JPH0312492U - - Google Patents
Info
- Publication number
- JPH0312492U JPH0312492U JP7390089U JP7390089U JPH0312492U JP H0312492 U JPH0312492 U JP H0312492U JP 7390089 U JP7390089 U JP 7390089U JP 7390089 U JP7390089 U JP 7390089U JP H0312492 U JPH0312492 U JP H0312492U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- heat dissipation
- heat
- lead wire
- metal material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 3
- 239000007769 metal material Substances 0.000 claims 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は同第１図の部分断面側面図、第３図は他の実
施例を示す斜視図、第４図は同第３図の部分断面
側面図、第５図は他の実施例を示す斜視図、第６
図は電線を用いた実施例を示す部分断面側面図、
第７図は電線を用いた他の実施例を示す部分断面
側面図、第８図は従来の電気部品（抵抗器）をプ
リント基板から十分浮かせて取付けた状態を示す
斜視図、第９図は同第８図の部分断面側面図であ
る。
１……プリント基板、２……放熱板、３……ピ
ン、４……切起し、５……透孔、６……導電箔、
７……半田付部、８……小板、９……切起し、１
０……透孔、１１……凸部、１２……溝、１３…
…電気部品、１４……電気部品のリード線、１５
……透孔、１６……ビニール被覆電線、１７……
透孔、１８……電気部品ＩＣ、１９……電気部品
ＩＣのリード線、２０……透孔、３０……プリン
ト基板、３１……電気部品（抵抗器）、３２……
電気部品（抵抗器）のリード線、３３……透孔、
３４……半田付部。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figures are a partially sectional side view of Fig. 1, Fig. 3 is a perspective view showing another embodiment, Fig. 4 is a partially sectional side view of Fig. 3, and Fig. 5 is a perspective view showing another embodiment. Figure, 6th
The figure is a partial cross-sectional side view showing an example using electric wires.
Fig. 7 is a partial cross-sectional side view showing another embodiment using electric wires, Fig. 8 is a perspective view showing a state in which a conventional electric component (resistor) is mounted sufficiently above the printed circuit board, and Fig. 9 is FIG. 8 is a partially sectional side view of FIG. 8; 1... Printed circuit board, 2... Heat sink, 3... Pin, 4... Cut-out, 5... Through hole, 6... Conductive foil,
7...Soldering part, 8...Small plate, 9...Cut up, 1
0...Through hole, 11...Protrusion, 12...Groove, 13...
...Electrical parts, 14...Lead wires of electrical parts, 15
...Through hole, 16...Vinyl coated wire, 17...
Through hole, 18... Electrical component IC, 19... Lead wire of electrical component IC, 20... Through hole, 30... Printed circuit board, 31... Electrical component (resistor), 32...
Electrical component (resistor) lead wire, 33...through hole,
34...Soldering part.
Claims (1)
周辺に導電箔を有する第１の透孔をプリント基板
に形成し、同透孔に発熱性の電気部品のリード線
を挿着し、前記第１の透孔の近傍であつて、かつ
、前記導電箔内に第２の透孔を設け、同第２の透
孔に挿入半田付固着する金属材とからなる電気部
品の放熱装置。 (2) 金属材が板または線材によりなる請求項(1)
記載の電気部品の放熱装置。[Scope of claims for utility model registration] (1) Regarding heat dissipation devices used in electronic equipment,
A first through hole having a conductive foil around the periphery is formed in the printed circuit board, a lead wire of a heat-generating electric component is inserted into the through hole, and the lead wire of a heat generating electric component is inserted into the through hole, and the first through hole is in the vicinity of the first through hole and A heat dissipation device for electrical components, comprising a second through hole provided in a conductive foil, and a metal material inserted into the second through hole and fixed by soldering. (2) Claim (1) in which the metal material is made of a plate or a wire rod.
Heat dissipation device for the electrical components described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7390089U JPH079434Y2 (en) | 1989-06-23 | 1989-06-23 | Heat dissipation device for electric parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7390089U JPH079434Y2 (en) | 1989-06-23 | 1989-06-23 | Heat dissipation device for electric parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0312492U true JPH0312492U (en) | 1991-02-07 |
| JPH079434Y2 JPH079434Y2 (en) | 1995-03-06 |
Family
ID=31613115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7390089U Expired - Fee Related JPH079434Y2 (en) | 1989-06-23 | 1989-06-23 | Heat dissipation device for electric parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079434Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002301420A (en) * | 2001-04-05 | 2002-10-15 | Ohtsuka Brush Manufacturing Co Ltd | Adjustable coating tool |
-
1989
- 1989-06-23 JP JP7390089U patent/JPH079434Y2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002301420A (en) * | 2001-04-05 | 2002-10-15 | Ohtsuka Brush Manufacturing Co Ltd | Adjustable coating tool |
| JP4618926B2 (en) * | 2001-04-05 | 2011-01-26 | 株式会社マルテー大塚 | Swivel applicator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH079434Y2 (en) | 1995-03-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |