
1111. The X-sode and Y-tsumugi motors are all step motors, and when reproducing them, they are obtained from the keyed-in data. The addresses where there is a possibility of cutting of the wiring board (1) are set in advance by the X) @ mark and Y1 in the rectangular coordinate system.
! Give the material for mark A, and decide on one starting point (origin of coordinates, α). In this way, the layout of the circuit determines which address points should be cut and stores that material (including X- and Y-axis material) in the system's "cutting memory." , the cutter is A of the "cutting memory"
Every time the material of the address is read and one cutting is performed, the material of the A+1 address is immediately read and the second cutting is performed. Continue cutting in this way until all the materials stored in the "cutting memory" have been read.

In addition to the above-mentioned ) and the cutting at the cutting point.In this, the "up and down mechanism" may be a motor or TsureMade, which raises the cutter when cutting (
(moves away from the wiring group JIi (A)) or lowers (contacts the wiring board (A)). The ``vibration mechanism'' is when the cutter is lowered (when it comes into contact with the wiring board (A)).
It has a function of cutting the metal wire (2) by vibrating the cutter.

The above is an explanation of the mechanism that performs sequential cutting operations in a computer cutting system, and it is clear that if these key mechanisms are combined and controlled by a microcomputer, a comprehensive system can be easily completed. be.

Although the above-mentioned combinator cutting system is large-scale in order to form the cut portion (3) that constitutes a predetermined electric circuit, another simple metal wire cutting system is shown in FIGS. 9 and 10. There is a chemical treatment method shown in the figure.

As an example, as shown in FIG.
Cover the area other than the cut point (3) in 4) with resist (9) (cross #+#1 area), then immerse it in an etching solution or apply it to the entire surface so that it is not covered with lenost. There is a method for obtaining a wiring board product (B) by dissolving and washing the metal wire (4) portion and removing it. This method requires simple equipment and is suitable for small-scale, low-volume production.
There is an advantage that the cut portion (3) of the metal wire (4) can be easily formed.

The present invention provides an improved wiring board, a wiring board product in which a predetermined circuit is formed using the same, and a method for manufacturing the same. Since this invention does not relate to a computer cutting system, a description of the hardware of the cutting system and the software combined therewith will be omitted.

Figures 7 and 8 show the wiring board (A) shown in Figures 1 to 3.
), and FIG. 7 is a diagram showing different embodiments of the metal wires (4), except for the crossing position (through the straight part (4a)).
An example of a structure in which holes (2) are formed is shown in Fig. 8, in which a chamfered countersunk hole (2a) with a hanger is formed on the back side of each through hole (2), and an electronic An embodiment is shown in which soldering of component legs is made easy.

The thickness of the metal wire may be the same on the front and back sides, or it may be of different thickness.Also, the thickness of the metal plating layer on the inner wall of the through hole may be compared to the thickness of the metal wire. They may have the same thickness, or they may have different thicknesses.

Although the embodiments considered to be representative of the present invention have been described above, the present invention is not necessarily limited to the structure and method of these embodiments. It can be implemented with appropriate modifications within the scope of achieving the purpose and having the following effects.

<Effects of the Invention> As is already clear from the above description, the present invention provides an improved wiring board, a wiring board product in which a predetermined circuit is formed using the same, and a method for manufacturing the same. Therefore, the effects and features of the present invention will be clear if the above explanation is taken into account, but they will be itemized as follows.

(-) As you can see from the layout method of the wiring board above, this is a matrix type, and each two through holes have one metal wire passing through them, and at the same time both vertical and horizontal Since the metal wires are formed independently on both the front and back surfaces, and are electrically connected through each through hole, the layout density per unit area can be significantly increased.

(d) After the metal wires of the wiring board are cut and blocks of independent wires are formed, many scraps of gold 1 and wires are left behind, but if these scraps are used as ground wires, A wiring board product with very good noise isolation circuitry can be obtained.

(3) It can significantly save time in manufacturing wiring board products;
Easy to make.

(4) Since the cost is low, it is suitable for manufacturing small quantities of wiring board products used in laboratories.

(5) Since there are not many soldering contacts, it is easy to inspect and modify, and the appearance is simple, and the soldering does not feel messy like a board that is often used.

(6) In addition to cutting the metal wire with a cutter, other methods such as chemical methods can be used to break part of the metal wire to create specific through holes independently or in several specific through holes. It can be electrically connected to the hole.

We have come to expect the remarkable effects mentioned above.

FIG. 10 is an enlarged plan view of the main part of the wiring board showing the circuit forming method over time.

In the figure, (1) is the material substrate, (2) is the through hole, (
3) is the cut portion of the metal wire, (4) is the metal wire, (5) is the metal plating ffi in the through hole, (6) is the wire block, and (A) is the wiring board.

[Brief explanation of the drawing]

Figures tI%1 through Figure 3 show basic embodiments of the wiring board, and Figure 1 is an overall plan view showing the distribution of metal wires and through holes on the wiring board. fjS2 figure is an enlarged plan view of the same main part, and figure 3 is ■-■ in figure 2.
The line cross-sectional view and tJS4 diagram are circuit diagrams, Figures 5 and 6 show examples of wiring board products, Figure 5 is an enlarged plan view of the main parts, and Pt5G diagram is the ■-■ in fjS5 diagram. A line sectional view, FIGS. 7 and 8 are enlarged plan views of main parts showing other embodiments of the wiring board, FIG. 9 and FIG.

Claims (1)

[Claims] [1] A material substrate (1) formed of a non-conductive material
), a large number of metal-plated filaments (4)... are formed in the same position and in the same shape on the front and back sides, and these metal-plated filaments (4)... are formed on the front and back sides. A through hole (2) with a metal plating layer (5) on the inner wall that communicates with the metal plating stripes (4) on both sides (4)...
A printed wiring board in which a large number of through holes are formed at predetermined intervals. [2] The printed wiring board according to claim 1 (
In A), the metal plated filaments (4) on the same part of the front and back sides of the substrate (A) are partially cut transversely (3).
A printed wiring board product in which a large number of independent linear blocks (6) including at least two through holes (2), (2) are formed. [3] A large number of metal plated wires (4) are formed on both the front and back sides of the material substrate (1) in the same position and in the same shape in the form of a mesh on the front and back, and the metal plated wires on the printed wiring board (A) The substrate (A) is obtained by partially cross-cutting the strip (4)...
A method for forming an independent filament block (6) on top, the forming layer of the metal plated filament (4) is cut by a cutting tool,
Cutter, cutting tool, computer cutting
The cut section (3
) A method for manufacturing a printed wiring board. [4] A large number of metal plated wires (4) are formed on both the front and back sides of the material substrate (1) in the same position and in the same shape in a mesh shape on the front and back sides, and the metal plated wires on the printed wiring board (A) The substrate (A) is obtained by partially cross-cutting the strip (4)...
A method of forming an independent filament block (6) on the top, wherein the cutting method of forming the cut portion (3) of the metal plated filament (4) is entirely based on a chemical action method. A method for manufacturing printed wiring boards.