JPH03124642U - - Google Patents
Info
- Publication number
- JPH03124642U JPH03124642U JP1990032517U JP3251790U JPH03124642U JP H03124642 U JPH03124642 U JP H03124642U JP 1990032517 U JP1990032517 U JP 1990032517U JP 3251790 U JP3251790 U JP 3251790U JP H03124642 U JPH03124642 U JP H03124642U
- Authority
- JP
- Japan
- Prior art keywords
- lead portion
- inner lead
- liquid crystal
- view
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990032517U JPH087636Y2 (ja) | 1990-03-28 | 1990-03-28 | 電子部品付きフィルムコネクタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990032517U JPH087636Y2 (ja) | 1990-03-28 | 1990-03-28 | 電子部品付きフィルムコネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03124642U true JPH03124642U (un) | 1991-12-17 |
JPH087636Y2 JPH087636Y2 (ja) | 1996-03-04 |
Family
ID=31535526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990032517U Expired - Fee Related JPH087636Y2 (ja) | 1990-03-28 | 1990-03-28 | 電子部品付きフィルムコネクタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH087636Y2 (un) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09274948A (ja) * | 1996-02-05 | 1997-10-21 | Yazaki Corp | フラットケーブルとジョイント端子との接合体 |
JP2007157393A (ja) * | 2005-12-01 | 2007-06-21 | Fujitsu Component Ltd | ケーブルコネクタ型トランシーバモジュール |
-
1990
- 1990-03-28 JP JP1990032517U patent/JPH087636Y2/ja not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09274948A (ja) * | 1996-02-05 | 1997-10-21 | Yazaki Corp | フラットケーブルとジョイント端子との接合体 |
JP2007157393A (ja) * | 2005-12-01 | 2007-06-21 | Fujitsu Component Ltd | ケーブルコネクタ型トランシーバモジュール |
JP4643423B2 (ja) * | 2005-12-01 | 2011-03-02 | 富士通コンポーネント株式会社 | ケーブルコネクタ型トランシーバモジュール |
Also Published As
Publication number | Publication date |
---|---|
JPH087636Y2 (ja) | 1996-03-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |