JPS6433749U - - Google Patents
Info
- Publication number
- JPS6433749U JPS6433749U JP12777087U JP12777087U JPS6433749U JP S6433749 U JPS6433749 U JP S6433749U JP 12777087 U JP12777087 U JP 12777087U JP 12777087 U JP12777087 U JP 12777087U JP S6433749 U JPS6433749 U JP S6433749U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- side wall
- element body
- electronic component
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に係る樹脂モールド型電子部品
の一実施例を示す要部側面図、第２図と第３図と
第４図は第１図の電子部品の機能説明図、第５図
は従来の樹脂モールド型電子部品の一具体例を示
す側面図、第６図と第７図は第５図のリード成形
動作を示す各側面図である。
８……電子部品、９……樹脂外装部、９ａ……
側壁、９ｂ……樹脂、１０……リード。
FIG. 1 is a side view of essential parts showing an embodiment of the resin molded electronic component according to the present invention, FIGS. 2, 3, and 4 are functional explanatory diagrams of the electronic component shown in FIG. 1, and FIG. 5 6 is a side view showing a specific example of a conventional resin molded electronic component, and FIGS. 6 and 7 are side views showing the lead forming operation of FIG. 5. 8...Electronic component, 9...Resin exterior part, 9a...
Side wall, 9b...resin, 10...lead.
Claims (1)
したリードを樹脂外装部側壁より導出しリード中
間部を樹脂外装部側壁と平行配置した部品におい
て、 上記リードの折り曲げ肩部内面に樹脂を突設し
たことを特徴とする樹脂モールド型電子部品。[Scope of Claim for Utility Model Registration] In a component in which the element body is sheathed with resin, the leads connected to the element body are led out from the side wall of the resin sheathing part, and the middle part of the lead is arranged parallel to the side wall of the resin sheathing part, A resin molded electronic component characterized by a resin protrusion on the inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12777087U JPS6433749U (en) | 1987-08-21 | 1987-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12777087U JPS6433749U (en) | 1987-08-21 | 1987-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433749U true JPS6433749U (en) | 1989-03-02 |
Family
ID=31380495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12777087U Pending JPS6433749U (en) | 1987-08-21 | 1987-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433749U (en) |
-
1987
- 1987-08-21 JP JP12777087U patent/JPS6433749U/ja active Pending