JPS63180907U - - Google Patents

Info

Publication number
JPS63180907U
JPS63180907U JP7191587U JP7191587U JPS63180907U JP S63180907 U JPS63180907 U JP S63180907U JP 7191587 U JP7191587 U JP 7191587U JP 7191587 U JP7191587 U JP 7191587U JP S63180907 U JPS63180907 U JP S63180907U
Authority
JP
Japan
Prior art keywords
case
vertical surface
primary
primary case
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7191587U
Other languages
Japanese (ja)
Other versions
JPH0614420Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987071915U priority Critical patent/JPH0614420Y2/en
Publication of JPS63180907U publication Critical patent/JPS63180907U/ja
Application granted granted Critical
Publication of JPH0614420Y2 publication Critical patent/JPH0614420Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る電子部品の部分断面図、
第２図は本考案に係る電子部品の２次ケース成形
法を示す図、第３図は従来の電子部品の部分断面
図、第４図は同じく２次ケース成形法とその問題
点を示す図、第５図は従来の別の２次ケース成形
法を示す図、第６図は第５図の成形法によつて得
られた電子部品の部分断面図である。 １……１次ケース、２……端子、３……２次ケ
ース、１０１……凸部、１０１ａ……端面。 FIG. 1 is a partial cross-sectional view of an electronic component according to the present invention;
Figure 2 is a diagram showing the secondary case molding method for electronic components according to the present invention, Figure 3 is a partial sectional view of a conventional electronic component, and Figure 4 is a diagram showing the secondary case molding method and its problems. , FIG. 5 is a diagram showing another conventional secondary case molding method, and FIG. 6 is a partial cross-sectional view of an electronic component obtained by the molding method shown in FIG. DESCRIPTION OF SYMBOLS 1... Primary case, 2... Terminal, 3... Secondary case, 101... Convex part, 101a... End surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子回路素子を内蔵し金属薄板でなる端子を横
方向に引出した１次ケースと、前記１次ケースを
被覆する樹脂成形体でなる２次ケースとを備え、
前記１次ケースの縦方向の少なくとも一面に、端
面を前記２次ケースの縦方向の表面と略同一位置
に位置させた凸部を設けたことを特徴とする電子
部品。 comprising a primary case containing an electronic circuit element and having a terminal made of a thin metal plate pulled out laterally, and a secondary case made of a resin molded body covering the primary case,
An electronic component characterized in that a convex portion is provided on at least one vertical surface of the primary case, the end surface of which is located at approximately the same position as the vertical surface of the secondary case.
JP1987071915U 1987-05-13 1987-05-13 Electronic parts Expired - Lifetime JPH0614420Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987071915U JPH0614420Y2 (en) 1987-05-13 1987-05-13 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987071915U JPH0614420Y2 (en) 1987-05-13 1987-05-13 Electronic parts

Publications (2)

Publication Number Publication Date
JPS63180907U true JPS63180907U (en) 1988-11-22
JPH0614420Y2 JPH0614420Y2 (en) 1994-04-13

Family

ID=30914904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987071915U Expired - Lifetime JPH0614420Y2 (en) 1987-05-13 1987-05-13 Electronic parts

Country Status (1)

Country Link
JP (1) JPH0614420Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217056A (en) * 2001-01-19 2002-08-02 Shizuki Electric Co Inc Capacitor
JP2011009338A (en) * 2009-06-24 2011-01-13 Tdk Corp Resin sealed coil component, and manufacturing method of resin sealed coil component
WO2014034335A1 (en) * 2012-08-29 2014-03-06 株式会社村田製作所 Coil component and method for manufacturing same
WO2018092392A1 (en) * 2016-11-17 2018-05-24 ソニー株式会社 Electronic component, power supply device, and method for manufacturing coil

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166011A (en) * 1985-01-17 1986-07-26 Matsushita Electric Ind Co Ltd High frequency coil

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166011A (en) * 1985-01-17 1986-07-26 Matsushita Electric Ind Co Ltd High frequency coil

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217056A (en) * 2001-01-19 2002-08-02 Shizuki Electric Co Inc Capacitor
JP2011009338A (en) * 2009-06-24 2011-01-13 Tdk Corp Resin sealed coil component, and manufacturing method of resin sealed coil component
WO2014034335A1 (en) * 2012-08-29 2014-03-06 株式会社村田製作所 Coil component and method for manufacturing same
WO2018092392A1 (en) * 2016-11-17 2018-05-24 ソニー株式会社 Electronic component, power supply device, and method for manufacturing coil
JPWO2018092392A1 (en) * 2016-11-17 2019-10-10 ソニー株式会社 Electronic component, power supply device, and method of manufacturing coil
US10917971B2 (en) 2016-11-17 2021-02-09 Sony Corporation Electronic component, power supply device, and method of manufacturing coil

Also Published As

Publication number Publication date
JPH0614420Y2 (en) 1994-04-13

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