JP4086534B2 - Memory card and molding method - Google Patents

Memory card and molding method Download PDF

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Publication number
JP4086534B2
JP4086534B2 JP2002114509A JP2002114509A JP4086534B2 JP 4086534 B2 JP4086534 B2 JP 4086534B2 JP 2002114509 A JP2002114509 A JP 2002114509A JP 2002114509 A JP2002114509 A JP 2002114509A JP 4086534 B2 JP4086534 B2 JP 4086534B2
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JP
Japan
Prior art keywords
circuit board
memory card
semiconductor chip
sealed
mold plate
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Expired - Fee Related
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JP2002114509A
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Japanese (ja)
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JP2003308508A5 (en
JP2003308508A (en
Inventor
正志 ▲とく▼森
崇 鶴田
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Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2002114509A priority Critical patent/JP4086534B2/en
Publication of JP2003308508A publication Critical patent/JP2003308508A/en
Publication of JP2003308508A5 publication Critical patent/JP2003308508A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体を回路基板上に載置して、その回路基板と電気的、物理的に接続し、全体を樹脂により封止したフラッシュメモリーカード等のメモリーカードとその成形方法に関するものである。
【０００２】
【従来の技術】
従来、樹脂により封止したフラッシュメモリーカード等のメモリーカードは図６の（ａ）、（ｂ）の側断面図に示す２種類の構造があった。
【０００３】
図６の（ａ）に示すメモリーカードは半導体チップタイプと言われるもので、回路基板１の上に半導体チップ２を載置し、回路基板１と電気的、物理的に接続した後、ポッティングにより半導体チップ２を保護層３により保護し、その後、回路基板１の外部端子部分４を残して、上ケース５と下ケース６とで全体を覆っている。
【０００４】
図６の（ｂ）に示すメモリーカードは封止された半導体タイプと言われるもので、回路基板７の上に保護絶縁層によって封止された半導体チップ８を載置し、回路基板７と電気的、物理的に接続した後、回路基板７の外部端子部分９を残して、上ケース１０と下ケース１１とで全体を覆っている。
【０００５】
【発明が解決しようとする課題】
しかしながら、上記従来のメモリーカードの内、半導体チップタイプは回路基板の上に載置した半導体チップを保護層により保護するためにポッティング工程が必要でコストアップにつながり、また、封止された半導体タイプは回路基板からその上に載置した封止された半導体の上面までの寸法が大きくなり、メモリーカードの小型化が難しくなるという問題があった。
【０００６】
また、メモリーカードの構成物に上ケースと下ケースがあるため、その生産コストおよび組立コストも全体コストを押し上げる要因となっていた。
【０００７】
さらに、メモリーカードの組立構造上、上ケースと下ケースを外せば、容易に分解して内部の半導体を取り出すことができるため、半導体内のメモリーデータの安全性に問題があった。
【０００８】
本発明は上記の課題を解決するもので、封止された半導体を載置した回路基板をコンパクトに一体樹脂成形することで、ポッティング工程と上下ケースを廃止してコストダウンを図った上、サイズ的に小さなメモリーカードを得るとともに、容易に分解できない構造として、内部データの安全性を確保できるメモリーカードを提供することを目的とするものである。
【０００９】
【課題を解決するための手段】
上記の課題を解決するために、本発明は、回路基板上に保護絶縁層によって封止された半導体チップを載置して回路基板と電気的、物理的に接続し、回路基板を、封止された半導体チップを載置した部分と外部に露出する外部端子部を境として所定の角度で折曲げ、封止された半導体チップを載置した部分の上下と、外部に露出する外部端子部の上部を樹脂によって封止したメモリーカードであり、ポッティング工程と上下ケースがなく、コンパクトな構成でサイズ的に小さくコストがかからず、かつ、内部データの安全性を確保できるメモリーカードが得られる。
【００１０】
【発明の実施の形態】
本発明の請求項１に記載の発明は、回路基板上に保護絶縁層によって封止された半導体チップを載置して回路基板と電気的、物理的に接続し、回路基板を、封止された半導体チップを載置した部分と外部に露出する外部端子部分を境として所定の角度で折曲げ、封止された半導体チップを載置した部分の上下部と、外部に露出する外部端子部分の上部を樹脂によって封止したメモリーカードであり、回路基板を、封止された半導体チップを載置した部分と外部に露出する外部端子部分を境として所定の角度で折曲げることにより、その後の樹脂封止による樹脂厚に占める封止された半導体チップを載置した回路基板の厚さの比率を小さくするという作用を有する。
【００１１】
本発明の請求項２に記載の発明は、保護絶縁層によって封止された半導体チップを回路基板に載置して電気的、物理的に接続した後、１次成形工程として、１次成形用金型の固定側型板と可動側型板とで回路基板を挟み、固定側型板の凸状部によって、固定側型板と可動側型板の間のキャビティ内で回路基板の先端を、封止された半導体チップを載置した部分と外部に露出する外部端子部分を境として所定の角度で折曲げて、キャビティ内に溶融樹脂を流し込み、回路基板が折曲した１次成形品を成形し、２次成形工程として、前記１次成形品を２次成形用金型の固定側型板と可動側型板の間のキャビティ内にセットして、１次成形工程では流し込めなかった回路基板に樹脂を流し込み２次成形品を成形するメモリーカードの成形方法であり、１次成形工程により、所定の角度で折曲げた回路基板を樹脂成形で固定し、２次成形工程により、１次成形工程では流し込めなかった回路基板に樹脂を流し込み、回路基板の全周を樹脂成形するという作用を有する。
【００１２】
以下、本発明の実施の形態について図面を参照しながら説明する。
【００１３】
（実施の形態）
図１は本発明の実施の形態におけるメモリーカードの側断面図、図２の（ａ）は同メモリーカードの製造工程における１次成形時のメモリーカードと金型の中央部分の側断面図、図２の（ｂ）は同メモリーカードの製造工程における１次成形時のメモリーカードと金型のサイド部分の側断面図、図３は同メモリーカードの１次成形時の斜視図、図４は同メモリーカードの製造工程における２次成形時のメモリーカードと金型の中央部分の側断面図、図５は同メモリーカードの２次成形時の斜視図である。
【００１４】
まず、図１に示すメモリーカードは、回路基板１２上に保護絶縁層によって封止された半導体チップ１３が載置され、回路基板１２と電気的、物理的に接続し、回路基板１２を、封止された半導体チップ１３を載置した部分１４と外部に露出する外部端子部分１５を境として所定の角度で折曲げた状態で、封止された半導体チップ１３を載置した部分１４の上下部と、外部に露出する外部端子部分１５の上部を樹脂１６によって封止している。
【００１５】
上記図１に示すメモリーカードの製造工程は、まず、１次成形工程として、図２の（ａ）に示す１次成形時のメモリーカードと金型の中央部分の側断面図および図２の（ｂ）に示す１次成形時のメモリーカードと金型のサイド部分の側断面図に示すように、回路基板１２上に保護絶縁層によって封止された半導体チップ１３を載置し、回路基板１２と電気的、物理的に接続した後、金型の型締め工程時に１次成形用金型の固定側型板１７と可動側型板１８とで封止された半導体チップ１３を載置した回路基板１２の中央部分を挟み、固定側型板１７の凸状部１９によって、固定側型板１７と可動側型板１８の間のキャビティ２０内で回路基板１２の先端を、封止された半導体チップ１３を載置した部分１４と外部に露出する外部端子部分１５を境として所定の角度で折曲げ、回路基板１２から封止された半導体チップ１３の上面までの寸法が最終のメモリーカードの厚さ内に収まるように固定した後、金型のゲート２１から溶融した樹脂をキャビティ２０に流し込むのであるが、封止された半導体チップ１３を載置した回路基板１２の中央部分は金型の固定側型板１７と可動側型板１８とで挟まれているため、中央部分には樹脂は流れ込まず、金型で挟まれていない回路基板１２の両サイド部分および上辺には樹脂が流れ込み、回路基板１２の両サイド部分の外形を樹脂２２、２３で、上辺の外形を樹脂２４で形作ることになる。
【００１６】
上記図２に示す１次成形で成形された１次成形品は図３の斜視図に示すように、封止された半導体チップ１３を載置した回路基板１２の中央部分には樹脂が流れ込まず、封止された半導体チップ１３が露出した状態であり、回路基板１２の両サイド部分にはその外形を形作る樹脂２２、２３が形成され、回路基板１２の上辺にはその外形を形作る樹脂２４が形成されている。
【００１７】
次に、上記１次成形工程で成形され、回路基板１２がその外形を形作る両サイド部分の樹脂２２、２３および上辺の樹脂２４によって折曲げられた状態で固定され、回路基板１２の中央部分には樹脂がない図３の１次成形品を、図４の２次成形時のメモリーカードと金型の中央部分の側断面図に示すように、２次成形用金型の固定側型板２５と可動側型板２６との間のキャビティ２７内に、前記図３の１次成形品の両サイド部分の樹脂２２、２３がキャビティ２７と同じ形状で接するように位置決めすることにより、回路基板１２上の封止された半導体チップ１３と２次成形用金型の固定側型板２５との距離、および回路基板１２と２次成形用金型の可動側型板２６との距離が所定の値になり、その状態で金型のゲート２８から溶融した樹脂をキャビティ２７に流し込み、１次成形時には樹脂が流れ込まず露出していた回路基板１２の中央部分を樹脂２９で封止し、図５のメモリーカードの２次成形時の斜視図に示すように、封止された半導体チップ１３を載置した回路基板１２は、その両サイド部分が樹脂２２、２３によって、上辺が樹脂２４によって外形が形作られ、中央部分が樹脂２９によって前記両サイド部分および上辺の上面と面一に封止されて最終のメモリーカードが得られる。
【００１８】
尚、上記ゲート２１、２８はサイドゲート方式の金型構造に限らず、ピンポイントゲート、トンネルゲート方式でもよいことは申すまでもない。
【００１９】
以上のように、本実施の形態におけるメモリーカードは、１次成形において、金型内で、回路基板１２が、封止された半導体チップ１３を載置した部分１４と外部に露出する外部端子部分１５を境として所定の角度で折曲げられ、回路基板１２から封止された半導体チップ１３の上面までの寸法が最終のメモリーカードの厚さ内に収まるように固定されているので、回路基板１２の上下を封止する樹脂１６の厚みを大きくしなくても、充分に封止可能となり、薄型のメモリーカードを得ることができ、また、回路基板１２と封止された半導体チップ１３とが外部に露出する外部端子部分１５を残して樹脂１６により封止され一体成形されているので、回路基板１２と封止された半導体チップ１３とを容易には分解することができず、メモリーカード内のデータの安全性が飛躍的に高まるものであり、さらに、封止された半導体チップ１３を用いることにより、従来のポッティング工程が不要となり、上下のケースも不要となるため、製品のコストダウンが図れるものである。
【００２０】
【発明の効果】
以上のように、本発明のメモリーカードによれば、封止された半導体を載置した回路基板をコンパクトに一体樹脂成形することで、ポッティング工程と上下ケースを廃止しコストダウンができ、サイズ的に小さなメモリーカードが得られるとともに、容易に分解できない構造として、内部データの安全性を確保できるという効果が得られる。
【図面の簡単な説明】
【図１】本発明の実施の形態におけるメモリーカードの側断面図
【図２】（ａ）同メモリーカードの製造工程における１次成形時のメモリーカードと金型の中央部分の側断面図
（ｂ）同メモリーカードの製造工程における１次成形時のメモリーカードと金型のサイド部分の側断面図
【図３】同メモリーカードの１次成形時の斜視図
【図４】同メモリーカードの製造工程における２次成形時のメモリーカードと金型の中央部分の側断面図
【図５】同メモリーカードの２次成形時の斜視図
【図６】（ａ）従来のメモリーカードの側断面図
（ｂ）上記（ａ）と違う従来のメモリーカードの側断面図
【符号の説明】
１，７，１２ 回路基板
２ 半導体チップ
３ 保護層
４，９，１５ 外部端子部分
５，１０ 上ケース
６，１１ 下ケース
８，１３ 封止された半導体チップ
１４ 封止された半導体チップ１３を載置した部分
１６，２２，２３，２４，２９ 樹脂
１７，２５ 固定側型板
１８，２６ 可動側型板
１９ 凸状部
２０，２７ キャビティ
２１，２８ ゲート[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a memory card such as a flash memory card in which a semiconductor is placed on a circuit board, electrically and physically connected to the circuit board, and is entirely sealed with a resin, and a molding method thereof. .
[0002]
[Prior art]
Conventionally, a memory card such as a flash memory card sealed with a resin has two types of structures shown in the side sectional views of FIGS.
[0003]
The memory card shown in FIG. 6 (a) is called a semiconductor chip type. The semiconductor card 2 is placed on the circuit board 1, electrically and physically connected to the circuit board 1, and then potted. The semiconductor chip 2 is protected by the protective layer 3, and then the upper case 5 and the lower case 6 cover the whole, leaving the external terminal portion 4 of the circuit board 1.
[0004]
The memory card shown in FIG. 6B is said to be a sealed semiconductor type. A semiconductor chip 8 sealed with a protective insulating layer is placed on the circuit board 7, and the circuit board 7 is electrically connected. After the physical and physical connection, the upper case 10 and the lower case 11 cover the whole, leaving the external terminal portion 9 of the circuit board 7.
[0005]
[Problems to be solved by the invention]
However, among the above conventional memory cards, the semiconductor chip type requires a potting process to protect the semiconductor chip placed on the circuit board with a protective layer, leading to an increase in cost, and the sealed semiconductor type. However, there is a problem that the size from the circuit board to the upper surface of the sealed semiconductor placed on the circuit board becomes large, and it is difficult to reduce the size of the memory card.
[0006]
In addition, since the memory card components include an upper case and a lower case, the production cost and assembly cost have also increased the overall cost.
[0007]
Furthermore, because of the assembly structure of the memory card, if the upper case and the lower case are removed, the internal semiconductor can be easily taken out and the internal semiconductor can be taken out.
[0008]
The present invention solves the above problems, and by compactly molding the circuit board on which the sealed semiconductor is placed, the potting process and the upper and lower cases are eliminated, and the cost is reduced. An object of the present invention is to provide a memory card that can obtain a small memory card and can ensure the safety of internal data as a structure that cannot be easily disassembled.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, the present invention places a semiconductor chip sealed with a protective insulating layer on a circuit board and electrically and physically connects to the circuit board. Bending at a predetermined angle between the part where the semiconductor chip is placed and the external terminal part exposed to the outside as a boundary, the top and bottom of the part where the sealed semiconductor chip is placed, and the external terminal part exposed to the outside It is a memory card whose upper part is sealed with a resin. There is no potting process and upper and lower cases, a memory card that has a compact configuration, is small in size and does not cost much, and can ensure the safety of internal data.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, a semiconductor chip sealed with a protective insulating layer is placed on a circuit board and electrically and physically connected to the circuit board, and the circuit board is sealed. The upper and lower portions of the part on which the sealed semiconductor chip is placed and the external terminal part exposed to the outside are bent at a predetermined angle with the part on which the semiconductor chip is placed and the external terminal part exposed to the outside as a boundary. A memory card whose upper part is sealed with resin, and the circuit board is bent at a predetermined angle with a part where the sealed semiconductor chip is placed and an external terminal part exposed to the outside as a boundary. This has the effect of reducing the ratio of the thickness of the circuit board on which the sealed semiconductor chip occupies the resin thickness due to sealing.
[0011]
According to the second aspect of the present invention, the semiconductor chip sealed by the protective insulating layer is placed on the circuit board and electrically and physically connected, and then the primary molding step is performed. The circuit board is sandwiched between the fixed side mold plate and the movable side mold plate of the mold, and the convex part of the fixed side mold plate seals the tip of the circuit board in the cavity between the fixed side mold plate and the movable side mold plate. Bending at a predetermined angle with the portion where the semiconductor chip is placed and the external terminal portion exposed to the outside as a boundary, pouring molten resin into the cavity, and forming a primary molded product in which the circuit board is bent, As a secondary molding process, the primary molded product is set in a cavity between a fixed mold plate and a movable mold plate of a secondary mold, and resin is applied to a circuit board that cannot be poured in the primary molding process. It is a method of molding a memory card to mold a cast secondary molded product In the primary molding process, the circuit board bent at a predetermined angle is fixed by resin molding, and in the secondary molding process, the resin is poured into the circuit board that could not be poured in the primary molding process. Has the effect of resin molding.
[0012]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0013]
(Embodiment)
FIG. 1 is a side sectional view of a memory card according to an embodiment of the present invention. FIG. 2A is a side sectional view of a central portion of a memory card and a mold during primary molding in the manufacturing process of the memory card. 2 (b) is a side cross-sectional view of the memory card and the side portion of the mold during the primary molding in the manufacturing process of the memory card, FIG. 3 is a perspective view during the primary molding of the memory card, and FIG. FIG. 5 is a perspective view of the memory card at the time of secondary molding, and FIG. 5 is a perspective view at the time of secondary molding of the memory card.
[0014]
First, in the memory card shown in FIG. 1, a semiconductor chip 13 sealed with a protective insulating layer is placed on a circuit board 12, electrically and physically connected to the circuit board 12, and the circuit board 12 is sealed. Upper and lower portions of the portion 14 on which the sealed semiconductor chip 13 is placed in a state of being bent at a predetermined angle with the portion 14 on which the stopped semiconductor chip 13 is placed and the external terminal portion 15 exposed to the outside as a boundary. The upper portion of the external terminal portion 15 exposed to the outside is sealed with a resin 16.
[0015]
The memory card manufacturing process shown in FIG. 1 includes, as a primary molding process, a side sectional view of a central portion of the memory card and the mold shown in FIG. As shown in the side sectional view of the side portion of the memory card and the mold at the time of the primary molding shown in b), the semiconductor chip 13 sealed with a protective insulating layer is placed on the circuit board 12, and the circuit board 12 A circuit in which a semiconductor chip 13 sealed with a fixed mold plate 17 and a movable mold plate 18 of a primary mold is placed in a mold clamping process after being electrically and physically connected to each other. A semiconductor in which the front end of the circuit board 12 is sealed in the cavity 20 between the fixed side mold plate 17 and the movable side mold plate 18 by the convex portion 19 of the fixed side mold plate 17 with the central portion of the substrate 12 interposed therebetween. A portion 14 on which the chip 13 is placed and an external terminal portion 15 exposed to the outside Bending at a predetermined angle as a boundary, fixing the dimension from the circuit board 12 to the top surface of the sealed semiconductor chip 13 within the thickness of the final memory card, and then melting from the gate 21 of the mold The resin is poured into the cavity 20, but the central portion of the circuit board 12 on which the sealed semiconductor chip 13 is placed is sandwiched between the fixed mold plate 17 and the movable mold plate 18. The resin does not flow into the central portion, the resin flows into both side portions and the upper side of the circuit board 12 that are not sandwiched between the molds, and the outer shapes of the both side portions of the circuit board 12 are the outer shapes of the upper side with the resins 22 and 23. Is formed from the resin 24.
[0016]
As shown in the perspective view of FIG. 3, in the primary molded product formed by the primary molding shown in FIG. 2, the resin does not flow into the central portion of the circuit board 12 on which the sealed semiconductor chip 13 is placed. The sealed semiconductor chip 13 is exposed. Resins 22 and 23 forming the outer shape are formed on both side portions of the circuit board 12, and the resin 24 forming the outer shape is formed on the upper side of the circuit board 12. Is formed.
[0017]
Next, the circuit board 12 is molded in the primary molding step and fixed in a state where the circuit board 12 is bent by the resins 22 and 23 on both side portions and the resin 24 on the upper side forming the outer shape. 3 shows the primary molded product of FIG. 3 having no resin, as shown in the side sectional view of the center portion of the memory card and the mold in the secondary molding of FIG. 3 is positioned so that the resins 22 and 23 on both side portions of the primary molded product in FIG. 3 are in contact with each other in the same shape as the cavity 27. The distance between the semiconductor chip 13 sealed above and the fixed side mold plate 25 of the secondary molding die, and the distance between the circuit board 12 and the movable side mold plate 26 of the secondary molding die are predetermined values. In this state, the molten resin from the mold gate 28 The resin is not poured into the cavity 27 and the central portion of the circuit board 12 exposed without being poured during the primary molding is sealed with the resin 29, and as shown in the perspective view during the secondary molding of the memory card in FIG. The circuit board 12 on which the stopped semiconductor chip 13 is mounted has an outer shape formed on both sides thereof by the resins 22 and 23, an upper side is formed by the resin 24, and a central portion is formed by the resin 29 on the upper surfaces of the both side portions and the upper side. And the final memory card is obtained.
[0018]
Needless to say, the gates 21 and 28 are not limited to the side gate type mold structure, but may be a pinpoint gate type or a tunnel gate type.
[0019]
As described above, in the memory card according to the present embodiment, in the primary molding, in the mold, the circuit board 12 has the portion 14 on which the sealed semiconductor chip 13 is placed and the external terminal portion exposed to the outside. Since the dimension from the circuit board 12 to the upper surface of the sealed semiconductor chip 13 is fixed within the thickness of the final memory card, the circuit board 12 is bent. Even if the thickness of the resin 16 that seals the upper and lower sides of the substrate is not increased, it can be sufficiently sealed, and a thin memory card can be obtained. Also, the circuit board 12 and the sealed semiconductor chip 13 are connected to the outside. Therefore, the circuit board 12 and the sealed semiconductor chip 13 cannot be easily disassembled because the external terminal portion 15 exposed to the resin is sealed and molded integrally with the resin 16. The safety of the data in the card is drastically increased. Furthermore, the use of the sealed semiconductor chip 13 eliminates the need for a conventional potting process and eliminates the need for upper and lower cases. Cost can be reduced.
[0020]
【The invention's effect】
As described above, according to the memory card of the present invention, by compactly molding the circuit board on which the sealed semiconductor is placed, the potting process and the upper and lower cases can be eliminated, and the cost can be reduced. In addition, a small memory card can be obtained and a structure that cannot be easily disassembled can ensure the safety of internal data.
[Brief description of the drawings]
FIG. 1 is a side sectional view of a memory card according to an embodiment of the present invention. FIG. 2 (a) is a side sectional view of a central portion of a memory card and a mold at the time of primary molding in the manufacturing process of the memory card. ) Side cross-sectional view of the memory card and the side part of the mold during the primary molding in the memory card manufacturing process [FIG. 3] Perspective view during the primary molding of the memory card [FIG. 4] Manufacturing process of the memory card FIG. 5 is a side sectional view of the memory card and the central part of the mold in the secondary molding in FIG. 5. FIG. 6 is a perspective view of the memory card in the secondary molding. ) Side sectional view of a conventional memory card different from the above (a) [Explanation of symbols]
1, 7, 12 Circuit board 2 Semiconductor chip 3 Protective layers 4, 9, 15 External terminal portions 5, 10 Upper case 6, 11 Lower case 8, 13 Sealed semiconductor chip 14 Mounted semiconductor chip 13 Placed portions 16, 22, 23, 24, 29 Resin 17, 25 Fixed side template 18, 26 Movable side plate 19 Convex portion 20, 27 Cavity 21, 28 Gate

Claims (2)

回路基板上に保護絶縁層によって封止された半導体チップを載置して回路基板と電気的、物理的に接続し、回路基板を、封止された半導体チップを載置した部分と外部に露出する外部端子部分を境として所定の角度で折曲げ、封止された半導体チップを載置した部分の上下部と、外部に露出する外部端子部分の上部を樹脂によって封止したメモリーカード。 A semiconductor chip sealed with a protective insulating layer is placed on the circuit board and electrically and physically connected to the circuit board, and the circuit board is exposed to the part where the sealed semiconductor chip is placed and to the outside. A memory card in which the upper and lower portions of the portion where the sealed semiconductor chip is placed and the upper portion of the external terminal portion exposed to the outside are sealed with resin. 保護絶縁層によって封止された半導体チップを回路基板に載置して電気的、物理的に接続した後、１次成形工程として、１次成形用金型の固定側型板と可動側型板とで回路基板を挟み、固定側型板の凸状部によって、固定側型板と可動側型板の間のキャビティ内で回路基板の先端を、封止された半導体チップを載置した部分と外部に露出する外部端子部分を境として所定の角度で折曲げて、キャビティ内に溶融樹脂を流し込み、回路基板が折曲した１次成形品を成形し、２次成形工程として、前記１次成形品を２次成形用金型の固定側型板と可動側型板の間のキャビティ内にセットして、１次成形工程では流し込めなかった回路基板に樹脂を流し込み２次成形品を成形するメモリーカードの成形方法。After a semiconductor chip sealed with a protective insulating layer is placed on a circuit board and electrically and physically connected, as a primary molding step, a fixed mold plate and a movable mold plate of a primary mold Between the fixed side mold plate and the movable side mold plate by the convex portion of the fixed side mold plate, the tip of the circuit board is placed outside the part where the sealed semiconductor chip is placed Bending at a predetermined angle with the exposed external terminal portion as a boundary, pouring molten resin into the cavity, forming a primary molded product in which the circuit board is bent, and forming the primary molded product as a secondary molding step. Molding a memory card that is set in a cavity between a fixed mold plate and a movable mold plate of a mold for secondary molding, and a resin is poured into a circuit board that cannot be poured in the primary molding process to mold a secondary molded product. Method.
JP2002114509A 2002-04-17 2002-04-17 Memory card and molding method Expired - Fee Related JP4086534B2 (en)

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JP2008084263A (en) * 2006-09-29 2008-04-10 Renesas Technology Corp Memory card and its manufacturing method
JP4945682B2 (en) 2010-02-15 2012-06-06 株式会社東芝 Semiconductor memory device and manufacturing method thereof

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