JPH03102740U - - Google Patents
Info
- Publication number
- JPH03102740U JPH03102740U JP1080490U JP1080490U JPH03102740U JP H03102740 U JPH03102740 U JP H03102740U JP 1080490 U JP1080490 U JP 1080490U JP 1080490 U JP1080490 U JP 1080490U JP H03102740 U JPH03102740 U JP H03102740U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- sensor element
- resin
- circuit module
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案の好適な実施例を示す断面
図である。第２図は、第１図に示すものを成形す
るための金型及び被成形電子部品の断面図である
。
１……基板、２……電子部品、３……センサ素
子、３ａ……検出部位、１０……モールドパツケ
ージ、１１……樹脂、１１ａ……孔。
FIG. 1 is a sectional view showing a preferred embodiment of this invention. FIG. 2 is a sectional view of a mold for molding what is shown in FIG. 1 and an electronic component to be molded. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Electronic component, 3... Sensor element, 3a... Detection site, 10... Mold package, 11... Resin, 11a... Hole.
Claims (1)
を樹脂によつてモールドしたモールドパツケージ
において、前記回路モジユール内のセンサ素子の
検出部位を、モールドした樹脂から露出したこと
を特徴とするセンサ素子付きモールドパツケージ
。 1. A molded package with a sensor element in which a circuit module integrating electronic components, circuits, etc. is molded with resin, characterized in that a detection part of a sensor element in the circuit module is exposed from the molded resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080490U JPH03102740U (en) | 1990-02-06 | 1990-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080490U JPH03102740U (en) | 1990-02-06 | 1990-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102740U true JPH03102740U (en) | 1991-10-25 |
Family
ID=31514358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1080490U Pending JPH03102740U (en) | 1990-02-06 | 1990-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102740U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001050838A (en) * | 1999-06-25 | 2001-02-23 | Robert Bosch Gmbh | Manufacture of pressure sensor |
-
1990
- 1990-02-06 JP JP1080490U patent/JPH03102740U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001050838A (en) * | 1999-06-25 | 2001-02-23 | Robert Bosch Gmbh | Manufacture of pressure sensor |
| JP4653285B2 (en) * | 1999-06-25 | 2011-03-16 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Method for manufacturing a pressure sensor |