JPH0614420Y2 - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH0614420Y2 JPH0614420Y2 JP1987071915U JP7191587U JPH0614420Y2 JP H0614420 Y2 JPH0614420 Y2 JP H0614420Y2 JP 1987071915 U JP1987071915 U JP 1987071915U JP 7191587 U JP7191587 U JP 7191587U JP H0614420 Y2 JPH0614420 Y2 JP H0614420Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- primary
- primary case
- electronic component
- secondary case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Details Of Resistors (AREA)
- Insulating Of Coils (AREA)
- Coils Or Transformers For Communication (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は、金属薄板でなる端子を横方向の突出させた１
次ケースと、１次ケースの周りに射出成形によって充填
されたモールド樹脂成形体でなる２次ケースとを備える
２重パッケージ構造の電子部品に関し、１次ケースの縦
方向に凸部を設けることにより、２次ケース成形時に、
凸部を金型のキャビティ内面に当接させて１次ケース位
置決めとして使用し、１次ケースに対する２次ケースの
被覆厚みを一定化できるようにしたものである。DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention is a device in which terminals made of a thin metal plate are laterally projected.
Regarding an electronic component having a double package structure including a secondary case and a secondary case formed of a molded resin molded body filled by injection molding around the primary case, by providing a convex portion in the longitudinal direction of the primary case When molding the secondary case,
The convex portion is brought into contact with the inner surface of the cavity of the mold to be used for positioning the primary case so that the coating thickness of the secondary case with respect to the primary case can be made constant.
従来の技術 チップタイプのインダクタ、トランス或いはセラミック
フィルタ等の各種電子部品において、電子回路素子を内
蔵した１次ケースの外側を２次ケースで覆う２重パッケ
ージ構造をとることがある。第３図はこの種の電子部品
の断面図で、１は１次ケース、２は端子、３は２次ケー
スである。１次ケース１の内部には各種の電子回路素子
（図示しない）を内蔵させてあり、また、１次ケース１
の側面から横方向に、電子回路素子に導通する適当な本
数の端子２を引出してある。端子２は例えば0.1〜0.15m
m程度の金属薄板で形成されている。１次ケース１と端
子２の結合に当っては、帯状の金属薄板を打抜き加工を
施して得られたリードフレームを使用し、このリードフ
レームの所定位置に１次ケース１を成形する。これによ
り、リードフレームでなる端子２をインサート成形した
１次ケース１が得られる。2. Description of the Related Art In various electronic components such as chip type inductors, transformers, and ceramic filters, a double package structure may be used in which a secondary case covers the outside of a primary case containing an electronic circuit element. FIG. 3 is a sectional view of this type of electronic component, in which 1 is a primary case, 2 is a terminal, and 3 is a secondary case. Various electronic circuit elements (not shown) are built in the inside of the primary case 1.
An appropriate number of terminals 2 which are electrically connected to the electronic circuit element are drawn out from the side surface in the lateral direction. Terminal 2 is, for example, 0.1 to 0.15m
It is formed of a thin metal plate of about m. When connecting the primary case 1 and the terminal 2, a lead frame obtained by punching a strip-shaped thin metal plate is used, and the primary case 1 is molded at a predetermined position of the lead frame. As a result, the primary case 1 in which the terminal 2 made of a lead frame is insert-molded is obtained.
このようにして得られた１次ケース１に対し、第４図に
示すように、縦方向から金型４、５を組合せ、金型４−
５間で端子２を挟み込むと共に、金型４、５のキャビテ
ィ４１、５１内の中間位置に１次ケース１を位置させ、
注入口５２からキャビティ４１、５１内の１次ケース１
の周りに樹脂を注入して２次ケース３を射出成形する。As shown in FIG. 4, the dies 4 and 5 are combined in the vertical direction with respect to the primary case 1 thus obtained, and the dies 4-
The terminal 2 is sandwiched between 5 and the primary case 1 is positioned at an intermediate position in the cavities 41, 51 of the molds 4, 5.
Primary case 1 from the inlet 52 to the cavities 41 and 51
The secondary case 3 is injection-molded by injecting a resin around.
考案が解決しようとする問題点 ところが、２次ケース３の射出成形時に１次ケース１を
支える端子２が例えば0.1〜0.15mm程度で可撓性の高い
金属薄板で形成されているため、射出圧力等によって、
端子２が点線（イ）のように撓み、キャビティ４１、５
１内で１次ケース１が位置ズレを起こしてしまう。この
ため、１次ケース１を被覆する２次ケース３の厚みが、
所定値から外れてしまうという問題点があった。The problem to be solved by the invention is that, when the secondary case 3 is injection-molded, the terminal 2 supporting the primary case 1 is formed of a highly flexible metal thin plate of, for example, about 0.1 to 0.15 mm. By etc.
The terminal 2 bends as shown by the dotted line (a), and the cavities 41, 5
In case 1, the primary case 1 is displaced. Therefore, the thickness of the secondary case 3 covering the primary case 1 is
There was a problem that it deviated from the predetermined value.
上述の１次ケース１の位置ズレ防止手段として、従来
は、第５図に示すように、金型４（または５）の内面に
ピン４２を設けて、１次ケース１の下面（または上面）
をピン４２で支えるようにしていた。しかし、この場合
には、第６図に示すように、完成品にピン４２の抜け跡
（ロ）が残ってしまうという問題点がある。抜け跡
（ロ）ができないように、ピンコントロール機構を付加
した金型も知られているが、金型の設計、製作が複雑に
なること、成形条件が限定されること等の問題点があ
る。As means for preventing the displacement of the primary case 1 described above, conventionally, as shown in FIG. 5, a pin 42 is provided on the inner surface of the mold 4 (or 5) to provide a lower surface (or an upper surface) of the primary case 1.
Was supported by the pin 42. However, in this case, as shown in FIG. 6, there is a problem that a trace (B) of the pin 42 remains on the finished product. A mold with a pin control mechanism is also known so as not to leave a trace (B), but it has problems such as complicated design and manufacturing of the mold and limited molding conditions. .
問題点を解決するための手段 上述する従来の問題点を解決するため、本考案に係る電
子部品は、電子回路素子を内蔵し金属薄板でなる端子を
横方向に引出した１次ケースと、前記１次ケースの周り
に射出成形によって充填されたモールド樹脂成形体でな
る２次ケースとを備え、前記１次ケースの縦方向の少な
くとも一面に、端面を前記２次ケースの縦方向の表面と
略同一位置に位置させた凸部を設けたことを特徴とす
る。Means for Solving the Problems In order to solve the above-mentioned conventional problems, an electronic component according to the present invention includes a primary case in which an electronic circuit element is built in and a terminal made of a thin metal plate is drawn out in a lateral direction. A secondary case made of a molded resin molded body filled by injection molding around the primary case, wherein at least one surface in the vertical direction of the primary case and an end surface of the secondary case are substantially the same as the surface of the secondary case in the vertical direction. It is characterized in that the convex portions located at the same position are provided.
作用 １次ケースの縦方向の少なくとも一面に、端面を２次ケ
ースの表面と略同一位置に位置させた凸部を設けると、
１次ケースの外側に２次ケースを成形する際、凸部を端
面に金型の内面を当接させて、１次ケースを金型キャビ
ティ内で位置決めし、１次ケースの外側に、所定厚みを
有する２次ケースを成形できる。Action When a convex portion whose end face is located at substantially the same position as the surface of the secondary case is provided on at least one surface in the vertical direction of the primary case,
When the secondary case is molded on the outside of the primary case, the convex part is brought into contact with the inner surface of the mold so that the primary case is positioned in the mold cavity, and a predetermined thickness is provided on the outside of the primary case. It is possible to mold a secondary case having
凸部は１次ケースに設けてあって、その端面を２次ケー
スの縦方向の表面と略同一位置に位置させてあるので、
従来と異なって、ピンの抜け跡等が発生することがな
い。また、金型も特別の構造を持つ必要がないので、そ
の設計、製作が容易になる。Since the convex portion is provided on the primary case and its end face is located at substantially the same position as the vertical surface of the secondary case,
Unlike the conventional case, there is no occurrence of pin removal marks. Further, since the mold does not have to have a special structure, its design and manufacture are easy.
実施例 第１図は本考案に係る電子部品の部分断面図である。図
において、第３図と同一の参照符号は同一性ある構成部
分を示している。この実施例では、電子回路素子を内蔵
し金属薄板でなる端子２を横方向に突出させた１次ケー
ス１の縦方向の両面に、断面円形状、各形状等の適当な
形状の凸部１０１を一体的に設けてある。凸部１０１
は、端面１０１ａを、２次ケース３の縦方向における表
面３１と略同一位置に位置させてある。Embodiment 1 FIG. 1 is a partial sectional view of an electronic component according to the present invention. In the figure, the same reference numerals as those in FIG. 3 denote the same components. In this embodiment, a convex portion 101 having an appropriate shape such as a circular cross section or each shape is formed on both surfaces in the vertical direction of a primary case 1 in which a terminal 2 made of a thin metal plate and containing an electronic circuit element is laterally projected. Are provided integrally. Convex portion 101
The end surface 101a is located at substantially the same position as the surface 31 of the secondary case 3 in the vertical direction.
実施例では、１次ケース１の縦方向の両面に凸部１０１
を設けてあるが、２次ケース３の成形時に、射出圧等に
よる端子２の撓みを防ぐ方向の片面に設けるだけでよ
い。また、凸部１０１は同一面上に間隔を隔てて複数個
設けてもよい。In the embodiment, the convex portions 101 are formed on both surfaces of the primary case 1 in the vertical direction.
However, when the secondary case 3 is molded, it may be provided on only one surface in the direction in which the bending of the terminal 2 due to injection pressure or the like is prevented. In addition, a plurality of convex portions 101 may be provided on the same surface at intervals.
２次ケース３を成形に当っては、第２図に示すように、
凸部１０１の端面１０１ａに金型４、５のキャビティ内
面４１１、５１１を当接させる。これにより、１次ケー
ス１が金型キャビティ４１、５１内に位置決めされ、射
出圧等が加わっても、端子２が撓むことがないので、１
次ケース１の外側に、所定厚みを有する２次ケース３が
成形される。When molding the secondary case 3, as shown in FIG.
The cavity inner surfaces 411, 511 of the molds 4, 5 are brought into contact with the end surface 101a of the convex portion 101. As a result, the primary case 1 is positioned in the mold cavities 41 and 51, and the terminal 2 does not bend even when an injection pressure or the like is applied.
A secondary case 3 having a predetermined thickness is formed on the outer side of the next case 1.
凸部１０１は１次ケース１に設けてあって、その端面１
０１ａを２次ケース３の表面３１と略同一位置に位置さ
せてあるので、２次ケース３の表面は平坦な面となり、
従来と異なって、ピンの抜け跡等が発生することがな
い。また、金型４、５も特別の構造を持つ必要がない。The convex portion 101 is provided on the primary case 1 and its end face 1
Since 01a is located at substantially the same position as the surface 31 of the secondary case 3, the surface of the secondary case 3 is a flat surface,
Unlike the conventional case, there is no occurrence of pin removal marks. Also, the molds 4 and 5 do not need to have a special structure.
考案の効果 以上述べたように、本考案に係る電子部品は、電子回路
素子を内蔵し金属薄板でなる端子を横方向に引出した１
次ケースと、前記１次ケースの周りに射出成形によって
充填されたモールド樹脂成形体でなる２次ケースとを備
え、前記１次ケースの縦方向の少なくとも一面に、端面
を前記２次ケースの縦方向の表面と略同一位置に位置さ
せた凸部を設けたことを特徴とするから、次のような効
果が得られる。Effect of the Invention As described above, in the electronic component according to the present invention, the terminal made of a thin metal plate having the built-in electronic circuit element is drawn out in the lateral direction.
A secondary case and a secondary case made of a molded resin molded body that is filled around the primary case by injection molding are provided, and at least one surface in the longitudinal direction of the primary case has an end face in the vertical direction of the secondary case. Since the convex portion is provided at substantially the same position as the surface in the direction, the following effects can be obtained.
（ａ）所定厚みの２次ケースを有する高信頼度の２重パ
ッケージ型電子部品を提供できる。(A) It is possible to provide a highly reliable double package type electronic component having a secondary case of a predetermined thickness.
（ｂ）凸部を１次ケースに設け、その端面を２次ケース
の表面と略同一位置に位置させてあるので、ピン抜け跡
等のない２重パッケージ型電子部品を提供できる。(B) Since the convex portion is provided on the primary case and the end face thereof is located at substantially the same position as the surface of the secondary case, it is possible to provide a double package type electronic component without pin removal marks and the like.
（ｃ）成形用金型の設計、製作の容易な２重パッケージ
型電子部品を提供できる。(C) It is possible to provide a double package type electronic component that is easy to design and manufacture a molding die.
第１図は本考案に係る電子部品の部品断面図、第２図は
本考案に係る電子部品の２次ケース成形法を示す図、第
３図は従来の電子部品の部分断面図、第４図は同じく２
次ケース成形法とその問題点を示す図、第５図は従来の
別の２次ケース成形法を示す図、第６図は第５図の成形
法によって得られた電子部品の部分断面図である。 １……１次ケース、２……端子 ３……２次ケース、１０１……凸部 １０１ａ……端面FIG. 1 is a sectional view of an electronic component according to the present invention, FIG. 2 is a diagram showing a secondary case molding method for an electronic component according to the present invention, and FIG. 3 is a partial sectional view of a conventional electronic component. The figure is also 2
FIG. 5 is a diagram showing the next case molding method and its problems, FIG. 5 is a diagram showing another conventional secondary case molding method, and FIG. 6 is a partial sectional view of an electronic component obtained by the molding method of FIG. is there. 1 ... Primary case, 2 ... Terminal 3 ... Secondary case, 101 ... Convex part 101a ... End surface
フロントページの続き (56)参考文献 特開 昭61−166011（ＪＰ，Ａ) 実開 昭61−44931（ＪＰ，Ｕ) 実開 昭62−26924（ＪＰ，Ｕ)Continuation of the front page (56) References JP-A-61-166011 (JP, A) Actually opened 61-44931 (JP, U) Actually opened 62-26924 (JP, U)
Claims (1)
を横方向に引出した１次ケースと、前記１次ケースの周
りに射出成形によって充填されたモールド樹脂成形体で
なる２次ケースとを備え、前記１次ケースの縦方向の少
なくとも一面に、端面を前記２次ケースの縦方向の表面
と略同一位置に位置させた凸部を設けたことを特徴とす
る電子部品。1. A primary case in which an electronic circuit element is built in and a terminal made of a thin metal plate is laterally drawn out, and a secondary case made of a molded resin molding filled around the primary case by injection molding. An electronic component, comprising: a protrusion having an end face located at substantially the same position as a vertical surface of the secondary case, on at least one vertical surface of the primary case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071915U JPH0614420Y2 (en) | 1987-05-13 | 1987-05-13 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071915U JPH0614420Y2 (en) | 1987-05-13 | 1987-05-13 | Electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63180907U JPS63180907U (en) | 1988-11-22 |
| JPH0614420Y2 true JPH0614420Y2 (en) | 1994-04-13 |
Family
ID=30914904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987071915U Expired - Lifetime JPH0614420Y2 (en) | 1987-05-13 | 1987-05-13 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0614420Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217056A (en) * | 2001-01-19 | 2002-08-02 | Shizuki Electric Co Inc | Capacitor |
| JP5257849B2 (en) * | 2009-06-24 | 2013-08-07 | Ｔｄｋ株式会社 | Resin-sealed coil component and method for manufacturing resin-sealed coil component |
| WO2014034335A1 (en) * | 2012-08-29 | 2014-03-06 | 株式会社村田製作所 | Coil component and method for manufacturing same |
| US10917971B2 (en) | 2016-11-17 | 2021-02-09 | Sony Corporation | Electronic component, power supply device, and method of manufacturing coil |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61166011A (en) * | 1985-01-17 | 1986-07-26 | Matsushita Electric Ind Co Ltd | High frequency coil |
-
1987
- 1987-05-13 JP JP1987071915U patent/JPH0614420Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63180907U (en) | 1988-11-22 |
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