JPH0312536B2 - - Google Patents

Info

Publication number
JPH0312536B2
JPH0312536B2 JP60168143A JP16814385A JPH0312536B2 JP H0312536 B2 JPH0312536 B2 JP H0312536B2 JP 60168143 A JP60168143 A JP 60168143A JP 16814385 A JP16814385 A JP 16814385A JP H0312536 B2 JPH0312536 B2 JP H0312536B2
Authority
JP
Japan
Prior art keywords
wiring board
flexible wiring
pressure
heating
inner layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60168143A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6228228A (ja
Inventor
Masanobu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ashida Manufacturing Co Ltd
Original Assignee
Ashida Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ashida Manufacturing Co Ltd filed Critical Ashida Manufacturing Co Ltd
Priority to JP60168143A priority Critical patent/JPS6228228A/ja
Publication of JPS6228228A publication Critical patent/JPS6228228A/ja
Publication of JPH0312536B2 publication Critical patent/JPH0312536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP60168143A 1985-07-30 1985-07-30 フレキシブル配線板の接着硬化方法 Granted JPS6228228A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60168143A JPS6228228A (ja) 1985-07-30 1985-07-30 フレキシブル配線板の接着硬化方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60168143A JPS6228228A (ja) 1985-07-30 1985-07-30 フレキシブル配線板の接着硬化方法

Publications (2)

Publication Number Publication Date
JPS6228228A JPS6228228A (ja) 1987-02-06
JPH0312536B2 true JPH0312536B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-20

Family

ID=15862625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60168143A Granted JPS6228228A (ja) 1985-07-30 1985-07-30 フレキシブル配線板の接着硬化方法

Country Status (1)

Country Link
JP (1) JPS6228228A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661449B2 (ja) * 1988-06-30 1994-08-17 株式会社芦田製作所 オートクレーブのガス循環方法及びその装置
KR20020042372A (ko) * 2000-11-30 2002-06-05 이상수 Fpc내의 기포 제거방법
TWI738490B (zh) * 2020-07-27 2021-09-01 劉劭祺 材料處理設備及其操作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5364286A (en) * 1976-11-22 1978-06-08 Ishikawajima Harima Heavy Ind Method and apparatus for pressing panel structure by gas

Also Published As

Publication number Publication date
JPS6228228A (ja) 1987-02-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term