JPH02137088U - - Google Patents
Info
- Publication number
- JPH02137088U JPH02137088U JP4310389U JP4310389U JPH02137088U JP H02137088 U JPH02137088 U JP H02137088U JP 4310389 U JP4310389 U JP 4310389U JP 4310389 U JP4310389 U JP 4310389U JP H02137088 U JPH02137088 U JP H02137088U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- circuit
- printed
- resist film
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Description
第１図ないし第５図は本考案の第１実施例を示
し、第１図は回路基板の半田面側を示す平面図、
第２図は回路基板上に回路部品を取付けた状態の
平面図、第３図は第１図中−線に沿う断面図
、第４図は電気かみそりを一部断面した側面図、
第５図は各部熱抵抗の等価回路図、第６図は本考
案の第２実施例を示す断面図、第７図および第８
図は本考案の第３実施例を示し、第７図は回路部
品の取付け状態を示す斜視図、第８図は回路部品
の取付け状態を示す平面図である。
１…ケース本体、８…回路基板、１４，１５…
回路部品（コイル、ダイオード）、１６，４１…
配線パターン、１８，１８ａ，１８ｂ…端子、２
４…レジスト被膜、２５…除去部、３１…半田。
1 to 5 show a first embodiment of the present invention, and FIG. 1 is a plan view showing the solder side of the circuit board;
Fig. 2 is a plan view of circuit components mounted on a circuit board, Fig. 3 is a sectional view taken along the line - in Fig. 1, and Fig. 4 is a partially sectional side view of the electric shaver.
Fig. 5 is an equivalent circuit diagram of the thermal resistance of each part, Fig. 6 is a sectional view showing the second embodiment of the present invention, Figs.
The figures show a third embodiment of the present invention, FIG. 7 is a perspective view showing how the circuit parts are attached, and FIG. 8 is a plan view showing the way the circuit parts are attached. 1...Case body, 8...Circuit board, 14, 15...
Circuit components (coil, diode), 16, 41...
Wiring pattern, 18, 18a, 18b...terminal, 2
4...Resist film, 25...Removed portion, 31...Solder.
Claims (1)
態で設けられる回路基板の一面に、種々の回路部
品を配置し、これら回路部品の端子を上記回路基
板の反対側の面に印刷した配線パターンに半田付
けするとともに、この配線パターンの半田付け部
を除いた部分を電気絶縁性のレジスト被膜によつ
て被覆した携帯形電気機器において、 上記レジスト被膜のうち、通電時に発熱する回
路部品に接続された配線パターンを覆う箇所を部
分的に除去し、この除去部を通じて上記配線パタ
ーンを露出させたことを特徴とする携帯形電気機
器の印刷配線板。 ２ 上記レジスト被膜の除去部を通じて露出され
る配線パターンに、半田を付着させたことを特徴
とする請求項１記載の携帯形電気機器の印刷配線
板。 ３ 合成樹脂製のケース本体の内面に近接した状
態で設けられる回路基板の一面に、種々の回路部
品を配置し、これら回路部品の端子を上記回路基
板の反対側の面に印刷した配線パターンに半田付
けするとともに、この配線パターンの半田付け部
を除いた部分を電気絶縁性のレジスト被膜によつ
て被覆した携帯形電気機器において、 上記レジスト被膜のうち、通電時に発熱する回
路部品に接続された配線パターンを覆う箇所を部
分的に除去し、この除去部を通じて上記配線パタ
ーンを露出させる一方、上記回路基板の回路部品
側の面にも配線パターンを印刷し、この配線パタ
ーンは上記発熱する単一の回路部品の一つの端子
にのみ接続され、その他の回路部品には接続され
ることなく電気的に絶縁されていることを特徴と
する携帯形電気機器の印刷配線板。[Claims for Utility Model Registration] 1. Various circuit components are arranged on one side of a circuit board provided in close proximity to the inner surface of the case body made of synthetic resin, and the terminals of these circuit components are connected to the opposite side of the circuit board. In a portable electrical device that is soldered to a wiring pattern printed on the surface of the device, and the portion of the wiring pattern other than the soldered portion is covered with an electrically insulating resist film, when the resist film is energized, 1. A printed wiring board for a portable electrical device, characterized in that a portion covering a wiring pattern connected to a heat-generating circuit component is partially removed, and the wiring pattern is exposed through the removed portion. 2. The printed wiring board for a portable electric device according to claim 1, wherein solder is attached to the wiring pattern exposed through the removed portion of the resist film. 3. Various circuit components are arranged on one side of a circuit board provided close to the inner surface of the case body made of synthetic resin, and the terminals of these circuit components are connected to a wiring pattern printed on the opposite side of the circuit board. In a portable electrical device that is soldered and the part of the wiring pattern other than the soldered part is covered with an electrically insulating resist film, the part of the resist film that is connected to a circuit component that generates heat when energized is The part covering the wiring pattern is partially removed, and the wiring pattern is exposed through this removed part, while the wiring pattern is also printed on the circuit component side of the circuit board, and this wiring pattern is used as the heat generating unit. A printed wiring board for a portable electrical device, which is electrically insulated and connected to only one terminal of a circuit component, and is electrically insulated without being connected to other circuit components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4310389U JPH02137088U (en) | 1989-04-14 | 1989-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4310389U JPH02137088U (en) | 1989-04-14 | 1989-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137088U true JPH02137088U (en) | 1990-11-15 |
Family
ID=31555234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4310389U Pending JPH02137088U (en) | 1989-04-14 | 1989-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137088U (en) |
-
1989
- 1989-04-14 JP JP4310389U patent/JPH02137088U/ja active Pending