JPH0330475U - - Google Patents

Info

Publication number
JPH0330475U
JPH0330475U JP9049989U JP9049989U JPH0330475U JP H0330475 U JPH0330475 U JP H0330475U JP 9049989 U JP9049989 U JP 9049989U JP 9049989 U JP9049989 U JP 9049989U JP H0330475 U JPH0330475 U JP H0330475U
Authority
JP
Japan
Prior art keywords
metal case
electronic device
coating layer
wiring board
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9049989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9049989U priority Critical patent/JPH0330475U/ja
Publication of JPH0330475U publication Critical patent/JPH0330475U/ja
Pending legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例に係るモールド型
電子機器の要部を示す拡大断面図、第2図は従来
のモールド型電子機器を示す断面図、第3図は第
2図の要部を拡大して示す断面図である。 1……金属ケース、4……配線基板、5……電
子部品、6……樹脂モールド部、9……コーテイ
ング層。
FIG. 1 is an enlarged sectional view showing the main parts of a molded electronic device according to an embodiment of the invention, FIG. 2 is a sectional view showing a conventional molded electronic device, and FIG. 3 is the main part of FIG. 2. FIG. 2 is an enlarged cross-sectional view. DESCRIPTION OF SYMBOLS 1...Metal case, 4...Wiring board, 5...Electronic component, 6...Resin mold part, 9...Coating layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品を実装した配線基板が収容された金属
ケースと、この金属ケース内に注型樹脂を充填し
て形成された樹脂モールド部とを備え、前記金属
ケースの内壁にはプライマー処理によるコーテイ
ング層が形成されて成るモールド型電子機器。
The metal case includes a metal case in which a wiring board mounted with electronic components is housed, and a resin molded part formed by filling the metal case with casting resin, and a coating layer formed by primer treatment is applied to the inner wall of the metal case. A molded electronic device made by molding.
JP9049989U 1989-07-31 1989-07-31 Pending JPH0330475U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9049989U JPH0330475U (en) 1989-07-31 1989-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9049989U JPH0330475U (en) 1989-07-31 1989-07-31

Publications (1)

Publication Number Publication Date
JPH0330475U true JPH0330475U (en) 1991-03-26

Family

ID=31640016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9049989U Pending JPH0330475U (en) 1989-07-31 1989-07-31

Country Status (1)

Country Link
JP (1) JPH0330475U (en)

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