JPS6373993U - - Google Patents
Info
- Publication number
- JPS6373993U JPS6373993U JP16854486U JP16854486U JPS6373993U JP S6373993 U JPS6373993 U JP S6373993U JP 16854486 U JP16854486 U JP 16854486U JP 16854486 U JP16854486 U JP 16854486U JP S6373993 U JPS6373993 U JP S6373993U
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- molded product
- utility
- model registration
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000012779 reinforcing material Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は、本考案のシールド成形品の導通部の
構成の一例を示す断面図である。第２図は、本考
案のシールド成形品の導通部の別の態様を示す断
面図である。
１……シールド成形品の導通部、２……基材、
３……導電層、４……金属メツキ層、５……樹脂
層、６……金属片、７……ネジ、８……導通孔、
９……補強材、１０……プリント基板。
FIG. 1 is a sectional view showing an example of the configuration of a conductive portion of a shield molded product of the present invention. FIG. 2 is a sectional view showing another embodiment of the conductive portion of the shield molded product of the present invention. 1... Conductive part of shield molded product, 2... Base material,
3... Conductive layer, 4... Metal plating layer, 5... Resin layer, 6... Metal piece, 7... Screw, 8... Conductive hole,
9... Reinforcement material, 10... Printed circuit board.
Claims (1)
出成形により樹脂層５と一体化してなるシールド
成形品において、樹脂層５に導通孔８を設け、プ
リント基板１０に固定した金属片６を、導通孔８
の底部に露出している導電層３に押しあて導通を
確保してなるシールド成形品の導通部１。 (2) 導通孔８の底部に露出している導電層３の
上に金属メツキ層４を設けた実用新案登録請求の
範囲第１項記載のシールド成形品の導通部１。 (3) 基材２の少なくとも導通孔８に対応する部
分に補強材９を固定した実用新案登録請求の範囲
第１項に記載のシールド成形品の導通部１。 (4) 金属片６がプリント基板１０のＧＮＤライ
ンに接続されたものである実用新案登録請求の範
囲第１項ないし第３項のいずれかに記載のシール
ド成形品の導通部１。[Claims for Utility Model Registration] (1) In a shield molded product in which a base material 2 and a conductive layer 3 provided thereon are integrated with a resin layer 5 by injection molding, a conductive hole 8 is provided in the resin layer 5, The metal piece 6 fixed to the printed circuit board 10 is inserted into the conduction hole 8
A conductive part 1 of a shield molded product is pressed against a conductive layer 3 exposed at the bottom of the shield to ensure conduction. (2) The conductive part 1 of the shield molded product according to claim 1 of the utility model registration claim, in which a metal plating layer 4 is provided on the conductive layer 3 exposed at the bottom of the conductive hole 8. (3) The conductive portion 1 of the shield molded product according to claim 1 of the utility model registration claim, in which a reinforcing material 9 is fixed to at least a portion of the base material 2 corresponding to the conductive hole 8. (4) The conductive portion 1 of the shield molded product according to any one of claims 1 to 3 of the utility model registration claim, wherein the metal piece 6 is connected to the GND line of the printed circuit board 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16854486U JPS6373993U (en) | 1986-11-01 | 1986-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16854486U JPS6373993U (en) | 1986-11-01 | 1986-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6373993U true JPS6373993U (en) | 1988-05-17 |
Family
ID=31101516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16854486U Pending JPS6373993U (en) | 1986-11-01 | 1986-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373993U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11502974A (en) * | 1995-12-21 | 1999-03-09 | シーメンス マツシタ コンポーネンツ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ウント コンパニ コマンデイート ゲゼルシヤフト | Electronic components, in particular, components operated by surface acoustic waves-SAW components and method of manufacturing the same |
-
1986
- 1986-11-01 JP JP16854486U patent/JPS6373993U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11502974A (en) * | 1995-12-21 | 1999-03-09 | シーメンス マツシタ コンポーネンツ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ウント コンパニ コマンデイート ゲゼルシヤフト | Electronic components, in particular, components operated by surface acoustic waves-SAW components and method of manufacturing the same |